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Laser additive manufacturing method of a tungsten-copper composite material

A composite material, tungsten copper technology, applied in metal material coating process, coating, electrical components and other directions, can solve the problems of uneven tissue distribution, complex process, high powder cost, save raw material cost, simplify preparation process, The effect of improving mechanical properties

Active Publication Date: 2022-05-10
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The theoretical density of the high-temperature liquid phase sintering method is 90-95%. In order to increase its density, it is necessary to increase the subsequent processing steps after liquid phase sintering: repressing, hot pressing, hot forging, etc., which complicates the process and increases the cost. cost
In the infiltration method, the liquid phase copper infiltrates only by the capillary action of the tungsten skeleton pores, and the densification speed is slow. After infiltration, the structure of the WCu composite material, the tungsten particles merge and grow, and the excessive overflow of the liquid phase copper causes the components to segregate and the structure The distribution is uneven, and the process is complicated and the production cycle is long. The obtained sintered product needs to be machined to remove excess metal copper, which increases the processing cost and reduces the yield
[0004] Laser cladding, a new type of surface strengthening method, has gradually matured after the development of high-power lasers in recent years, and has certain applications in the field of tungsten copper, but it still has very complicated problems in the powder processing process, which will be extremely Big obstacles to the application of laser cladding engineering
Such as CN103952697A invention in the raw material preparation of tungsten-copper layer needs Cu powder and W powder to dry after 20 hours of wet ball milling, and the process is too complicated; Need to adopt ultra-fine crystal or nanocrystalline tungsten powder and copper powder in CN 110343925 A invention Mixing, powder cost too much

Method used

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  • Laser additive manufacturing method of a tungsten-copper composite material
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  • Laser additive manufacturing method of a tungsten-copper composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0039] (1) Use spherical pure tungsten powder with a particle size of 25 microns, and dry it in an oven before laser cladding. The drying temperature is 200-250 ° C, and the drying time is 1-2 hours.

[0040] (2) Grinding the surface of the pure copper workpiece with a grinder and sandpaper to remove the surface oxide layer; and cleaning the surface of the pure copper workpiece with absolute alcohol or acetone to obtain a pure copper workpiece with a clean surface;

[0041] (3) Prepare tungsten-copper cladding by passing pure tungsten powder through high-speed laser cladding equipment. The laser equipment adopts high-speed cladding fiber laser with a wavelength of 1080nm in continuous output mode. It adopts the light-encapsulated powder mode of 3 beams combined with center powder feeding, 3 The beam light converges to form a flat-top light shape, the focus is on the copper surface, the powder feeding method is synchronous powder feeding, and the carrier gas is argon. The proces...

Embodiment 2

[0047] (1) Use spherical pure tungsten powder with a particle size of 15 microns, and dry it in an oven before cladding. The drying temperature is 200-250°C and the drying time is 1-2 hours.

[0048] (2) Grinding the surface of the pure copper workpiece with a grinder and sandpaper to remove the surface oxide layer; and cleaning the surface of the pure copper workpiece with absolute alcohol or acetone to obtain a pure copper workpiece with a clean surface.

[0049] (3) Prepare tungsten-copper cladding by passing pure tungsten powder through high-speed laser cladding equipment. The laser equipment adopts high-speed cladding fiber laser with a wavelength of 1080nm in continuous output mode. It adopts the light-encapsulated powder mode of 3 beams combined with center powder feeding, 3 The beam light converges to form a flat-top light shape, the focus is on the copper surface, the powder feeding method is synchronous powder feeding, and the carrier gas is argon. The process paramet...

Embodiment 3

[0055] (1) Use spherical pure tungsten powder with a particle size of 5 microns, and dry it in an oven before cladding. The drying temperature is 200-250°C and the drying time is 1-2 hours.

[0056] (2) Grinding the surface of the pure copper workpiece with a grinder and sandpaper to remove the surface oxide layer; and cleaning the surface of the pure copper workpiece with absolute alcohol or acetone to obtain a clean surface of the pure copper workpiece;

[0057] (3) Prepare tungsten-copper cladding by passing pure tungsten powder through high-speed laser cladding equipment. The laser equipment adopts high-speed cladding fiber laser with a wavelength of 1080nm in continuous output mode. It adopts the light-encapsulated powder mode of 3 beams combined with center powder feeding, 3 The beam light converges to form a flat-top light shape, the focus is on the copper surface, the powder feeding method is synchronous powder feeding, and the carrier gas is argon. The process paramete...

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Abstract

The invention discloses a preparation method of a high-speed laser cladding tungsten-copper composite material. A pure copper substrate and tungsten powder are used to form a tungsten-copper cladding layer on the surface of the copper substrate by a high-speed laser cladding method. The laser uses multiple beams of light to converge into a flat-top light mode. The tungsten powder is synchronously fed to the center of the cladding head to form a spatial combination of light-packed powder. After laser heating of the pure tungsten powder, laser cladding is performed on pure copper. The copper on the surface of the pure copper substrate The molten copper and tungsten powder provided after melting form a molten pool, and the induction coil placed under the copper substrate generates an induced magnetic field to fully electromagnetically stir the molten pool, and the tungsten-copper coating is obtained after cooling. The invention does not need to add copper powder, adopts single-feeding tungsten powder, utilizes the copper in the copper matrix to obtain the tungsten-copper cladding layer after direct laser cladding, and simplifies the process. Since the copper in the tungsten-copper cladding is formed by in-situ cladding on the pure copper substrate, the cladding and the substrate are an integral metallurgical bond without cracks, and the tungsten content in the cladding can be adjusted through process parameters to meet different requirements. Requirements for changes in tungsten and copper content required by working conditions.

Description

technical field [0001] The invention relates to the field of metal manufacturing, in particular to a method for preparing an alloy coating for high-speed laser cladding. Background technique [0002] Tungsten-copper alloy is a pseudo-alloy composed of tungsten and copper that neither dissolves nor forms intermetallic compounds. It is this combination that makes tungsten-copper alloy have many excellent properties of tungsten and copper at the same time. And under the action of high-temperature arc, copper evaporation will take away a lot of heat, cool the tungsten skeleton, and reduce the degree of electron emission. Tungsten-copper alloy has good breaking performance, especially suitable as contacts for high-voltage and ultra-high-voltage switching appliances. For tungsten copper contact materials, the relative content of tungsten and copper has a crucial influence on the performance of the material. Studies have shown that the hardness of tungsten-copper contact material...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C24/10H01H11/04
CPCC23C24/106H01H11/04
Inventor 王宏涛谢宏斌方攸同刘嘉斌
Owner ZHEJIANG UNIV