Copper lead frame, surface treatment method thereof, packaging body and preparation method of packaging body

Abstract

The invention relates to the technical field of integrated circuit packaging, and especially relates to a copper lead frame, a surface treatment method thereof, a packaging body and a preparation method of the packaging body. The copper lead frame is subjected to degreasing treatment to be activated, so that microetching treatment can be better performed to form the outer surface with certain roughness and extremely high surface activity, then electrolytic oxidation treatment is performed, the composition of the electrolytic oxidation liquid, the current density of electrolytic oxidation and the treatment temperature are set, and the oxidation reaction and the corrosion reaction are balanced, so that a finally formed oxidation film has a vertically staggered micro-pore structure, and compared with a relatively planar micro-coarsened structure obtained by browning treatment in the traditional technology, the oxidation film has better surface bonding performance, the copper lead frame subjected to surface treatment can have good binding force with plastic, the copper lead frame can be used for preparing a plastic cavity packaging body with high air tightness, and the manufacturing cost of the packaging body is effectively reduced on the premise that good air tightness is maintained.

Description

technical field [0001] The invention relates to the technical field of integrated circuit packaging, in particular to a copper lead frame, a surface treatment method thereof, a packaging body and a preparation method thereof. Background technique [0002] With the development of semiconductor technology, integrated circuits can play an important role in all walks of life, and can be called the cornerstone of the modern information society. Integrated circuit chips are usually packaged by a package. On the one hand, the package prevents the chip from being subjected to external impact, dissipates heat from the chip, and protects and stabilizes the chip. Key components, therefore, hermeticity is an important performance indicator of the package. [0003] The ceramic package is a package with good airtightness. However, the ceramic package is expensive. When the ceramic package is used for packaging, the cost of the ceramic package will occupy most of the cost of the entire pa...

AI Technical Summary

Problems solved by technology

[0003] The ceramic package is a package with good airtightness. However, the ceramic package is expensive. When the ceramic package is used for packaging, the cost of the ceramic package will occupy most of the cost of the entire package, which is not conducive to reducing the cost of the device.

If plastics are used instead of ceramics, the packaging cost will be greatly reduced. However, the bonding force between plastics and the surface of commonly used copper lead frames is generally poor, and water vapor or other corrosive gases can enter the interior of the package through the interface between plastics and lead frames. The tightness between them cannot meet the performance requirements

In order to solve this problem, in the traditional technology, brown oxidation treatment is usually performed on the surface of copper lead frame to obtain a certain microscopically rough surface, but the microscopically roughened surface obtained by browning treatment is relatively planar, which improves the surface adhesion performance. The effect is limited, so the airtightness of such a package is still not very good. When external water vapor or other corrosive gases invade the internal chip or bonding wire position, it will contaminate the device, resulting in a decrease in device performance or even failure

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