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Water-soluble lead-free flux paste, washing solder paste and preparation method of washing solder paste

A solder paste and water-soluble technology, which is applied in the field of water-washed ultra-fine tin powder water-soluble lead-free high-temperature solder paste and its preparation, can solve the problem of inability to meet more precise operation requirements, strong aggressiveness of solder paste to tin powder, Affect the reliability of the welding effect and other issues, to achieve the effect of low voids, good cleanability, and detailed steps

Active Publication Date: 2021-04-02
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Ultra-fine-pitch semiconductors (4-6mil) require tin powder of size below No. 6 (5-15 microns). At present, traditional water-washed solder paste generally has poor oxidation resistance, which leads to easy oxidation of tin powder, which affects soldering effect and storage reliability.
[0009] (2) Insufficient welding ability
[0010] Ordinary water-washed solder paste lacks rosin carrier, and the solder paste is highly aggressive to tin powder, so the active body configuration is weaker than conventional solder paste. For the welding of special semiconductor materials, the soldering ability is insufficient
[0011] (3) The thixotropic index is low
[0012] The thixotropic index of conventional water-washed solder paste is about 0.5-0.6, which is not up to the expected thixotropic index of 0.6-0.7, so it cannot meet the more refined operation requirements

Method used

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  • Water-soluble lead-free flux paste, washing solder paste and preparation method of washing solder paste
  • Water-soluble lead-free flux paste, washing solder paste and preparation method of washing solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] The water-soluble lead-free soldering paste consists of the following components in parts by weight:

[0055] 51 parts of antioxidant, 16.8 parts of organic solvent, 4 parts of thixotropic agent, 12 parts of active agent, 8.2 parts of corrosion inhibitor, and 8 parts of surfactant.

[0056] Among them, the antioxidant is composed of water-soluble polymerized rosin, high acid value liquid organic acid EB9, tetrahydroxypropyl ethylenediamine, and polyoxyethylene tallow amine in a weight ratio of 2:4.8:2.4:1; the organic solvent is composed of Tetraethylene glycol dimethyl ether and 1-decyl alcohol are mixed at a weight ratio of 1:2; the thixotropic agent is a water-soluble polyamide, and the active agent is malonic acid, dimethylolpropionic acid, succinic acid and cyclic Hexylamine adipate is composed by weight ratio of 1:12:5:6; the corrosion inhibitor is composed of diethylimidazole and triethanolamine by weight ratio of 1.56:1.

[0057] Wherein the water-soluble polya...

Embodiment 2

[0068] The water-soluble lead-free soldering paste consists of the following components in parts by weight:

[0069] 51 parts of antioxidant, 16.8 parts of organic solvent, 6 parts of thixotropic agent, 12 parts of active agent, 8.2 parts of corrosion inhibitor and 8 parts of surfactant.

[0070] Among them, the antioxidant is composed of water-soluble polymerized rosin, high acid value liquid organic acid EB9, tetrahydroxypropyl ethylenediamine, and polyoxyethylene tallow amine in a weight ratio of 3:5:3:1; the organic solvent is composed of Tetraethylene glycol dimethyl ether and 1-decyl alcohol are mixed in a weight ratio of 1:3; the thixotropic agent is composed of water-soluble polyamide and water-based vinyl ether in a weight ratio of 4:2, and the active agent is made of propanediol Acid, dihydroxymethylpropionic acid, succinic acid and cyclohexylamine adipate in a weight ratio of 1:15:7:8; the corrosion inhibitor consists of diethylimidazole and triethanolamine in a wei...

Embodiment 3

[0083] The water-soluble lead-free soldering paste consists of the following components in parts by weight:

[0084] 51 parts of antioxidant, 16.8 parts of organic solvent, 8 parts of thixotropic agent, 12 parts of active agent, 8.2 parts of corrosion inhibitor and 8 parts of surfactant.

[0085] Among them, the antioxidant is composed of water-soluble polymerized rosin, high acid value liquid organic acid EB9, tetrahydroxypropyl ethylenediamine, and polyoxyethylene tallow amine in a weight ratio of 1:3:2:1; the organic solvent is composed of Tetraethylene glycol dimethyl ether and 1-decyl alcohol are mixed in a weight ratio of 1:1; the thixotropic agent is composed of water-soluble polyamide and water-based vinyl ether in a weight ratio of 6:2, and the active agent is made of propanediol Acid, dihydroxymethylpropionic acid, succinic acid and cyclohexylamine adipate in a weight ratio of 1:10:3:4; the corrosion inhibitor is composed of diethylimidazole and triethanolamine in a ...

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Abstract

The invention discloses washing superfine tin powder water-soluble lead-free high-temperature flux paste and a preparation method thereof. The washing superfine tin powder water-soluble lead-free high-temperature flux paste is prepared from the following raw materials in parts by weight: 30-55 parts of an antioxidant, 10-26 parts of an organic solvent, 4-8 parts of a thixotropic agent, 8-16 partsof an active agent, 6-10 parts of a corrosion inhibitor and 6-10 parts of a surfactant. The water-washing solder paste prepared from the flux paste is good in stability, and effectively meets the practical requirements for oxidation resistance, tin point plumpness, low void content, no splashing of residues, good cleaning performance and the like.

Description

technical field [0001] The invention belongs to the technical field of soldering paste, in particular to a water-washed ultrafine tin powder water-soluble lead-free high-temperature soldering paste and a preparation method thereof. Background technique [0002] With the development of the semiconductor packaging industry, the semiconductor packaging method is more precise, and the use of no-clean solder paste soldering cannot meet the requirements of increasingly precise and smaller pitch soldering. The residue in the no-clean solder paste is very easy to cause many adverse effects such as chip breakdown short circuit, withstand voltage drop, leakage, etc. for ultra-fine pitch soldering, especially chip soldering of semiconductor device packaging, under the condition of large instantaneous current . This requires that after soldering, the residue must be completely removed, so the current ordinary rosin-type no-clean solder paste can not meet the cleaning requirements, only...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362B23K35/36
CPCB23K35/362B23K35/3612
Inventor 吴高健钱雪行
Owner 深圳市晨日科技股份有限公司
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