Polyimide and application thereof in metal laminated plate

Abstract

The invention relates to polyimide and application thereof in a metal laminated plate. The prepared polyimide has good regularity and ordered biphenyl, terphenyl and other long-chain structures; the good heat resistance of the polyimide is maintained, combination of C = O in an imide ring and a metal surface is promoted, so that adhesion between the polyimide and the metal layer is improved; with the introduction of a phenyl ester group-containing monomer, the dielectric loss can be further reduced; the polyimide can directly coat the metal layer to form a flexible copper-clad plate, the coating of a bonding layer material is not needed; the prepared flexible copper-clad plate has excellent heat resistance, peel strength and dielectric properties, and can be applied to the fields of flexible circuit substrate materials and communication.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a polyimide and its application in metal laminated boards. Background technique [0002] With the rapid popularization of 5G communication, flexible copper clad laminates with high frequency and low dielectric loss are more and more widely used in the fields of electronics and information, and flexible copper clad laminates with good heat resistance, dielectric properties and excellent adhesion Become the current research and development hotspot. [0003] Flexible copper clad laminate (FCCL) refers to a bendable layered composite material formed by covering a polymer base film with copper foil. It is widely used in mobile phones, For notebook computers and wearable electronic products, traditional FCCL adopts a three-layer structure of polyimide / adhesive / copper foil, in which the adhesive is low Tg (glass transition temperature) such as acrylic resin, epoxy...

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Problems solved by technology

[0005] CN108699243A discloses a thermoplastic polyimide, and metal-clad laminates and circuit substrates prepared therefrom. The thermoplastic polyimide developed in this paper has excellent peel strength and dielectric loss, but its temperature within 320°C Tg limits its use as an adhesive layer between the insulating layer and the metal layer, and cannot take advantage of polyimide as a substrate material

Disclosed in CN109843588A is a polyimide film for high temperature resistant metal lamination and its metal laminate, using a high proportion of long-chain aromatic rings, which greatly improves the heat resistance of polyimide, but there is still a dielectric The problem of excessive loss and decreased adhesion, it needs to be attached to hot-melt polyimide resin to increase the peeling force, but the hot-melt adhesive layer further reduces its heat resistance and service temperature

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