Water-soluble lead-free flux paste, washing solder paste and preparation method of washing solder paste

Abstract

The invention discloses washing superfine tin powder water-soluble lead-free high-temperature flux paste and a preparation method thereof. The washing superfine tin powder water-soluble lead-free high-temperature flux paste is prepared from the following raw materials in parts by weight: 30-55 parts of an antioxidant, 10-26 parts of an organic solvent, 4-8 parts of a thixotropic agent, 8-16 partsof an active agent, 6-10 parts of a corrosion inhibitor and 6-10 parts of a surfactant. The water-washing solder paste prepared from the flux paste is good in stability, and effectively meets the practical requirements for oxidation resistance, tin point plumpness, low void content, no splashing of residues, good cleaning performance and the like.

Description

technical field

[0001] The invention belongs to the technical field of soldering paste, in particular to a water-washed ultrafine tin powder water-soluble lead-free high-temperature soldering paste and a preparation method thereof. Background technique

[0002] With the development of the semiconductor packaging industry, the semiconductor packaging method is more precise, and the use of no-clean solder paste soldering cannot meet the requirements of increasingly precise and smaller pitch soldering. The residue in the no-clean solder paste is very easy to cause many adverse effects such as chip breakdown short circuit, withstand voltage drop, leakage, etc. for ultra-fine pitch soldering, especially chip soldering of semiconductor device packaging, under the condition of large instantaneous current . This requires that after soldering, the residue must be completely removed, so the current ordinary rosin-type no-clean solder paste can not meet the cleaning requirements, only...

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