Fluorine-containing resin composition, resin glue solution containing fluorine-containing resin composition, fluorine-containing dielectric sheet, laminated board, copper-clad board and printed circuit board

A technology of printed circuit boards and fluorine-containing resins, which is applied to printed circuits, printed circuit components, and circuit substrate materials, etc. Effects of electrical properties and withstand voltage properties

Active Publication Date: 2021-03-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the problem in the aforementioned patent application is that the interaction force between the unmodified inorganic filler and the fluorine-containing resin matrix is ​​very poor, especially when the addition amount of the inorganic filler is required to be very large, the inorganic filler will be in the base The dispersion in the body is extremely poor, the inhomogeneity of the dielectric properties of the plate is extremely serious, and the mechanical properties are difficult to meet the actual use requirements
[0004] Therefore, it is urgent to solve the problem of poor interaction between unmodified inorganic filler and PTFE resin matrix, as well as the problem of decreased electrical performance and reduced voltage resistance caused by adding a large amount of inorganic filler to the PTFE resin system.

Method used

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  • Fluorine-containing resin composition, resin glue solution containing fluorine-containing resin composition, fluorine-containing dielectric sheet, laminated board, copper-clad board and printed circuit board
  • Fluorine-containing resin composition, resin glue solution containing fluorine-containing resin composition, fluorine-containing dielectric sheet, laminated board, copper-clad board and printed circuit board
  • Fluorine-containing resin composition, resin glue solution containing fluorine-containing resin composition, fluorine-containing dielectric sheet, laminated board, copper-clad board and printed circuit board

Examples

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Effect test

Embodiment 1

[0062] This embodiment provides a fluorine-containing resin composition, comprising the following components: PTFE resin (247.5g), inorganic filler A (300g), thickener (4g).

[0063] The preparation method of above-mentioned fluororesin composition is as follows: get 450g PTFE resin emulsion (particle diameter 0.25 μ m, resin content 55wt%, Japanese Daikin Company produces, trade mark: D210C), add 300g inorganic filler A and 4g thickener (polyester Oxyethylene distyrenated phenyl ether, Kao Corporation, brand name EMULGEN A-60), was stirred and mixed for 2 hours to obtain the resin glue of the fluorine-containing resin composition.

[0064] This embodiment also provides a copper clad laminate, the preparation method of which is as follows:

[0065] The above-mentioned resin glue solution was coated on the surface of the PI film with a coating machine, and a resin layer with a thickness of 129 μm was coated to obtain a glue-coated PI film. Put the glue-coated PI film in a vacu...

Embodiment 2

[0067] The only difference from Example 1 is that the inorganic filler A is replaced by an equal mass of inorganic filler B.

Embodiment 3

[0069] The difference with Example 1 is only that the inorganic filler A is replaced with the inorganic filler A that uses a silane coupling agent to carry out surface modification, wherein the silane coupling agent is a polar coupling agent (all Fluorosilane, Shandong Sike, F823) and non-polar coupling agent (silane coupling agent with epoxy group, Shin-Etsu Chemical, product name KBM403), the amount of silane coupling agent is 0.5% of the quality of inorganic filler A %.

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Abstract

The invention relates to a fluorine-containing resin composition, and a resin glue solution containing the fluorine-containing resin composition, a fluorine-containing dielectric sheet, a laminated board, a copper-clad board and a printed circuit board. The fluorine-containing resin composition comprises the following components: 30wt%-70wt% of a fluorine-containing polymer and 30wt%-70wt% of an inorganic filler; the inorganic filler comprises the following particle size distribution: D10 is greater than 1.5 microns, and D50 is 10-15 microns. By selecting the inorganic filler with specific particle size distribution, even if the addition amount of the inorganic filler is large, the plate prepared from the fluorine-containing resin composition has excellent dielectric property and voltage resistance.

Description

technical field [0001] The invention relates to the technical field of communication materials, in particular to a fluorine-containing resin composition and a resin glue containing the same, a fluorine-containing dielectric sheet, a laminate, a copper-clad laminate and a printed circuit board. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, vending machines, communication base stations, satellites, wearable devices, unmanned vehicles, drones and intelligent robots, and are one of the key basic materials for the electronic communication and information industries. The fluorine-containing resin represented by polytetrafluoroethylene (PTFE) has many excellent properties such as low dielectric constant, low dielectric loss, high thermal stability and chemical stability that cannot be compared with other polymer resins. It is an ideal Copper clad laminate base material. Since the invention of PTFE-based CCL in the 1950s, researche...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K9/06C08K7/18C08K7/00C08K3/38C08J5/18B32B27/06B32B27/20B32B27/32B32B15/085B32B15/20B32B27/30H05K1/03
CPCC08J5/18H05K1/036B32B27/08B32B27/20B32B27/322B32B15/085B32B15/20B32B27/304C08J2327/18C08K9/06C08K7/18C08K7/00C08K2003/385B32B2250/24B32B2250/242B32B2250/40B32B2264/102B32B2264/10B32B2264/12B32B2307/20B32B2457/08B32B2270/00H05K1/03C09D127/18C08K3/36H05K3/022H05K1/034C08K2003/2241C08K2201/005C08K3/22H05K1/0373C08K3/013C08L71/02C08L27/12C08K7/04C08K7/28C08L27/18C09J127/18H01B3/445C08J2427/18C08J2471/02C08L2201/52C08L2203/16C08L2203/20C08L2205/025C08L2205/03H05K2201/0209
Inventor 柴颂刚刘潜发郝良鹏梁伟
Owner GUANGDONG SHENGYI SCI TECH
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