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Photocuring hot melt adhesive for base material difficult to attach and preparation method of photo-curing hot melt adhesive

A light-curing and base-attaching technology, used in adhesives, adhesive additives, polymer adhesive additives, etc., can solve problems such as cumbersome processes, achieve good adhesion, and avoid the effects of different compatibility

Active Publication Date: 2021-09-03
深圳市东升塑胶制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, for plastic substrates without any polar groups on the surface or weakly polar plastic substrates such as PP substrates, surface treatment is usually required to increase the surface polarity before bonding, and the process is relatively cumbersome.

Method used

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  • Photocuring hot melt adhesive for base material difficult to attach and preparation method of photo-curing hot melt adhesive
  • Photocuring hot melt adhesive for base material difficult to attach and preparation method of photo-curing hot melt adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] 1. Add 110 parts of neopentyl glycol and 180 parts of isophthalic acid into the reaction bottle that has been dehydrated and deoxygenated, raise the temperature to 155°C, stir evenly, keep it warm for 2 hours, then add 9 parts of ethyl butyl propylene glycol, and heat up to Continue to keep warm at 180°C for 2 hours to obtain thermoplastic polyester R1.

[0027] 2. Add 16 parts of butanediol and 20 parts of sebacic acid into the reaction flask that has been dehydrated and deoxygenated, mix evenly, raise the temperature to 150° C., and keep it warm for 2 hours to obtain aliphatic polyester Z1.

[0028] 3. Add thermoplastic polyester R1 to aliphatic polyester Z1 and mix evenly, heat up to 210°C, keep warm for 1 hour, add tetrabutyl titanate, antimony trioxide, antioxidant 1010, continue to heat up to 240°C, pass Nitrogen, add xylene to reflux to remove water, keep warm until the acid value is less than 0.1mgKOH / g, to obtain block copolyester.

[0029] 4. After cooling th...

Embodiment 2

[0032] 1. Add 60 parts of ethylene glycol, 9 parts of hydrogenated bisphenol A and 171 parts of isophthalic acid into the reaction bottle that has been dehydrated and deoxygenated, raise the temperature to 155°C, stir evenly, keep it warm for 2 hours, and then add 12 parts of ethyl alcohol butyl propylene glycol, heated to 180°C and continued to keep warm for 2 hours to obtain thermoplastic polyester R2.

[0033] 2. Add 7 parts of PCL1000 and 1 part of adipic acid into the reaction flask that has been dehydrated and deoxygenated, mix well, raise the temperature to 150°C, and keep it warm for 2 hours to obtain aliphatic polyester Z2.

[0034] 3. Add thermoplastic polyester R2 to aliphatic polyester Z2, mix well, heat up to 210°C, keep warm for 1 hour, add tetrabutyl titanate, antimony trioxide, antioxidant 1010, continue to heat up to 240°C, pass Inject nitrogen, add xylene to reflux to remove water, keep warm until the acid value is less than 0.1mgKOH / g, and discharge.

[003...

Embodiment 3

[0044] The photocurable hot melt adhesives obtained in Example 1 and Example 2 and Comparative Example 1-Comparative Example 3 for difficult-to-adhere substrates were tested for performance, and the test results are shown in Table 1.

[0045] Sample preparation method: apply glue on the untreated PP substrate bonding sample at 120°C, irradiate the glue layer with a UV-LED light source with a wavelength of 365nm, and the irradiation dose is 3000mJ / cm 2 , and then attach another adhesive sample to the adhesive layer, and hold the pressure for 30s at room temperature.

[0046] Table 1

[0047]

[0048]

[0049] It can be seen from Table 1 that the light-curable hot melt adhesive for difficult-to-adhesive substrates prepared by Examples 1 and 2 of the present invention has better performance for untreated PP, PET, ABS and other difficult-to-adhesive substrates. Excellent adhesive performance, when the strength is peeled off, it can achieve the effect of breaking the materia...

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Abstract

The invention belongs to the technical field of high-molecular polymerization, and particularly relates to a photocuring hot melt adhesive for a base material difficult to attach and a preparation method of the photocuring hot melt adhesive. The photocuring hot melt adhesive comprises 90-95 parts of a block copolymer, 2-5 parts of a photoinitiator and 2-5 parts of styrene modified tackifying resin, the block copolymer is obtained by carrying out a reaction on polyester-polyester block copolyester and a diisocyanate-acrylic ester hydroxyl ester semi-addition product; the polyester-polyester block copolyester takes thermoplastic polyester as a hard segment and aliphatic polyester as a soft segment, the mass ratio of the content of the soft segment to the content of the hard segment is (3-12): 100, and the hydroxyl value of the block copolyester is 20-60mgKOH / g; the diisocyanate-acrylic ester hydroxyl ester semi-adduct product is obtained by carrying out a reaction on norbornane dimethylene isocyanate and acrylic acid hydroxyl ester. And the adhesive has good adhesion and heat and humidity resistance when applied to untreated non-polar or weak-polar difficult-to-attach base materials.

Description

technical field [0001] The invention belongs to the technical field of polymer polymerization, and more specifically relates to a light-curable hot melt adhesive for difficult-to-attach substrates and a preparation method thereof. Background technique [0002] In recent years, adhesives have been widely used in various fields. Due to the diversification of usage purposes, people need to prepare adhesives that meet various requirements. For example, the adhesion to various plastic substrates such as PET, PP, and ABS, the adhesion to metals such as copper, iron, aluminum, and stainless steel, and the adhesion to inorganic substances such as glass, quartz, and ceramics. At present, for plastic substrates without any polar groups on the surface or weakly polar plastic substrates such as PP substrates, it is usually necessary to perform surface treatment to increase the surface polarity before bonding, and the process is relatively cumbersome. Contents of the invention [0003...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J187/00C09J11/08C08G81/00
CPCC09J187/005C09J11/08C08G81/00C08L45/00
Inventor 王栋
Owner 深圳市东升塑胶制品有限公司