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Terahertz metamaterial wave absorber manufacturing method based on micro-nano 3D printing

A 3D printing and manufacturing method technology, applied in the field of terahertz metamaterials, can solve the problems of cumbersome manufacturing process, large manufacturing size, and long manufacturing time, and achieve the effects of improving sensitivity, increasing limits, and economical manufacturing

Active Publication Date: 2021-07-30
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Through this process method, metamaterials whose working frequency band is close to the terahertz frequency band can be manufactured, but the terahertz frequency has not been fully reached. The process steps of dipping conductive glue and using metal etchant to corrode excess metal not only make the overall manufacturing process cumbersome but also Unable to solve micron-scale manipulation of terahertz metamaterials
[0006] The existing technology has common problems such as many process steps, long manufacturing time, high manufacturing cost, and difficulty in processing three-dimensional structures.
In addition, there are also problems such as the minimum manufacturing size is too large, the manufacturing accuracy is low, and the metallization process of the resin model is too macroscopic to be implemented at the micron scale, so the manufacture of terahertz metamaterials cannot be completed.

Method used

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  • Terahertz metamaterial wave absorber manufacturing method based on micro-nano 3D printing
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  • Terahertz metamaterial wave absorber manufacturing method based on micro-nano 3D printing

Examples

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Embodiment 1

[0064] In order to better illustrate the characteristics of the present invention, a specific example 1 is given: a typical cross-shaped metamaterial absorber is selected as the verification object of the proposed terahertz metamaterial absorber manufacturing method. The structure of the absorber and the specific geometric parameters such as Figure 7 shown. The cross-shaped length l=112 μm, width b=25 μm, height h=25 μm, period p=280 μm.

[0065] Embodiment 1 manufacturing step 1: apply the UGNX three-dimensional modeling software to complete the modeling of the cross model, such as Figure 8 .

[0066] Embodiment 1 Manufacturing Step 2: Use a high-precision micro-stereoscopic projection micro-nano 3D printer to directly print the cross-shaped metamaterial periodic array modeled in Step 1 on the copper sheet, such as Figure 9 shown.

[0067] Manufacturing Step 3 of Example 1: Use an electron beam evaporation coating machine to deposit a gold layer with a thickness of 200...

Embodiment 2

[0069] In order to further illustrate the characteristics, advantages and effectiveness of the present invention, a specific embodiment 2 is given: a broadband absorber composed of a basic cross-shaped structure, and the structural unit of the absorber is as follows Figure 12 shown. The broadband absorber unit structure consists of four cross units of different sizes. The cross lengths are 11=130 μm, 12=140 μm, 13=150 μm, 14=160 μm, width b=25 μm, height h=25 μm, period p=390 μm.

[0070] The manufacturing process of the second embodiment is the same as that of the first embodiment, so it will not be repeated.

[0071] Discussion on the results of Example 2: THz-TDS and SEM were also used to perform electromagnetic and morphological characterization of the terahertz broadband absorber manufactured according to the method proposed in the present invention. Figure 13(a) to Figure 13(b) To characterize the result. Figure 13(a) shows the absorption curve (solid line) of the c...

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Abstract

The invention discloses a terahertz metamaterial wave absorber manufacturing method based on micro-nano 3D printing, and the method comprises the steps: carrying out the three-dimensional modeling of a terahertz metamaterial wave absorber to form a three-dimensional model which comprises a plurality of metamaterial structure units; slicing the three-dimensional model, and carrying out the micro-nano 3D printing on a first metal layer to form a three-dimensional structure; and depositing a second metal layer with a predetermined thickness on the top surface of the three-dimensional structure based on a directional deposition process.

Description

technical field [0001] The invention relates to the technical field of terahertz metamaterials, in particular to a method for manufacturing a terahertz metamaterial wave absorber based on micro-nano 3D printing. Background technique [0002] At present, metamaterials in the terahertz band are limited by their sub-wavelength characteristic sizes (tens to hundreds of microns), and the manufacturing methods mainly rely on traditional micro-nano manufacturing, and the characteristic structures of metamaterials are manufactured and designed through lithography and other processes. [0003] Traditional stereolithography (SL) needs to use multiple photolithography processes when processing three-dimensional space structures, that is, the process of multiple glue coating, exposure, and stripping, as well as electron beam lithography, ion beam etching, Auxiliary processes such as ion implantation may be several times more complicated than two-dimensional structures. Although the mic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q17/00
CPCH01Q17/00Y02P10/25
Inventor 张留洋李胜男陈雪峰王中兴徐亚飞沈忠磊韩东海
Owner XI AN JIAOTONG UNIV