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A kind of raw material composition for preparing photocurable resin, photocurable resin prepared therefrom and application thereof

A technology of raw material composition and photocurable resin, which is applied in the field of curable resin synthesis, can solve the problems of reduced impact resistance, etc., and achieve the effects of low shrinkage, excellent mechanical and thermal properties, and high strength

Active Publication Date: 2022-07-19
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Currently known polyurethane / cyanate interpenetrating polymer network structure, bismaleimide / cyanate ester interpenetrating polymer network structure and epoxy / cyanate ester interpenetrating polymer network structure, etc., after the above modification The tensile and bending properties of the IPN resin are significantly improved, while the impact resistance is reduced

Method used

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  • A kind of raw material composition for preparing photocurable resin, photocurable resin prepared therefrom and application thereof
  • A kind of raw material composition for preparing photocurable resin, photocurable resin prepared therefrom and application thereof
  • A kind of raw material composition for preparing photocurable resin, photocurable resin prepared therefrom and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0060] The preparation of embodiment 1-5 photocurable IPN resin

[0061] The preparation steps of the light-cured IPN resin are as follows:

[0062] 1. Ingredient process

[0063] The cyanate ester was dissolved in the photocurable prepolymer in the beaker 1, and it stirred at 60 degreeC for 10 minutes. Mix the catalyst and part of the diluent in beaker 2, pour into beaker 1 after sonicating for 30 minutes, rinse beaker 2 with the remaining diluent and pour into beaker 1, then add photoinitiator and stir for 10 minutes. The beaker 1 was placed in a vacuum box, evacuated for 10 minutes, and the air bubbles were removed for later use.

[0064] 2. Curing process

[0065] 1) Ultraviolet light curing: pour the mixture prepared by the above batching process into a mold, and irradiate it under ultraviolet light with a power of 400W for 200 seconds to obtain a preliminary cured product.

[0066] 2) Thermal curing: the preliminary cured product is placed in a temperature-programmed...

Embodiment 6

[0070] Example 6 Performance test of light-cured IPN resin

[0071] The photocurable IPN resin samples prepared in the above Examples 1-5 were tested for mechanical and thermal properties.

[0072] The tensile strength was measured on a universal mechanical property testing machine according to the ISO527 standard; the glass transition temperature Tg was obtained from Tanδ on a dynamic thermomechanical analyzer DMA, the temperature range was 20 to 300°C, the heating rate was 3°C / min, and the vibration frequency was 1.0Hz. The sample size is 33mm×13mm×3.0mm; the thermal deformation temperature is measured on the Vicat tester, and the sample size is 80mm×10mm×3.0mm.

[0073] Table 2 Properties of light-cured IPN resins

[0074]

[0075]

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Abstract

The present application discloses a raw material composition for preparing a photocurable resin, a photocurable resin prepared therefrom and use thereof, belonging to the field of curable resin synthesis. The raw material composition for preparing the photocurable resin comprises cyanate ester, photocurable prepolymer, diluent, catalyst and photoinitiator. The photocurable interpenetrating polymer network structure resin is obtained from the composition through ultraviolet light curing and thermal curing. The raw material composition for preparing the photocurable resin of the present application has both the characteristics of rapid prototyping of photosensitive resin and the characteristics of excellent heat resistance and moisture resistance of cyanate ester. The photocurable interpenetrating polymer network structure resin of the present application has low viscosity and is easy to process, and has the advantages of high strength, high temperature resistance, low shrinkage, low water absorption and low dielectric constant, etc., and can be used for 3D printing, coating, bonding, etc. Agents, aerospace materials, printed circuit boards, invisibility cloaks, artificial satellites, flame retardant materials and electronic packaging.

Description

technical field [0001] The present application relates to a raw material composition for preparing a photocurable resin, a photocurable interpenetrating polymer network structure resin prepared therefrom, and use thereof, belonging to the field of curable resin synthesis. Background technique [0002] In the 1950s and 1960s, R.Stroh and H.Gerber synthesized cyanate esters for the first time. In 1963, German scientist E. Grigat used phenolic compounds to react with hydrogen halide to synthesize cyanate esters, and then Bayer company also conducted research on cyanate esters. However, due to the lack of understanding of the polymerization mechanism of cyanate esters and the improper processing methods of resins, the popularization and use of cyanate esters are limited. In 1976, Miles introduced 70% cyanate ester butanone solution resin and used it in the electronics industry. Cyanate ester resin has attracted the attention of people from all walks of life in recent years due...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F283/00C08F220/20C08F222/14C08F2/48
CPCC08F283/00C08F283/008C08F283/105C08F220/20C08F2/48
Inventor 周照喜李悦微许莹吴立新龚翠然罗震郑杨清
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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