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Ultraviolet absorbing compound and sealant composition comprising same

A compound and ultraviolet technology, applied in the direction of non-polymer organic compound adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of equipment function decline, organic light-emitting device degradation, degradation, etc.

Inactive Publication Date: 2021-03-19
克美有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, devices using organic thin films have problems in that they are degraded by moisture or oxygen, etc., and the functions of the devices are degraded, which eventually leads to a reduction in lifespan.
However, in this case, there are problems of deterioration of the organic light-emitting device due to the curing heat of the thermosetting resin composition and its own reaction heat, and a problem of delamination of the negative electrode from the organic layer due to stress changes at the time of curing.
Also, when an epoxy resin is cured with an amine curing agent, there is a problem that the organic light-emitting device is corroded through the pin hole of the protective film due to the influence of the amine exhaust gas generated during curing, or the transmittance is lowered due to the coloring of the cured product. Wait

Method used

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  • Ultraviolet absorbing compound and sealant composition comprising same
  • Ultraviolet absorbing compound and sealant composition comprising same
  • Ultraviolet absorbing compound and sealant composition comprising same

Examples

Experimental program
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preparation example Construction

[0070] The preparation method of the ultraviolet absorbing compound of chemical formula 1 according to one aspect of the present invention comprises: making the fluorenyl magnesium halide of the following chemical formula 1 react with the cyanuric chloride of the following chemical formula 2 to obtain the bisfluorenyl cyanuric chloride of the following chemical formula 3 Step; make the bisfluorenyl cyanuric chloride of above-mentioned chemical formula 3 react with the resorcinol of following chemical formula 4 to obtain the step of the bisfluorenyl cyanurate compound of following chemical formula 5 that the resorcinol replaces; And make The step of reacting the above-mentioned resorcinol-substituted bisfluorenyl cyanurate compound with an alkyl halide to obtain a compound of formula I,

[0071] Chemical formula 1:

[0072]

[0073] Chemical formula 2:

[0074]

[0075] Chemical formula 3:

[0076]

[0077] Chemical formula 4:

[0078]

[0079] Chemical formula 5...

preparation example 1

[0119] Preparation Example 1: Preparation of Compound 1

[0120] (1) Synthesis of compound 1-a

[0121]

[0122] 6.8 g (282 mmol) of magnesium, a small amount of iodine and 200 ml of tetrahydrofuran were added to a dry 2 L reactor and stirred for 15 minutes under nitrogen atmosphere. After dissolving 62.8 g (256 mmol) of 2-bromofluorene in tetrahydrofuran, it was added dropwise to the reactor at 0° C. and stirred under reflux for about 2 hours.

[0123] The reactant was added dropwise at 0°C to a tetrahydrofuran solution in which 23.6 g (128 mmol) of cyanuric chloride was dissolved, and the resulting mixture was stirred at 50°C under reflux for 12 hours. After completion of the reaction, an aqueous ammonium chloride solution was slowly added dropwise at 0°C to extract an organic layer, and then concentrated. The concentrate was purified by column chromatography to obtain 42.6 g of the above compound 1-a (75% yield).

[0124] 1 H NMR (300MHz, CDCl 3 ): δ7.98 (2H, d, J=8...

preparation example 2

[0133] Preparation Example 2: Preparation of Compound 2

[0134] (1) Synthesis of compound 2-a

[0135]

[0136] 6.8 g (282 mmol) of magnesium, a small amount of iodine and 200 ml of tetrahydrofuran were added to a dry 2 L reactor and stirred for 15 minutes under nitrogen atmosphere. After dissolving 77.1 g (256 mmol) of 2-bromo-9,9-diethylfluorene in tetrahydrofuran, this was added dropwise to the above-mentioned reactor at 0° C., followed by stirring under reflux for about 2 hours.

[0137] The above reactant was added dropwise at 0°C to a tetrahydrofuran solution in which 23.6 g (128 mmol) of cyanuric chloride was dissolved, and the resulting mixture was stirred at 50°C under reflux for 12 hours. After completion of the reaction, an aqueous ammonium chloride solution was slowly added dropwise at 0°C to extract an organic layer, and then concentrated. The concentrate was purified by column chromatography to obtain 55.5 g of Compound 2-a (78% yield).

[0138] 1 H NMR (...

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Abstract

Provided are an ultraviolet absorbing compound, a sealant composition comprising the same, and a sealant prepared thereby. According to an example of the present invention, degradation caused by ultraviolet light of a display device including an organic light emitting device, particularly a flexible display device, can be effectively prevented by including an ultraviolet light absorbing compound.

Description

technical field [0001] This specification claims priority on the filing date of Korean Patent Application No. 10-2019-0115690 filed with the Korean Intellectual Property Office on September 19, 2019, the entire contents of which are included in the present invention. [0002] The present invention relates to ultraviolet absorbing compounds and sealant compositions comprising the same. In particular, it relates to ultraviolet absorbing compounds useful for flexible displays and sealant compositions comprising the same. Background technique [0003] As devices using organic thin films, for example, photosensors, organic memory devices, display devices, organic transistors, organic thin film solar cells, organic semiconductor devices, communication devices, and the like are attracting attention. [0004] However, a device using an organic thin film has problems in that it deteriorates due to moisture, oxygen, etc., and the function of the device decreases, resulting in a decre...

Claims

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Application Information

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IPC IPC(8): C07D251/24C09J11/06C09J4/02C08F2/48
CPCC07D251/24C08F2/48C09J4/00C09J11/06C08K5/005C08K5/3492
Inventor 金俊佑司空泉金世勋金美爱崔景洙金星炫
Owner 克美有限公司