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Temperature sensor element

A temperature sensor and component technology, applied in thermometers, electrical components, resistors with negative temperature coefficients, etc., can solve the problems of thermistor hardness

Pending Publication Date: 2021-09-21
SUMITOMO CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since an inorganic semiconductor thermistor is hard, it is generally difficult to make a temperature sensor element using the inorganic semiconductor thermistor flexible.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0175] (Manufacturing Example 1: Preparation of dedoped polyaniline)

[0176] The dedoped polyaniline is prepared by preparing hydrochloric acid-doped polyaniline and dedoping it as shown in the following [1] and [2].

[0177] [1] Preparation of polyaniline doped with hydrochloric acid

[0178] 5.18 g of aniline hydrochloride (manufactured by Kanto Chemical Co., Ltd.) was dissolved in 50 mL of water to prepare a first aqueous solution. Separately, 11.42 g of ammonium persulfate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) was dissolved in 50 mL of water to prepare a second aqueous solution.

[0179] Next, the first aqueous solution was stirred at 400 rpm for 10 minutes using a magnetic stirrer while the temperature of the first aqueous solution was adjusted to 35° C., and then the second solution was added dropwise to the first aqueous solution at a rate of 5.3 mL / min while stirring at the same temperature. aqueous solution. After the dropwise addition, th...

manufacture example 2

[0186] (Manufacturing example 2: Preparation of matrix resin 1)

[0187] According to the description of Example 1 of International Publication No. 2017 / 179367, 2,2'-bis(trifluoromethyl)benzidine (TFMB) represented by the following formula (3) was used as diamine, and tetracarboxylic 4,4'-(1,1,1,3,3,3-hexafluoropropane-2,2-diyl)diphthalic dianhydride (6FDA) represented by the following formula (4) of acid dianhydride ) to produce a polyimide powder having a repeating unit represented by the following formula (5).

[0188] The said powder was dissolved in propylene glycol 1-monomethyl ether 2-acetate so that the density|concentration might become 8 mass %, and the polyimide solution (1) was prepared. In the following examples, the polyimide solution (1) was used as the matrix resin 1 .

[0189]

manufacture example 3

[0190] (Manufacturing example 3: Preparation of matrix resin 2)

[0191] According to Example 5 of Japanese Patent Application Laid-Open No. 2018-119132, under a nitrogen atmosphere, 52 g (162.38 mmol) of TFMB represented by the above formula (3) and dimethylacetamide ( DMAc) 884.53 g, TFMB was dissolved in DMAc while stirring at room temperature.

[0192] Next, 17.22 g (38.79 mmol) of 6FDA represented by the above formula (4) was added to the flask, and stirred at room temperature for 3 hours.

[0193] Then, 4.80 g (16.26 mmol) of 4,4'-oxybis(benzoyl chloride) [OBBC] represented by the following formula (6) was added to the flask, followed by 19.81 g of terephthaloyl chloride (TPC) (97.57 mmol) was added to the flask and stirred at room temperature for 1 hour.

[0194] Next, 8.73 g (110.42 mmol) of pyridine and 19.92 g (195.15 mmol) of acetic anhydride were added to the flask, and after stirring at room temperature for 30 minutes, the temperature was raised to 70° C. using ...

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Abstract

Provided is a temperature sensor element including a pair of electrodes and a temperature sensing film disposed so as to be in contact with the pair of electrodes. The temperature sensing film contains a matrix resin and a plurality of electroconductive domains included within the matrix resin. The matrix resin constituting the temperature sensing film has a molecular packing degree of 40% or higher as determined on the basis of X-ray diffraction method measurements and according to formula (I): molecular packing degree (%) = 100*(surface area of a peak originating from an ordered structure) / (total surface area from all the peaks).

Description

technical field [0001] The invention relates to a temperature sensor element. Background technique [0002] A thermistor-type temperature sensor element including a temperature-sensitive film whose resistance value changes with temperature changes is conventionally known. Conventionally, inorganic semiconductor thermistors have been used as temperature sensitive films of thermistor-type temperature sensor elements. Since an inorganic semiconductor thermistor is hard, it is generally difficult to make a temperature sensor element using the inorganic semiconductor thermistor flexible. [0003] Japanese Patent Application Laid-Open No. 03-255923 (Patent Document 1) relates to a thermistor-type infrared detection element using a polymer semiconductor having NTC characteristics (Negative Temperature Coefficient; a characteristic that the resistance value decreases as temperature rises). This infrared detection element detects infrared rays by detecting a temperature rise caused...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/16G01K7/22H01C7/04
CPCH01C7/04C08L101/12C08L101/00C08G73/0266C08G73/1039C08G73/1067C08G73/1042C08G73/1071C08G73/105C08G73/1053C08G73/1078C08L79/08C08L79/02H01G4/012H01C7/049H01C7/042C08K5/42G01K7/16G01K7/22C08L2203/16C08L2203/20G01N23/20G01N2223/056H01C1/1413
Inventor 早坂惠美九内雄一朗
Owner SUMITOMO CHEM CO LTD