Preparation method of brazing filler metal for lead-free tin-silver-copper brazing
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A brazing material, silver-copper technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve problems such as poor oxidation resistance, decreased reliability of brazing filler metal, high cost of brazing filler metal, etc.
Pending Publication Date: 2021-06-29
江苏德誉环保设备科技有限公司
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Problems solved by technology
However, compared with the traditional Sn-Pb solder, its oxidation resistance is poor, and due to the high content of Ag, it is easy to form large Ag 3 Sn intermetallic compounds reduce the reliability of the solder, and the higher Ag content also results in a higher cost of the Sn-Ag solder
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Embodiment 1
[0023] The preparation method of solder for lead-free tin-silver-copper brazing of the present invention comprises the following steps:
[0024] S1, weigh the raw materials Sn, Ag, Cu, Ge, Mn, Ni and P-Cu master alloy, so that the Ni element accounts for 1% of the total mass, the Ag element accounts for 2% of the total mass, and the Cu element accounts for 2.5% of the total mass , P element accounts for 1.5% of the total mass, Ge element accounts for 1% of the total mass, Mn element accounts for 2% of the total mass, and the balance is Sn element (90%);
[0025] S2, mix all the weighed raw materials, put them into a heating furnace with a temperature of 1000~1200°C for melting, the heating furnace adopts a vacuum induction heating furnace, and the vacuum degree is <10Pa, and then cast it into a solder ingot;
[0026] S3, remove the scale and riser of the solder ingot, and then use the method of hot extrusion to make the ingot into a wire rod of φ2~4mm (use a hydraulic press, s...
Embodiment 2
[0030] Different from Example 1, each element in the solder of Example 2 is composed of the following mass percentages:
[0031] Ag: 2%; Cu: 2%; P: 1%; Ge: 2%; Mn: 1%; Ni: 1.5%; the balance is Sn (90.5%).
[0032] The preparation method is the same as in Example 1.
[0033] After testing, the solder obtained in this embodiment has good wettability and spreadability on welding base materials such as Cu plate, Ni plate and ceramics. Compared with the commonly used Sn-3.5Ag solder, under the same conditions, the solder The wet angle is reduced by 4°~6°, the oxidation resistance is increased by 15~23%, the creep strength is increased by 6~9%, and the shear strength is increased by 14%~20%, showing good brazing process performance , the joint performance obtained by welding is excellent.
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Abstract
The invention discloses a preparation method of brazing filler metal for lead-free tin-silver-copper brazing. The preparation method comprises the following steps that firstly, raw materials Sn, Ag, Cu, Ge, Mn, Ni and a P-Cu intermediate alloy are weighed and taken to enable that the Ni element accounts for 1%-2% of the total mass, the Ag element accounts for 2.0%-3.0% of the total mass, the Cu element accounts for 1.5%-2.5% of the total mass, the P element accounts for 0.5%-1.5% of the total mass, the Ge element accounts for 1%-2% of the total mass, the Mn element accounts for 1%-2% of the total mass, and the balance is the Sn element; the weighed raw materials are uniformly mixed, smelt in a heating furnace at the temperature of 1000 DEG C-1200 DEG C, and cast into an ingot; oxide skin and dead heads of the cast ingot are removed, and the cast ingot is made into a wire by adopting a hot extrusion forming method; and after vacuum annealing is carried out, the wire is processed into blocky brazing filler metal, rod-shaped brazing filler metal, sheet-shaped brazing filler metal or filiform brazing filler metal according to use requirements. According to the lead-free tin-silver-copper brazing filler metal prepared through the method, under the condition that good thermal performance is guaranteed, the wettability and the oxidation resistance are further improved, and the higher requirement of electronic products for the performance of welding spots is met.
Description
technical field [0001] The invention relates to the field of solder production, in particular to a preparation method of solder for lead-free tin-silver-copper brazing. Background technique [0002] Solder refers to the solder whose melting temperature is lower than 450°C. It is divided into tin-based, lead-based, zinc-based, cadmium-based, etc., but tin-lead alloy-based systems are mostly used. Due to the advantages of low melting point and good soldering performance, tin-lead solder has been widely used in the electronics industry. Although the softness and ductility of lead are good, it is a heavy metal that is seriously destructive to human health and the ecological environment. At present, countries have legislated to strictly prohibit the use of lead, so the development of lead-free solder has become an irreversible trend. [0003] In recent years, extensive research has been carried out on lead-free solder at home and abroad. At present, the most representative lead-...
Claims
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