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Special demolding film for manufacturing flexible printed circuit board

A circuit board manufacturing and flexible printing technology, applied in the field of film materials, can solve the problems of affecting the life and appearance of FPC circuits, not being able to obtain FPC, poor processing performance, etc., and achieve good comprehensive performance and performance stability, and significant mold release effect , the effect of preventing wrinkles

Active Publication Date: 2021-05-11
苏州市新广益电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These release films generally have the problem of releasability from the cover film, especially the problem of difficulty in plating due to transfer of copper foil when manufacturing multilayer flexible wiring boards
They also may wrinkle due to heat shrinkage, or have insufficient heat resistance, or have high price, low rigidity, poor processability, and insufficient moisture absorption; these defects seriously affect the circuit life and appearance of FPC
[0005] Japanese Patent Laying-Open No. 2-175247 discloses a release film for FPC. The problem with this release film is that in the process of applying heat and pressure to bond the overcoat layer to the circuit on the surface of the substrate , does not necessarily have a sufficient effect of preventing wrinkles on the film, and an FPC with a satisfactory appearance cannot be obtained

Method used

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  • Special demolding film for manufacturing flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A preparation method for a special mold release film for flexible printed circuit board manufacturing, characterized in that it comprises the following steps:

[0031] Step S1, preparation of copolymer: 1-allyl-3-methylimidazole chloride, 5-(methacryloyloxy)methyl-1,3-oxathiolane-2-thione, Vinyl monoblocked dimethylpolysiloxane, N-(4-cyano-3-trifluoromethylphenyl)methacrylamide, 4-methyl-1-pentene, and initiator were added to high In a boiling point solvent, in an inert gas atmosphere, stir and react at 65°C for 4 hours, then precipitate in water, wash the precipitated polymer with ethanol for 3 times, and finally place it in a vacuum drying oven at 85°C to dry to constant weight to obtain a copolymer thing;

[0032] Step S2, molding of release film: mix the copolymer prepared in step S1, 2,4,6-tris(4-carboxyphenyl)-1,3,5-triazine, filler and coupling agent evenly Finally, the mixed material is obtained, and then the mixed material is added into a twin-screw extruder ...

Embodiment 2

[0038] A preparation method for a special mold release film for flexible printed circuit board manufacturing, characterized in that it comprises the following steps:

[0039]Step S1, preparation of copolymer: 1-allyl-3-methylimidazole chloride, 5-(methacryloyloxy)methyl-1,3-oxathiolane-2-thione, Vinyl monoblocked dimethylpolysiloxane, N-(4-cyano-3-trifluoromethylphenyl)methacrylamide, 4-methyl-1-pentene, and initiator were added to high In a boiling point solvent, in an inert gas atmosphere, stir the reaction at 67°C for 4.5 hours, then precipitate in water, wash the precipitated polymer with ethanol 4 times, and finally place it in a vacuum drying oven at 87°C to dry to constant weight to obtain a copolymer thing;

[0040] Step S2, molding of release film: mix the copolymer prepared in step S1, 2,4,6-tris(4-carboxyphenyl)-1,3,5-triazine, filler and coupling agent evenly Finally, the mixed material is obtained, and then the mixed material is added into a twin-screw extruder ...

Embodiment 3

[0045] A preparation method for a special mold release film for flexible printed circuit board manufacturing, characterized in that it comprises the following steps:

[0046] Step S1, preparation of copolymer: 1-allyl-3-methylimidazole chloride, 5-(methacryloyloxy)methyl-1,3-oxathiolane-2-thione, Vinyl monoblocked dimethylpolysiloxane, N-(4-cyano-3-trifluoromethylphenyl)methacrylamide, 4-methyl-1-pentene, and initiator were added to high In a boiling point solvent, in an inert gas atmosphere, stir and react at 70°C for 5 hours, then precipitate in water, wash the precipitated polymer with ethanol for 5 times, and finally dry it in a vacuum oven at 90°C to constant weight to obtain a copolymer thing;

[0047] Step S2, molding of release film: mix the copolymer prepared in step S1, 2,4,6-tris(4-carboxyphenyl)-1,3,5-triazine, filler and coupling agent evenly Finally, the mixed material is obtained, and then the mixed material is added into a twin-screw extruder to be melted and...

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Abstract

The invention discloses a preparation method of a special demolding film for manufacturing a flexible printed circuit board, which is characterized by comprising the following steps of: S1, preparing a 1-allyl-3-methylimidazolium chloride / 5-(methacryloyloxy) methyl-1, 3-oxathiolane-2-thione / vinyl mono-terminated dimethyl polysiloxane / N-(4-cyano-3-trifluoromethylphenyl) methacrylamide / 4-methyl-1-pentene copolymer; and S2, molding a demolding film. The invention further discloses a special demolding film for manufacturing a flexible printed circuit board, which is prepared according to the preparation method of a special demolding film for manufacturing a flexible printed circuit board. The special demolding film for manufacturing the flexible printed circuit board disclosed by the invention is good in comprehensive performance and performance stability, long in service life, remarkable in demolding effect, capable of effectively preventing wrinkles and suitable for being used by an FPC (Flexible Printed Circuit).

Description

technical field [0001] The invention relates to the technical field of film materials, in particular to a special release film for the manufacture of flexible printed circuit boards. Background technique [0002] Flexible printed circuit boards are printed circuits made of flexible insulating substrates, which have many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC can greatly reduce the volume of electronic FPC, which is suitable for the development of electronic FPC in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08K5/3492C08K3/34C08K5/544C08K13/02C08J5/18C08F283/12C08F226/06C08F220/38C08F220/60C08F210/14H05K3/00
CPCC08J5/18C08F283/124H05K3/00C08J2351/08C08K5/3492C08K3/34C08K5/544C08K5/5435C08K3/346C08K13/02C08F226/06C08F220/382C08F220/606C08F210/14
Inventor 夏超华
Owner 苏州市新广益电子股份有限公司
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