Copper foil as well as preparation method and application thereof

A technology of copper foil and rough surface, applied in the field of electronic materials, can solve problems such as difficult to meet peel strength and signal loss at the same time, achieve the effect of improving peel strength, avoiding short circuit phenomenon, and reducing burrs

Active Publication Date: 2021-08-10
JIANGXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a copper foil and its preparation method and application in order to overcome t

Method used

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  • Copper foil as well as preparation method and application thereof
  • Copper foil as well as preparation method and application thereof
  • Copper foil as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0030] The second aspect of the invention provides a method of preparing a copper foil product, wherein the method comprises the following steps:

[0031] (1) The first surface treatment was performed in the primary treatment liquid to obtain a copper foil at a time treatment liquid, and the primary treatment liquid comprising copper ions 2-. of the total amount of the primary treatment liquid. 40g / L, 50-300 g / L of sulfuric acid, bismuth sulfate 30-400 ppm, sodium tungstate 5-250 ppm, rare earth salt 20-400 ppm;

[0032] (2) The primary treatment copper foil is subjected to a second surface treatment in the secondary treatment solution to obtain a copper foil product; wherein the secondary processing liquid is obtained based on the total amount of the secondary treatment liquid. Copper ions 20-80 g / l, 50-200 g / l, chloride ions 50-400 ppm.

[0033] In step (1),

[0034] In a preferred embodiment, the raw material copper foil has a thickness of from 12 to 70 μm, preferably f...

Example Embodiment

[0056] Example 1

[0057] (1) The copper foil having a thickness of 18 μm is placed in a primary treatment liquid for the first surface treatment to obtain a copper foil at a time; wherein the copper ion is provided by copper sulfate, copper ions in one treatment liquid. The concentration of 10 g / L, the concentration of sulfuric acid was 100 g / L, the concentration of sulfate was 100 ppm, the concentration of sodium tungstate was 50 ppm, and the concentration of sulfate was 100 ppm; the first surface treatment conditions included: first time Surface treatment limit current density is 25A / DM 2 The treatment temperature of the first surface treatment is 20 ° C, and the processing time of the first surface treatment is 3 s;

[0058] (2) The above-described primary treatment copper foil is subjected to a second surface treatment in the secondary treatment liquid to obtain a copper foil product having a rice granulated tumor point surface; wherein the copper ions in the secondary ...

Example Embodiment

[0059] Example 2

[0060] (1) The copper foil having a thickness of 18 μm is placed in a primary treatment liquid for the first surface treatment to obtain a copper foil at a time; wherein the copper ion is provided by copper sulfate, copper ions in one treatment liquid. The concentration of 15 g / L, the concentration of sulfuric acid was 120 g / L, the concentration of sulfate was 150 ppm, the concentration of sodium tungstate was 20 ppm, and the concentration of the lastium sulfate was 150 ppm; the first surface treatment conditions included: first time Surface treatment limit current density is 20A / DM 2 The processing temperature of the first surface treatment is 15 ° C, the treatment time of the first surface treatment is 2s;

[0061] (2) The above-described primary treatment copper foil is subjected to a second surface treatment in the secondary treatment liquid to obtain a copper foil product having a rice granulated tumor point surface; wherein the copper ions in the sec...

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Abstract

The invention relates to the technical field of electronic materials, and discloses a copper foil as well as a preparation method and application thereof. The copper foil comprises at least one rough surface with rice-grain-shaped tumor points, wherein the ratio of the long axis size to the short axis size of the rice-grain-shaped tumor points is larger than or equal to 1.7, the surface roughness value Rz of the rough surface of the copper foil is larger than or equal to 2 [mu]m, the surface roughness value Ra of the rough surface of the copper foil is smaller than or equal to 0.4 [mu]m, and the peel strength between the rough surface of the copper foil and thermosetting resin is larger than or equal to 0.8 N/mm. The rice-grain-shaped tumor points on the surface of the copper foil are vertically, uniformly, tightly and regularly arranged on the surface of the copper foil, the rice-grain-shaped tumor points can enhance the peeling strength of the copper foil in the form of constructing 'anchor points', meanwhile, the roughness value of the copper foil can be reduced, high-frequency transmission signal loss caused by the 'skin effect' is reduced, and the wiring requirement of fine printed circuits and the transmission requirement of high-frequency and high-speed copper foil printed circuits of more than 10 GHz can be met.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a copper foil and its preparation method and application. Background technique [0002] With the rapid development of current electronic information, the market has higher and higher requirements on the performance of high-frequency and high-speed copper foil, which is the raw material of PCB conductor used in electronic communication. In order to improve the peel strength of the PCB and prevent the copper foil from falling off, the surface profile of the copper foil needs to have a certain roughness value. However, the rough surface of copper foil is easy to cause signal loss or even distortion. Such dual requirements increase the difficulty of producing high-frequency and high-speed copper foil. [0003] At present, the surface of the high-frequency high-speed copper foil on the market is generally spherical after treatment, and there is also the problem of repea...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38C25D7/06H05K1/02H05K3/02
CPCC25D1/04C25D3/38C25D7/0614H05K3/025H05K1/02
Inventor 唐云志樊小伟孙贞谭育慧
Owner JIANGXI UNIV OF SCI & TECH
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