A temperature-sensitive adhesive resin plugging agent and its preparation method and application
A technology of temperature-sensitive adhesion type and plugging agent, which is applied in chemical instruments and methods, fibrous fillers, dyed organic silicon compound treatment, etc., can solve the problem of leakage plugging success rate of large cracks, low adhesion strength of resin materials, Problems such as low success rate of one-time plugging, to achieve the effects of not being affected by pressure fluctuations, enhancing the retention capacity, and having a wide range of density applications
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Embodiment 1
[0062] A temperature-sensitive adhesive resin plugging agent, comprising the following raw materials in parts by mass:
[0063] 88 parts of thermoplastic resin matrix, 12 parts of melting temperature regulator, 5 parts of organic lipid melting range regulator, 4 parts of modified solid-phase filled melting range regulator, and 30 parts of modified density regulator.
[0064] Wherein, the thermoplastic resin matrix is polyamide; the melting temperature regulator is phthalic acid; and the organic lipid melting range regulator is diisodecyl phthalate.
[0065] The modified solid-phase filled melting range modifier is modified calcium carbonate, which is prepared according to the following method:
[0066] Add 25g of dried calcium carbonate into 500mL of dichloromethane, and ultrasonically disperse for 30min to obtain suspension a; add 20mL of vinyltrimethoxysilane dropwise to suspension a for 30min, and ultrasonically disperse for 10min to obtain Suspension b was left to react...
Embodiment 2
[0080] A temperature-sensitive adhesive resin plugging agent, comprising the following raw materials in parts by mass:
[0081] 85 parts of thermoplastic resin matrix, 12 parts of melting temperature regulator, 4 parts of organic lipid melting range regulator, 3 parts of modified solid-phase filled melting range regulator, and 30 parts of modified density regulator.
[0082] Wherein, the thermoplastic resin matrix is polystyrene; the melting temperature regulator is a combination of phthalic acid and 3-phenylpropionic acid, wherein the mass ratio of phthalic acid and 3-phenylpropionic acid is 1:2; the organic lipid melting range modifier is dibutyl phthalate;
[0083] The modified solid-phase filled melting range modifier is modified zeolite powder, and its preparation method is the same as that of modified calcium carbonate in Example 1, except that calcium carbonate is replaced by zeolite powder.
[0084] The modified density regulator is modified barite, and its preparat...
Embodiment 3
[0088] A temperature-sensitive adhesive resin plugging agent, comprising the following raw materials in parts by mass:
[0089] 80 parts of thermoplastic resin matrix, 10 parts of melting temperature regulator, 5 parts of organic lipid melting range regulator, 3 parts of modified solid-phase filling type melting range regulator, and 20 parts of modified density regulator.
[0090] Wherein, the thermoplastic resin matrix is a combination of low-density polyethylene and high-density polyethylene, wherein the mass ratio of the low-density polyethylene to high-density polyethylene is 1:1; the melting temperature regulator is Phthalic acid; the organic lipid melting range modifier is dioctyl phthalate;
[0091] The modified solid-phase filled melting range regulator is modified silica, and its preparation method is the same as that of modified calcium carbonate in Example 1, except that calcium carbonate is replaced by silicon dioxide.
[0092] The modified density regulator is ...
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