Semiconductor cleaning agent and preparation method thereof

A cleaning agent and semiconductor technology, which is applied in the preparation of detergent mixture compositions, detergent compositions, detergent compounding agents, etc., can solve the problem of unsatisfactory removal effect of strong lye cleaning agents, eutrophication of water sources, and poor environment. friendly and other problems, to achieve the effect of rapid peeling and emulsification of oil stains, meeting production needs, and excellent dispersion.
CN112592771AInactive Publication Date: 2021-04-02德锡化学(山东)有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
德锡化学(山东)有限公司
Publication Date
2021-04-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a semiconductor cleaning agent and a preparation method thereof, and belongs to the technical field of semiconductor cleaning. The semiconductor cleaning agent comprises the following components in parts by mass: 2-5 parts of a nonionic surfactant, 9-12 parts of an anionic surfactant and 3-6 parts of an organic solvent. The semiconductor cleaning agent prepared by the preparation method of the semiconductor cleaning agent has excellent dispersing performance and tolerance to abrasives, metal ions and the like on the surface of a silicon wafer, the cleaned surface is uniform, smooth and clean, the production requirements of customers are well met, and meanwhile, the pollution to the environment is reduced.
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Description

technical field

[0001] The application relates to a semiconductor cleaning agent and a preparation method thereof, belonging to the technical field of semiconductor cleaning. Background technique

[0002] In the production of silicon transistors and integrated circuits, almost every process has the problem of cleaning silicon wafers. The quality of silicon wafers has a serious impact on device performance. Improper handling may cause all silicon wafers to be scrapped and fail to produce qualified products. Products, or manufactured products have poor performance, poor stability and reliability.

[0003] After a series of processing of the silicon material, the surface of the silicon wafer will form sand, cutting abrasives, fingerprints and metal ions. The purpose of cleaning is to remove pollutants such as particles, metal ions and organic substances on the surface of the silicon wafer, so that the surface of the silicon wafer can reach No corrosion, oxidation, no residue a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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