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Active ester compound, resin composition, and prepreg, insulating film, metal foil-clad laminate, and printed circuit board having same

A resin composition and compound technology, applied in the preparation of organic compounds, synthetic resin layered products, metal layered products, etc., to achieve low dielectric loss value, reduce dielectric constant and dielectric loss, solve roughness and toughness problem effect

Inactive Publication Date: 2020-12-15
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when preparing high-performance substrates for high-frequency and high-speed applications, bismaleimide resins, benzoxazine resins, or phosphorus-containing flame retardants are added to the resin composition in order to improve heat resistance, thermal expansion coefficient, or flame retardancy. and other components, so the dielectric constant of the final substrate material still fails to meet the requirements of high-frequency and high-speed substrates

Method used

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  • Active ester compound, resin composition, and prepreg, insulating film, metal foil-clad laminate, and printed circuit board having same
  • Active ester compound, resin composition, and prepreg, insulating film, metal foil-clad laminate, and printed circuit board having same
  • Active ester compound, resin composition, and prepreg, insulating film, metal foil-clad laminate, and printed circuit board having same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0081] Take the preparation of dicyclopentadiene active ester as an example below, and its reaction mechanism is as follows:

[0082]

[0083] Or, the active ester compound shown in structural formula (1) among the present invention can also adopt following preparation method:

[0084] First react the aromatic phenol resin and aromatic dicarboxylic acid, then add p-vinylphenol to continue the reaction to obtain the active ester compound. Take the preparation of dicyclopentadiene active ester as an example below. The reaction mechanism is as follows Show:

[0085] first step:

[0086]

[0087] Step two:

[0088]

[0089] Or first react the aromatic phenol resin and aromatic diacid chloride, then add p-vinylphenol to continue the reaction to obtain the active ester compound, the following is an example of the preparation of dicyclopentadiene active ester, the reaction mechanism is as follows Shown:

[0090] first step:

[0091]

[0092] Step two:

[0093]

...

Synthetic example 1

[0153] Synthesis Example 1: Synthesis of Dicyclopentadienyl Active Ester Compound

[0154] Take dicyclopentadienol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly, at the temperature of 60°C, feed nitrogen at the same time, add tetrabutylammonium bromide catalyst, and then slowly drop in the concentration of 20% aqueous sodium hydroxide solution, reacted for 4 hours, then added p-vinylphenol, continued the reaction for 1 hour, after the reaction was completed and washed several times, dried under vacuum conditions at 80°C for 3 hours to obtain the dicyclopentadiene Alkenyl active ester compound, denoted as active ester A.

Synthetic example 2

[0155] Synthesis Example 2: Synthesis of Tricyclopentadienyl Active Ester Compound

[0156] Take tricyclopentadienol resin and benzenedicarboxylic acid, stir and dissolve in toluene solvent evenly. 20% sodium hydroxide aqueous solution, reacted for 4 hours, then added p-vinylphenol, continued to react for 1 hour, after the reaction was completed and washed several times, dried under vacuum conditions at 80°C for 3 hours to obtain the tricyclic Pentadienyl active ester compound, denoted as active ester B.

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Abstract

The invention provides an active ester compound, a resin composition, and a prepreg, an insulating film, a metal foil-clad laminate and a printed circuit board having the same. The active ester compound is an active ester compound containing two reaction groups, hydroxyl with strong polarity is not generated when the active ester group reacts with epoxy resin, so that a low dielectric constant andlow dielectric loss are obtained after reaction, and meanwhile, a free radical polymerization reaction is carried out on a carbon-carbon double bond at the tail end and a maleimide group, the dielectric constant and dielectric loss of a cured product are further reduced, the toughness of maleimide resin is well improved, and the crosslinking density of the cured product is improved through the reaction of active ester and epoxy resin and the reaction of maleimide and vinyl; finally, a cured product which simultaneously meets the requirements of high heat resistance, high modulus, low dielectric constant, low dielectric loss, low CTE and low warpage is obtained.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to an active ester compound with low dielectric constant and low dielectric loss, a resin composition and a prepreg, an insulating film, a metal foil-clad laminate, and a printed circuit board . Background technique [0002] The automotive market, smart phones and other consumer electronics markets, with the upgrading of technology, have put forward new requirements for PCBs, and after the 5G commercial launch in 2018, the requirements for the dielectric properties of PCB substrates have been raised to a higher level. , High-frequency and high-speed copper-clad laminates are one of the indispensable electronic substrates in the 5G era. Simply put, the PCB substrate material needs to have a lower dielectric constant and dielectric loss tangent to reduce signal delay, distortion and loss during high-speed transmission, as well as interference between signals. Therefore, ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C69/80C07C67/08C08G59/42B32B7/12B32B15/09B32B15/20B32B27/06B32B27/36B32B33/00H05K1/03
CPCB32B7/12B32B15/09B32B15/20B32B27/06B32B27/36B32B33/00B32B2255/26B32B2307/206B32B2457/08C07C69/80C08G59/4223C07C2603/68H05K1/0373B32B15/08B32B27/00C07C67/08C08G59/40C08G59/42C08L63/00H05K1/03
Inventor 崔春梅戴善凯陈诚何继亮杨宋
Owner SHENGYI TECH SUZHOU
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