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Copper foil as well as preparation method and application thereof

A technology of copper foil and rough surface, applied in the field of electronic materials, can solve problems such as difficult to meet peel strength and signal loss at the same time, achieve the effect of improving peel strength, avoiding short circuit phenomenon, and reducing burrs

Active Publication Date: 2021-08-10
JIANGXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a copper foil and its preparation method and application in order to overcome the problem that the existing high-frequency high-speed copper foil is difficult to meet the peel strength and signal loss at the same time

Method used

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  • Copper foil as well as preparation method and application thereof
  • Copper foil as well as preparation method and application thereof
  • Copper foil as well as preparation method and application thereof

Examples

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preparation example Construction

[0030] The second aspect of the present invention provides a method for preparing a copper foil product, wherein the method includes the following steps:

[0031] (1) The raw copper foil is subjected to the first surface treatment in the primary treatment solution to obtain the primary treatment copper foil; wherein, based on the total amount of the primary treatment solution, the primary treatment solution includes copper ions 2- 40g / L, sulfuric acid 50-300g / L, bismuth sulfate 30-400ppm, sodium tungstate 5-250ppm, rare earth salt 20-400ppm;

[0032] (2) Perform a second surface treatment on the primary treated copper foil in the secondary treatment and dosing to obtain a copper foil product; wherein, based on the total amount of the second treatment and dosing, the second treatment and dosing Including copper ion 20-80g / L, sulfuric acid 50-200g / L, chloride ion 50-400ppm.

[0033] In step (1),

[0034] In a preferred embodiment, the raw copper foil has a thickness of 12-70 μ...

Embodiment 1

[0057] (1) Put the raw copper foil with a thickness of 18 μm in the primary treatment solution for the first surface treatment to obtain the primary treatment copper foil; wherein, the copper ions in the primary treatment solution are provided by copper sulfate pentahydrate, and the amount of copper ions Concentration is 10g / L, and the concentration of sulfuric acid is 100g / L, and the concentration of bismuth sulfate is 100ppm, and the concentration of sodium tungstate is 50ppm, and the concentration of terbium sulfate is 100ppm; The condition of described surface treatment for the first time comprises: The limiting current density of surface treatment is 25A / dm 2 , the treatment temperature for the first surface treatment is 20°C, and the treatment time for the first surface treatment is 3s;

[0058] (2) The above-mentioned primary treatment copper foil is subjected to a second surface treatment in the secondary treatment dosing solution to obtain a copper foil product with r...

Embodiment 2

[0060] (1) Put the raw copper foil with a thickness of 18 μm in the primary treatment solution for the first surface treatment to obtain the primary treatment copper foil; wherein, the copper ions in the primary treatment solution are provided by copper sulfate pentahydrate, and the amount of copper ions Concentration is 15g / L, and the concentration of sulfuric acid is 120g / L, and the concentration of bismuth sulfate is 150ppm, and the concentration of sodium tungstate is 20ppm, and the concentration of lanthanum sulfate is 150ppm; The condition of described surface treatment for the first time comprises: The limiting current density of surface treatment is 20A / dm 2 , the treatment temperature for the first surface treatment is 15°C, and the treatment time for the first surface treatment is 2s;

[0061] (2) The above-mentioned primary treatment copper foil is subjected to a second surface treatment in the secondary treatment dosing solution to obtain a copper foil product with...

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Abstract

The invention relates to the technical field of electronic materials, and discloses a copper foil as well as a preparation method and application thereof. The copper foil comprises at least one rough surface with rice-grain-shaped tumor points, wherein the ratio of the long axis size to the short axis size of the rice-grain-shaped tumor points is larger than or equal to 1.7, the surface roughness value Rz of the rough surface of the copper foil is larger than or equal to 2 [mu]m, the surface roughness value Ra of the rough surface of the copper foil is smaller than or equal to 0.4 [mu]m, and the peel strength between the rough surface of the copper foil and thermosetting resin is larger than or equal to 0.8 N / mm. The rice-grain-shaped tumor points on the surface of the copper foil are vertically, uniformly, tightly and regularly arranged on the surface of the copper foil, the rice-grain-shaped tumor points can enhance the peeling strength of the copper foil in the form of constructing 'anchor points', meanwhile, the roughness value of the copper foil can be reduced, high-frequency transmission signal loss caused by the 'skin effect' is reduced, and the wiring requirement of fine printed circuits and the transmission requirement of high-frequency and high-speed copper foil printed circuits of more than 10 GHz can be met.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a copper foil and its preparation method and application. Background technique [0002] With the rapid development of current electronic information, the market has higher and higher requirements on the performance of high-frequency and high-speed copper foil, which is the raw material of PCB conductor used in electronic communication. In order to improve the peel strength of the PCB and prevent the copper foil from falling off, the surface profile of the copper foil needs to have a certain roughness value. However, the rough surface of copper foil is easy to cause signal loss or even distortion. Such dual requirements increase the difficulty of producing high-frequency and high-speed copper foil. [0003] At present, the surface of the high-frequency high-speed copper foil on the market is generally spherical after treatment, and there is also the problem of repea...

Claims

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Application Information

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IPC IPC(8): C25D1/04C25D3/38C25D7/06H05K1/02H05K3/02
CPCC25D1/04C25D3/38C25D7/0614H05K3/025H05K1/02
Inventor 唐云志樊小伟孙贞谭育慧
Owner JIANGXI UNIV OF SCI & TECH
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