High-precision multi-layer chip capacitor forming process and capacitor thereof

Abstract

The invention discloses a high-precision multilayer chip capacitor forming process and a capacitor thereof, and the process comprises the following steps of (1) preparing a dielectric slurry suitable for waterfall tape casting: a, mixing ceramic powder, a solvent and balls, then adding a plasticizer, a dispersant and a defoaming agent to obtain a mixture, wherein the ratio of the balls to the ceramic powder to the solvent is (3-6): (0.5-2): (0.5-3), and the ceramic powder is one or more of barium titanate ceramic materials, strontium titanate ceramic materials, zirconium titanium ceramic materials and the like for capacitors, and the particle size of the ceramic powder is 0.1-3 [mu] m. According to the high-precision multi-layer chip capacitor forming process and the capacitor thereof, adopting the above structure, the cost is low, the model changing speed is high, the efficiency is high, the automatic production is convenient to realize, and the diaphragm precision is easy to control; a diaphragm directly flows on a printed electrode, a medium and the electrode are easy to combine, so that the thin dielectric film can be used as a high-precision and medium-high-capacity capacitor product.

Description

technical field [0001] The invention relates to the technical field of capacitor forming, in particular to a high-precision multilayer chip capacitor forming process and capacitor thereof. Background technique [0002] Multilayer chip capacitors are laminated by ceramic dielectric diaphragms with printed electrodes (internal electrodes) in a dislocation manner, and are sintered at a high temperature to form a ceramic chip, and then a metal layer (external electrode) is sealed on both ends of the chip. made capacitors. In addition to the common characteristics of capacitors "blocking direct traffic", MLCC also has the characteristics of small size, long life, high reliability, high integration, and suitable for surface mounting. It is widely used in various electronic complete machines and electronic equipment, such as Computers, telephones, program-controlled switches, precision testing instruments, etc. [0003] The existing capacitor forming technology has the following ...

AI Technical Summary

Problems solved by technology

[0006] Disadvantages: the production of capacitors has low capacity, low yield, scattered capacity, and cannot produce high-precision, low-loss products. Since the diaphragm is pressed on the electrode, the electrode is easy to Compression and deformation affect the capacity accuracy and capacitance loss of the capacitor

[0009] Disadvantages: high equipment requirements (mainly imported equipment at present), can not make high-voltage and high-power products, only high-capacity and low-voltage, small-size capacitors, due to When stacking, the electrode and the diaphragm are under the same pressure, and the electrode is easy to collapse, shift, and deform. It is not possible to print thick electrode products, and the electrode is easy to collapse, which affects the capacity accuracy and capacitance loss of high-voltage and high-power capacitors.

[0012] Disadvantages: Insufficient production efficiency, high requirements for printing environment, relatively complex component formula, high technical difficulty, low film thickness accuracy, and cannot meet the production requirements of high-precision capacitors

[0013]In order to solve the electrode diffusion caused by thicker or wider electrodes in the existing process, the problems of high frequency characteristics and capacity accuracy caused by uneven edges and collapse, Problems such as internal dielectric delamination, material sintering shrinkage, low product reliability, short life, etc., the invention provides a high-precision multilayer chip capacitor forming process and capacitor

Images