Copper microalloy, copper microalloy wire and preparation methods of copper microalloy and copper microalloy wire

Abstract

A copper microalloy is prepared from the components including, by weight, 0.5%-0.7% of palladium, 0.3%-0.5% of gold, 0.1%-0.3% of silver, 0.05%-0.2% of platinum, 0.05%-0.1% of phosphorus, 0.05%-0.1%of silicon and the balance copper. In the copper microalloy, phosphorus exists in the form of copper phosphide (Cu3P2), and silicon exists in the form of copper silicide (Cu5Si). The invention further provides a copper microalloy wire which is manufactured from the copper microalloy through a wire drawing technology. The invention further provides preparation methods of the copper microalloy and the copper microalloy wire. The copper microalloy wire has good conductivity, high corrosion resistance (the corrosion resistance is higher than that of a pure copper wire), and excellent mechanical strength and electrical fatigue characteristics. The tensile strength of the copper microalloy wire is 5-7 gf, and the power-on fatigue life of the copper microalloy wire is greater than 300 times.

Description

technical field [0001] The invention relates to alloy materials, in particular to a copper microalloy, a wire made of the copper microalloy (a wire that can be used for IC and LED packaging), and a preparation method of the above copper microalloy and copper microalloy wire. Background technique [0002] Copper wire is the main material for making wires because of its good conductivity and low cost, but because copper wire is easily oxidized and easily corroded, which affects its conductivity. In order to reduce the oxidation of the copper wire, a coating layer is currently coated on the outer surface of the copper wire to reduce the oxidation and corrosion rate of the copper wire. [0003] For example, Chinese Patent No. CN 103745963 B discloses a copper-based lead wire and a semiconductor package structure carrying the copper-based lead wire, which is a copper wire as a core material by electrolytic gold plating, electroless gold plating or evaporation method. The outer s...

AI Technical Summary

Problems solved by technology

However, due to the different materials of the inner and outer layers, this type of copper wire will have poor resistance to electrothermal fatigue due to the difference in thermal expansion; moreover, because of the different materials, it is more prone to potential difference corrosion in a corrosive environment, which greatly reduces application reliability.

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