Method for conducting magnetron sputtering on surface of Al2O3 ceramic matrix to coat Al2O3 ceramic matrix with nanometer copper film

A magnetron sputtering plating and ceramic substrate technology, applied in the field of metal surface coating, can solve the problems of low purity, strict pretreatment requirements, poor film uniformity, etc., achieve high conductivity and improve the bonding force between coatings

Inactive Publication Date: 2021-02-26
东莞市烽元科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Aiming at the shortcomings of poor uniformity, low purity and weak adhesion of the films coated on the current particles, according to the characteristics of the particles themselves, a new method that can deposit metal copper films with different thicknesses on the surface of the particles is proposed, which can significantly improve the surface film thickness of the particles. Uniformity, purity, compactness and adhesion
The Chinese patent with the application number 200510029905.2 discloses a method for electroless copper plating on the surface of SiC ceramic particles. Aiming at the current problems of expensive activators, strict pretreatment requirements and difficult operation, uneven coating and failure to coat copper, a method is proposed. A method for electroless copper plating, simple and easy, low in price, and the copper coating on the surface of the prepared ceramic particles is evenly coated

Method used

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  • Method for conducting magnetron sputtering on surface of Al2O3 ceramic matrix to coat Al2O3 ceramic matrix with nanometer copper film
  • Method for conducting magnetron sputtering on surface of Al2O3 ceramic matrix to coat Al2O3 ceramic matrix with nanometer copper film

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Embodiment 1

[0027] a in Al 2 o 3 The method for magnetron sputtering nano-scale copper film plating on ceramic substrate surface, it comprises the following steps:

[0028] (1) Sample treatment: Al 2 o 3The ceramic substrate was ultrasonically cleaned in acetone for 10 minutes, then ultrasonically cleaned twice with ethanol, taken out and dried;

[0029] (2) Equipment preparation: use a magnetron sputtering coating machine, select three Cu, Al and Ni simple substance targets with a purity of 99.99%, and the working gas is Ar gas with a purity of 99.99%, N 2 gas.

[0030] (3) The sample processed in step (1) is put into the furnace, and the air pressure in the vacuum chamber is pumped to 3×10 -3 Pa, filled with argon sputtering gas, ion bombardment for 10min, argon gas flow rate 20sccm, sputtering pressure 0.9Pa, plasma source power 1000W, turn on auxiliary heating, and raise the temperature to 350°C.

[0031] (4) Deposit the Al transition layer: turn on the magnetron sputtering Al t...

Embodiment 2

[0040] a in Al 2 o 3 The method for magnetron sputtering nanoscale copper film plating on ceramic substrate surface, it comprises the following steps: (1) sample processing: Al 2 o 3 The ceramic substrate was ultrasonically cleaned in acetone for 10 minutes, then ultrasonically cleaned twice with ethanol, taken out and dried;

[0041] (2) Equipment preparation: use a magnetron sputtering coating machine, select three Cu, Al and Ni simple substance targets with a purity of 99.99%, and the working gas is Ar gas with a purity of 99.99%, N 2 gas.

[0042] (3) The sample processed in step (1) is put into the furnace, and the air pressure in the vacuum chamber is pumped to 3×10 -3 Pa, filled with argon sputtering gas, ion bombardment for 10min, argon gas flow rate 10sccm, sputtering pressure 0.7Pa, plasma source input power 200W, turn on auxiliary heating, and raise the temperature to 350°C.

[0043] (4) Deposit the Al transition layer: turn on the power supply of the magnetron...

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Abstract

The invention provides a method for conducting magnetron sputtering on the surface of an Al2O3 ceramic matrix to coat the Al2O3 ceramic matrix with a nanometer copper film. According to the method, byconducting magnetron sputtering to coat the Al2O3 ceramic matrix with the nanometer copper film, protection of the film for the matrix is better, and good electrical conductivity and film-matrix adhesion are achieved; and the produced coat (film) is dense and flat, the hardness is high, the wear resistance is good, a wear rate decreases, and the high-temperature oxidation resistance is enhanced,so that the microstructure of the material (Al2O3 ceramic matrix) is improved, the comprehensive performance of the material (Al2O3 ceramic matrix) is improved, and meanwhile, the film has a good electrical property.

Description

technical field [0001] The invention belongs to the technical field of metal surface coatings, in particular to a 2 o 3 The invention discloses a preparation method for copper-plated metallization on the surface of a ceramic substrate. Background technique [0002] Al 2 o 3 Ceramic matrix is ​​an inorganic non-metallic material with high melting point, hardness and chemical stability. It has the characteristics of high temperature resistance, corrosion resistance, wear resistance and good insulation. It is widely used in the manufacture of daily life products and mechanical parts. With the improvement of people's living standards, Al 2 o 3 The performance requirements of ceramic materials are not limited to the use performance. By coloring the surface, while prolonging the service life, an elegant appearance is obtained, which greatly broadens its application range. The surface metallization of ceramics combines the good mechanical properties of ceramics and the excell...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35C23C14/18
CPCC23C14/352C23C14/185
Inventor 何霞文李杨张尚洲叶倩文毕永洁王政伟赵福帅赵亚晴姜晓雪
Owner 东莞市烽元科技有限公司
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