Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof

An epoxy resin curing technology at room temperature, which is applied in the direction of epoxy resin adhesives, adhesives, adhesive additives, etc., can solve problems such as limited use conditions, and achieve fast reaction speed, accelerated curing and toughening, and high curing strength. Effect

Active Publication Date: 2021-09-03
WUHAN UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]At present, the synthesis and curing reaction temperature of the existing epoxy resin glass polymer is relatively high, and the plasticity and reconstruction of the crosslinked network after molding are realized by heating at high temperatu

Method used

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  • Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof
  • Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof
  • Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof

Examples

Experimental program
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Example Embodiment

[0055] Example 1:

[0056] Method for preparing an epoxy resin group Vitrimer adhesive, which includes the following steps:

[0057] 1) Preparation of a component epoxy resin:

[0058] 1 Composition of each raw material and the number of weights: 100 parts of the bisphenol A epoxy resin, 5 parts of the bisphenol F, 5 parts of the active diluent, 0.5 parts of endocyclic oxycitrid nitrile rubber; Bisphenol A-type epoxy resin E-51, bisphenol F-type epoxy resin NPEF-170, active diluent polypropylene glycol dihydrate glycidyl ether, endocyclic oxycitride nitrile rubber epoxy functional degree of 2.0, viscosity is less than 500000 cps, Acrylonitrile content of 23 to 25% by weight;

[0059] 2 The bisphenol A epoxy resin and the endocyclic oxyfluid nitrile rubber are poured into the stirring tank to form a mixed liquid after stirring to 50-60 ° C for 25 to 30 minutes, and the stirring speed is controlled at 100R / MIN ~ 400R / min within the range;

[0060] 3 The bisphenol F-type epoxy re...

Example Embodiment

[0071] Example 2:

[0072] Method for preparing an epoxy resin group Vitrimer adhesive, which includes the following steps:

[0073] 1) Preparation of a component epoxy resin:

[0074] 1 Composition of each of the raw materials is: 100 parts of the bisphenol A type epoxy resin, 15 parts of the bisphenol F, 20 parts of the active diluent, 20 parts of the endocyclic oxycitrid nitrile rubber; Bisphenol A-type epoxy resin E-54, bisphenol F-type epoxy resin NPEF-164X, active diluent octylglycidyl ether, endocyclic oxycitrid nitrile rubber epoxy functional degree of 2.0, viscosity is less than 500000 cps, propylene Nitrile content 23 ~ 25 wt%;

[0075] 2 The bisphenol A epoxy resin and the endocyclic oxyfluid nitrile rubber are poured into the stirring tank to form a mixed liquid after stirring to 50-60 ° C for 25 to 30 minutes, and the stirring speed is controlled at 100R / MIN ~ 400R / min within the range;

[0076] 3 The bisphenol F-type epoxy resin was referred to by weight, and the...

Example Embodiment

[0087] Example 3:

[0088] Method for preparing an epoxy resin group Vitrimer adhesive, which includes the following steps:

[0089] 1) Preparation of a component epoxy resin:

[0090] 1 Composition and weight of the raw materials are: 100 parts of the bisphenol A type epoxy resin, 10 parts of the bisphenol F, 12.5 parts of the active diluent, 10 parts of endocyclic oxycitrid nitrile rubber; Bisphenol A-type epoxy resin (E-54: E-51 = 1: 1 mixture), bisphenol F epoxy resin NPEF-170, active diluent 1,4-butanediol dihydrate glycerol ether, end ring The oxyfluid nitrile rubber epoxy function is 2.0, the viscosity is less than 500,000 cps, and the acrylonitrile content is 23 to 25% by weight;

[0091] 2 The bisphenol A epoxy resin and the endocyclic oxyfluid nitrile rubber are poured into the stirring tank to form a mixed liquid after stirring to 50-60 ° C for 25 to 30 minutes, and the stirring speed is controlled at 100R / MIN ~ 400R / min within the range;

[0092] 3 The bisphenol F-...

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Abstract

The invention discloses a normal-temperature curing epoxy resin-based vitrimer adhesive, which is prepared by mixing a component A epoxy resin and a component B epoxy curing agent according to a weight ratio of 1:(0.80-1.20), the component A comprises the following components in parts by weight: 100 parts of bisphenol A type epoxy resin, 5-15 parts of bisphenol F type epoxy resin, 5-20 parts of a reactive diluent and 0.5-20 parts of epoxy-terminated liquid nitrile rubber, the component B comprises the following components in parts by weight: 55-70 parts of an amine curing agent, 15-30 parts of a toughening agent and 15-25 parts of a curing accelerator, the amine curing agent is a mixture of a long-chain aliphatic amine curing agent, an alicyclic amine curing agent and a polyether amine curing agent, and the toughening agentis amino-terminated, carboxyl-terminated or hydroxyl-terminated liquid nitrile rubber or any mixture thereof. The adhesive provided by the invention has the characteristics of high bonding strength, large tensile fracture elongation, small elastic modulus, good low-temperature flexibility and strong impact resistance, can be repeatedly fused within the temperature range of 80-200 DEG C, is high in plasticity and good in weldability, and has a shape memory function.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a room temperature curing epoxy resin-based vitrimer adhesive and a preparation method thereof. Background technique [0002] Epoxy adhesives have excellent mechanical properties, bonding properties, thermal stability and waterproof and anti-corrosion properties after curing, so they are widely used in coatings, structural bonding, waterproof and anti-corrosion and other fields. As a typical thermosetting material, epoxy adhesives form a stable three-dimensional network structure after reaction and curing. They are insoluble and infusible, making it impossible to reshape and weld after molding, and difficult to repair and recycle after damage. [0003] The thermosetting properties of epoxy adhesives make them non-thermoplastic due to chemical cross-linking. Therefore, how to make epoxy thermosetting materials thermoplastic and achieve cross-linked polymers w...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J115/00C09J11/08C08G59/50C08G59/68
CPCC09J163/00C09J11/08C08G59/5013C08G59/5026C08G59/504C08G59/68C08L2205/035C08L2205/025C08L63/00C08L15/00
Inventor 磨炼同史乐肖月
Owner WUHAN UNIV OF TECH
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