Method of preparing Mo-Cu alloy through field-assisted activated sintering

Abstract

The invention discloses a method of preparing Mo-Cu alloy through field-assisted activated sintering and belongs to the technical field of refractory metal processing. The method comprises the steps that molybdenum powder and copper powder are subjected to wet grinding and vacuum drying according to a certain component proportion to obtain Mo-Cu mixed powder, then the Mo-Cu mixed powder is put in a die to be pressed into a pressed blank, then the pressed blank is put in sintering equipment, and the Mo-Cu alloy is prepared through rapid sintering at a relatively low temperature with a specific sintering process. Aiming at the problems of Mo-Cu alloy preparation in the prior art, the invention provides the method of preparing the Mo-Cu alloy by field-assisted activated sintering, so that the sintering process can be conveniently and effectively controlled, and the compact Mo-Cu composite material with fine grains can be quickly obtained at the relatively lower temperature. In the method, activated sintering is carried out under the combined action of three physical fields, namely an electric field, a thermal field and a force field, so that a compaction process of a pressed blank is quickly completed at the relatively low temperature; and the preparation process is easy to control, activated elements do not need to be added in the sintering process, and then the quality of a product is improved.

Description

technical field [0001] The invention belongs to the technical field of refractory metal processing, and in particular relates to a method for preparing Mo-Cu alloy by field-assisted activation sintering. Background technique [0002] Mo-Cu alloy is a typical pseudo-alloy composed of Mo and Cu elements that are neither solid solution with each other nor form intermetallic compounds. Mo-Cu alloy not only has the characteristics of high strength, high hardness and low expansion coefficient of Mo, but also has the characteristics of high electrical conductivity and thermal conductivity of Cu. It is used in electrical contacts, electrode materials, electronic packaging, Thermal deposition materials, military equipment, aerospace and high temperature gas parts and other fields. It is worth noting that, compared with W-Cu alloys with similar functions and properties, the heat resistance of Mo-Cu alloys is not as good as that of W-Cu, but Mo-Cu alloys are light in weight and easy t...

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Problems solved by technology

However, this technology generally puts the Mo-Cu mixed powder into a graphite mold and puts it into a spark plasma sintering device for sintering. Partially acts on the compact, and cannot play a good role in promoting the sintering densification of the electric field

[0008] In summary, the current main preparation methods of Mo-Cu alloys either have shortcomings such as high sintering temperature, long sintering time, and severe grain growth, or the performance of Mo-Cu alloys is reduced due to the addition of activating elements; or there are production processes The disadvantages of cumbersome and high production costs, or the disadvantages of large mold consumption limit the popularization and application of Mo-Cu alloys to a certain extent.

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