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Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof

An epoxy resin curing technology at room temperature, which is applied in the direction of epoxy resin adhesives, adhesives, adhesive additives, etc., can solve problems such as limited use conditions, and achieve fast reaction speed, accelerated curing and toughening, and high curing strength. Effect

Active Publication Date: 2021-09-03
WUHAN UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004]At present, the synthesis and curing reaction temperature of the existing epoxy resin glass polymer is relatively high, and the plasticity and reconstruction of the crosslinked network after molding are realized by heating at high temperature. The use conditions are limited, and it is necessary to develop thermoplastic-thermosetting intermediate materials that can be cured at room temperature and can be reshaped many times at lower temperatures, welded and bonded, and shape memory

Method used

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  • Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof
  • Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof
  • Normal-temperature curing epoxy resin-based vitrimer adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0056] The preparation method of normal temperature curing epoxy resin base vitrimer adhesive, it comprises the steps:

[0057] 1) Prepare A component epoxy resin:

[0058] ①According to the composition and parts by weight of each raw material: 100 parts of bisphenol A epoxy resin, 5 parts of bisphenol F epoxy resin, 5 parts of reactive diluent, 0.5 part of epoxy-terminated liquid nitrile rubber; Bisphenol A type epoxy resin E-51, bisphenol F type epoxy resin NPEF-170, reactive diluent polypropylene glycol diglycidyl ether, epoxy-terminated liquid nitrile rubber epoxy functionality 2.0, viscosity less than 500000cps, Acrylonitrile content 23~25wt%;

[0059] ② Weigh bisphenol A epoxy resin and epoxy-terminated liquid nitrile rubber in parts by weight, pour it into a mixing tank, heat to 50-60°C and stir for 25-30 minutes to form a mixed solution. The stirring speed is controlled at 100r / In the range of min~400r / min;

[0060] ③ Weigh bisphenol F epoxy resin and reactive dilu...

Embodiment 2

[0072] The preparation method of normal temperature curing epoxy resin base vitrimer adhesive, it comprises the steps:

[0073] 1) Prepare A component epoxy resin:

[0074] ①According to the composition of each raw material and its parts by weight: 100 parts of bisphenol A type epoxy resin, 15 parts of bisphenol F type epoxy resin, 20 parts of reactive diluent, 20 parts of epoxy-terminated liquid nitrile rubber; Bisphenol A type epoxy resin E-54, bisphenol F type epoxy resin NPEF-164X, reactive diluent octyl glycidyl ether, epoxy-terminated liquid nitrile rubber epoxy functionality 2.0, viscosity less than 500000cps, propylene Nitrile content 23~25wt%;

[0075] ② Weigh bisphenol A epoxy resin and epoxy-terminated liquid nitrile rubber in parts by weight, pour it into a mixing tank, heat to 50-60°C and stir for 25-30 minutes to form a mixed solution. The stirring speed is controlled at 100r / In the range of min~400r / min;

[0076] ③ Weigh bisphenol F epoxy resin and reactive ...

Embodiment 3

[0088] The preparation method of normal temperature curing epoxy resin base vitrimer adhesive, it comprises the steps:

[0089] 1) Prepare A component epoxy resin:

[0090] ①According to the composition and parts by weight of each raw material: 100 parts of bisphenol A epoxy resin, 10 parts of bisphenol F epoxy resin, 12.5 parts of reactive diluent, 10 parts of epoxy-terminated liquid nitrile rubber; Bisphenol A type epoxy resin (E-54:E-51 = 1:1 mixture), bisphenol F type epoxy resin NPEF-170, reactive diluent 1,4-butanediol diglycidyl ether, terminal ring The oxygen-based liquid nitrile rubber has an epoxy functionality of 2.0, a viscosity of less than 500,000 cps, and an acrylonitrile content of 23-25 ​​wt %;

[0091] ② Weigh bisphenol A epoxy resin and epoxy-terminated liquid nitrile rubber in parts by weight, pour it into a mixing tank, heat to 50-60°C and stir for 25-30 minutes to form a mixed solution. The stirring speed is controlled at 100r / In the range of min~400r / ...

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Abstract

The invention discloses a normal-temperature curing epoxy resin-based vitrimer adhesive, which is prepared by mixing a component A epoxy resin and a component B epoxy curing agent according to a weight ratio of 1:(0.80-1.20), the component A comprises the following components in parts by weight: 100 parts of bisphenol A type epoxy resin, 5-15 parts of bisphenol F type epoxy resin, 5-20 parts of a reactive diluent and 0.5-20 parts of epoxy-terminated liquid nitrile rubber, the component B comprises the following components in parts by weight: 55-70 parts of an amine curing agent, 15-30 parts of a toughening agent and 15-25 parts of a curing accelerator, the amine curing agent is a mixture of a long-chain aliphatic amine curing agent, an alicyclic amine curing agent and a polyether amine curing agent, and the toughening agentis amino-terminated, carboxyl-terminated or hydroxyl-terminated liquid nitrile rubber or any mixture thereof. The adhesive provided by the invention has the characteristics of high bonding strength, large tensile fracture elongation, small elastic modulus, good low-temperature flexibility and strong impact resistance, can be repeatedly fused within the temperature range of 80-200 DEG C, is high in plasticity and good in weldability, and has a shape memory function.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a room temperature curing epoxy resin-based vitrimer adhesive and a preparation method thereof. Background technique [0002] Epoxy adhesives have excellent mechanical properties, bonding properties, thermal stability and waterproof and anti-corrosion properties after curing, so they are widely used in coatings, structural bonding, waterproof and anti-corrosion and other fields. As a typical thermosetting material, epoxy adhesives form a stable three-dimensional network structure after reaction and curing. They are insoluble and infusible, making it impossible to reshape and weld after molding, and difficult to repair and recycle after damage. [0003] The thermosetting properties of epoxy adhesives make them non-thermoplastic due to chemical cross-linking. Therefore, how to make epoxy thermosetting materials thermoplastic and achieve cross-linked polymers w...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J115/00C09J11/08C08G59/50C08G59/68
CPCC09J163/00C09J11/08C08G59/5013C08G59/5026C08G59/504C08G59/68C08L2205/035C08L2205/025C08L63/00C08L15/00
Inventor 磨炼同史乐肖月
Owner WUHAN UNIV OF TECH
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