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Optical laminating method for silicon-based OLED micro-display device

A micro-display device and silicon-based technology, which is applied in the manufacturing of semiconductor devices, electric solid-state devices, and semiconductor/solid-state devices, etc., can solve the problems of low bonding and alignment accuracy, poor bonding flatness, and complicated process flow. , to achieve the effect of saving labor costs, good contrast, and simplifying the process

Pending Publication Date: 2021-05-25
ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, silicon-based OLED microdisplay devices on the market use silicon wafers with a thickness of 725 μm as the substrate, and cover glass with a thickness of 500 μm to protect the display layer; Bonding in the vacuum chamber, high equipment investment cost, poor bonding flatness, easy to produce Muar (uneven brightness)
[0004] The existing silicon-based OLED micro-display device process is relatively complicated, requiring multiple processes and equipment to carry out operations including the following: dispensing coating (machine) → substrate lamination (machine) → pressure defoaming (furnace) → UV Curing (furnace); the bonding method is mainly large-scale VS large-scale bonding, which is prone to bubbles, and the product needs to be bonded in a vacuum chamber, which requires high equipment investment costs, low bonding alignment accuracy, and poor bonding flatness. Muar (uneven brightness)

Method used

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  • Optical laminating method for silicon-based OLED micro-display device
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  • Optical laminating method for silicon-based OLED micro-display device

Examples

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Effect test

Embodiment 1

[0032] A silicon-based OLED microdisplay device optical bonding method, comprising the following steps:

[0033] 1) The thin-film-encapsulated silicon wafer and cover glass containing OLED and CMOS circuits are cleaned and then dried; the cover glass is cleaned with water, and the washing tank is respectively ultrasonic vibration + megasonic vibration; Wafers are rinsed with two fluids or megasonic waves; after cleaning and drying, silicon wafers and cover glass are inspected by AOI equipment, and defective products are picked out or marked.

[0034] 2) Coating the silicon wafers containing OLED and CMOS that have passed the AOI inspection with filling materials: the filling material uses OCR glue; Can achieve;

[0035] 3) Lay the glue-coated silicon wafer and the cover glass in alignment: take the silicon wafer coated with the filling material and the cover glass one by one for alignment and lamination; the size of the cover glass is one unit The size of each piece contains...

Embodiment 2

[0038] A silicon-based OLED microdisplay device optical bonding method, comprising the following steps:

[0039] 1) The thin-film-encapsulated silicon wafer and cover glass containing OLED and CMOS circuits are cleaned and then dried; the cover glass is cleaned with water, and the washing tank is respectively ultrasonic vibration + megasonic vibration; The film is washed with two fluids or megasonic wave;

[0040] 2) Use AOI equipment to inspect the cleaned and dried silicon wafers and cover glass, and pick out or mark the defective products; use the ring guide rail to carry out the follow-up process, and the first stage will go to the pick-up station 1 first. After the operation is completed, the first stage moves on the circular guide rail; first moves to the dispensing station 2, and dispenses the entire silicon wafer containing OLED and CMOS that has passed the AOI inspection; at the same time The second carrier enters the unloading station 1 to perform the unloading and ...

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PUM

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Abstract

The invention provides an optical laminating method for a silicon-based OLED micro display device, which can effectively improve the laminating precision, the flatness and the laminating yield of a single product by adopting a mode of laminating small VS pieces and large VS pieces in batches, can effectively reduce the generation of bubbles, has better water and oxygen barrier property, can improve the coupling output efficiency of light, and is high in color purity and good in contrast ratio. According to the invention, a plurality of carrying tables are arranged in the whole process of rotating the guide rail, so that the dispensing process, the mounting process, the pressurizing defoaming process and the UV curing process can be respectively and simultaneously carried out, and the production efficiency is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of OLED microdisplay devices, and in particular relates to an optical bonding method for silicon-based OLED microdisplay devices. Background technique [0002] Silicon-based OLED (Organic Light Emittin Display) is known as the dark horse of next-generation display technology. Silicon-based OLED microdisplay refers to an organic light-emitting device with a display size of less than 1 inch and driven by silicon-based CMOS, with pixels up to 800×600 above. It is different from conventional AMOLED devices that use amorphous silicon, microcrystalline silicon or low-temperature polysilicon thin-film transistors as the backplane. It is an active organic light-emitting diode display device made of single-crystal silicon as the active driving backplane. The pixel size is 1 / 10 of traditional display devices, the fineness is much higher than traditional devices, and has many advantages such as high resolution, high i...

Claims

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Application Information

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IPC IPC(8): H01L51/56H01L51/00
CPCH10K71/50H10K59/1201H10K71/00
Inventor 冯军龙乔辉任清江祖伟
Owner ANHUI SEMICON INTEGRATED DISPLAY TECH CO LTD
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