Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method for electronic-grade high-purity low-apparent-density dendritic copper powder

A low bulk ratio, dendritic technology, applied in the field of functional powder material preparation, can solve the problems of uneven particles, low yield, low added value, etc., and achieves high technological content, simple process flow and strong oxidation resistance. Effect

Pending Publication Date: 2021-12-24
昆明高聚科技有限公司
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current industrial production methods mainly include electrolysis and water atomization. Among them, the electrolysis produces high purity, but the particle size is large and irregular in shape. The water atomization method has high cost, low yield, uneven particles, and unstable quality.
The chemical reduction production process is still in the research stage of the laboratory. Due to the high cost of raw materials, difficulty in reprocessing secondary pollutants, low product yield, and high cost, the price of the product is high, and its ultra-fine copper powder per ton The market price is between 1.5 million and 6 million yuan
[0004] The particle size distribution of copper powder produced by domestic electrolysis is generally above 30 μm. Most of the electrolytic copper powder is concentrated in the low-end products with low added value in the field of powder metallurgy, which cannot meet the higher requirements for copper powder performance in the field of electronic information.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method for electronic-grade high-purity low-apparent-density dendritic copper powder
  • Preparation method for electronic-grade high-purity low-apparent-density dendritic copper powder
  • Preparation method for electronic-grade high-purity low-apparent-density dendritic copper powder

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: A kind of preparation method of electronic grade high-purity low-porosity dendritic copper powder, concrete steps are as follows:

[0029] (1) Add the aluminum powder to the electrolyte, and make part of the aluminum powder react with the copper ions in the electrolyte for 1 minute to generate copper seeds, and the remaining aluminum powder will carry out the in-situ displacement reaction with the subsequent electrolysis reaction to improve the electrolysis efficiency; The electrolyte contains H 2 SO 4 30g / L, Cu 2+ 15g / L, HCl 0.6ml / L, NaCl 0.045g / L, dispersant PEG400 1.3g / L; the amount of aluminum powder added is 1.5g / L;

[0030] (2) Use pure copper anode plate and pure aluminum cathode plate to electrolyze in an electrolyte solution containing aluminum powder, and collect powdery deposits on the cathode plate; wherein the current density is 200A / m 2 , The pole spacing is 3cm, the system temperature is 20°C, and the powder brushing cycle is 15min;

[...

Embodiment 2

[0035] Embodiment 2: A kind of preparation method of electronic grade high-purity low-porosity dendritic copper powder, concrete steps are as follows:

[0036] (1) Add the zinc powder into the electrolyte, and make part of the zinc powder and the copper ions in the electrolyte replace and react for 10 minutes to generate copper seeds, and the remaining zinc powder carries out the in-situ replacement reaction with the subsequent electrolysis reaction to improve the electrolysis efficiency; The electrolyte contains H 2 SO 4 30g / L, Cu 2+ 15g / L, HCl 0.6ml / L, NaCl 0.045g / L, dispersant PEG400 1.3g / L; the amount of zinc powder added is 0.75g / L;

[0037] (2) Use pure copper anode plate and pure aluminum cathode plate to electrolyze in an electrolyte solution containing zinc powder, and collect powdery deposits on the cathode plate; wherein the current density is 300A / m 2 , The pole spacing is 5cm, the system temperature is 25°C, and the powder brushing cycle is 30min;

[0038] (3...

Embodiment 3

[0042] Embodiment 3: A kind of preparation method of electronic grade high-purity low-porosity dendritic copper powder, concrete steps are as follows:

[0043](1) Formaldehyde is added to the electrolyte, so that part of the formaldehyde reacts with the copper ions in the electrolyte for 10 minutes to form copper seeds, and the remaining formaldehyde is reduced in situ with the subsequent electrolysis reaction to improve the electrolysis efficiency; Contains H 2 SO 4 30g / L, Cu 2+ 15g / L, HCl 0.6ml / L, NaCl 0.045g / L, dispersant PEG400 1.3g / L; the amount of formaldehyde added is 1.25g / L;

[0044] (2) Use pure copper anode plate and pure aluminum cathode plate to electrolyze in an electrolyte containing formaldehyde, and collect powdery deposits on the cathode plate; wherein the current density is 100A / m 2 , The pole spacing is 5cm, the system temperature is 22°C, and the powder brushing cycle is 15min;

[0045] (3) In the cleaning tank, the powdery sediment is washed with dei...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a preparation method for electronic-grade high-purity low-apparent-density dendritic copper powder, and belongs to the technical field of functional powder material preparation. The preparation method comprises the following steps: adding a seed crystal initiator into an electrolyte, enabling the seed crystal initiator to react with copper ions in the electrolyte to generate copper seed crystals, electrolyzing in the electrolyte containing the copper seed crystal initiator by adopting a pure copper anode plate and a pure copper cathode plate, and collecting powdery sediments on the cathode plate; washing the powdery sediments by using deionized water until a supernatant is colorless and transparent, adding the washed powder into a reducing agent solution for reduction treatment, then adding a surface treating agent for surface anti-oxidation treatment, and sequentially filtering, vacuum drying and screening to obtain the electronic-grade high-purity low-apparent-density dendritic copper powder. The low-apparent-density dendritic copper powder has the purity of 99.9%, the average particle size of 6-10 microns and the apparent density of 0.45-1.5 g / cm < 2 >, is dendritic, can exert the conductivity of the copper powder to the greatest extent, and is particularly suitable for electronic-grade superfine copper powder in the field of electronic information industry.

Description

technical field [0001] The invention relates to a preparation method of electronic-grade high-purity dendritic copper powder with low porosity ratio, and belongs to the technical field of preparation of functional powder materials. Background technique [0002] Ultrafine copper powder has the characteristics of good electrical and thermal conductivity, small particle size, corrosion resistance, non-magnetic, smooth surface, strong fluidity, and low price. It is an important raw material in the powder metallurgy industry and is mainly used for conductive adhesives, conductive coatings and electrodes. The manufacture of materials, etc., and the performance of ultrafine copper powder mainly depends on its morphology, particle size and preparation process. [0003] The processing, production and application technology of ultra-fine copper powder has always been the main bottleneck affecting the development of the industry. Due to the softness of copper powder, it is difficult t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C25C5/02C25C7/06B22F1/00
CPCC25C5/02C25C7/06
Inventor 黄惠
Owner 昆明高聚科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com