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Polyfunctional hybrid epoxy compound and light/heat dual-curing resin composition as well as preparation method and application of light/heat dual-curing resin composition

A technology of epoxy compound and resin composition, which is applied in the direction of non-polymer organic compound adhesives, organic chemistry, adhesives, etc., and can solve the problems of low bonding strength and poor heat resistance

Active Publication Date: 2022-01-07
XIAMEN WELDTONE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The first purpose of the present invention is to provide a new multifunctional hybrid epoxy compound in order to overcome the defects of low bonding strength and poor heat resistance of the existing UV / heat dual curing resin composition, The introduction of the multifunctional hybrid epoxy compound into the UV / heat dual curing resin system can achieve rapid positioning and the corresponding UV / heat dual curing resin system has good bond strength and heat resistance after curing

Method used

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  • Polyfunctional hybrid epoxy compound and light/heat dual-curing resin composition as well as preparation method and application of light/heat dual-curing resin composition
  • Polyfunctional hybrid epoxy compound and light/heat dual-curing resin composition as well as preparation method and application of light/heat dual-curing resin composition
  • Polyfunctional hybrid epoxy compound and light/heat dual-curing resin composition as well as preparation method and application of light/heat dual-curing resin composition

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preparation example Construction

[0057] The preparation method of the multifunctional hybrid epoxy compound provided by the present invention comprises: under the protection of an inert gas, the bisphenol compound represented by the general formula (II) and the halogenated compound represented by the general formula (III) are mixed according to the molar ratio of 1 : (30-60) After mixing, heat up to 40-45°C and stir for 15-30 minutes, then add a phase transfer catalyst and heat up to 50-55°C, stir for 2-4 hours, then add alkali and heat up to 70-80°C Stir the reaction for 1-2 hours, filter the obtained reaction solution, and recover the excess halogenated compound by distillation of the filtrate under reduced pressure, wash the remaining product with water and extract it with an organic solvent, collect the organic phase and evaporate to dryness to obtain a colorless or pale Yellow multifunctional hybrid epoxy compound;

[0058]

[0059] In the general formula (II), R 9 , R 10 , R 11 and R 12 One and o...

preparation example 1

[0086] Add 100g of 5,5'-diallyl-2,2'-diphenol into 1400g of epichlorohydrin, epichlorohydrin and 5,5'-diallyl-2,2'-diphenol The molar ratio of hydroquinone is 40:1, heat up to 40°C, and stir for 20 minutes under the protection of argon; add 10g of tetrabutylammonium chloride, then heat up to 55°C, and stir for 3 hours under the protection of argon; Add 50wt% potassium hydroxide aqueous solution, then raise the temperature to 75°C, and continue to stir and react for 2 hours under the protection of argon; filter the reaction solution, and recover excess epichlorohydrin by distillation under reduced pressure from the filtrate, wash the remaining product three times with water, and use Dichloromethane extraction, the organic phase was collected and evaporated to dryness to obtain 140.3 g of a liquid colorless or light yellow product containing 5,5'-diallyl-2,2'-biphenyl diglycidyl ether, the specific reaction The process is shown in reaction formula (1). Among them, the total yie...

preparation example 2

[0089] Add 100g of 5,5'-diallyl-3,3'-dimethoxy-2,2'-diphenol into 1420g of epichlorohydrin, epichlorohydrin and 5,5'-diphenol The molar ratio of allyl-3,3'-dimethoxy-2,2'-biphenyldiol is 50:1, heat up to 40°C, stir for 20 minutes under the protection of argon; add 10g of tetrabutyl Ammonium chloride, then heated up to 55°C, stirred and reacted for 3 hours under the protection of argon; added 50wt% potassium hydroxide aqueous solution, then raised the temperature to 75°C, continued to stir and reacted for 2 hours under the protection of argon; filtered the reaction solution, Distill the filtrate under reduced pressure to recover excess epichlorohydrin, wash the remaining product three times with water, and extract with dichloromethane, collect the organic phase and evaporate to dryness to obtain colorless or light yellow 5,5'-diallyl in liquid state Base-3,3'-dimethoxy-2,2'-biphenyl diglycidyl ether product 133g, the specific reaction process is shown in the reaction formula (2...

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Abstract

The invention belongs to the field of adhesives and sealants, and relates to a polyfunctional hybrid epoxy compound and an ultraviolet light / heat dual-curing resin composition as well as a preparation method and application of the ultraviolet light / heat dual-curing resin composition. The ultraviolet / thermal dual-curing resin composition comprises the following components: (A) acrylate resin; (B) an epoxy resin; (C) a polyfunctional hybrid compound as shown in a general formula (I); (D) a radical photoinitiator; (E) a radical polymerization inhibitor; (F) a curing accelerator; (G) a stabilizer; and optionally (H) a silane coupling agent and (I) an auxiliary agent. The ultraviolet light / heat dual-curing resin composition provided by the invention has good bonding strength and heat resistance at the same time.

Description

technical field [0001] The invention belongs to the field of adhesives and sealants, and in particular relates to a multifunctional hybrid epoxy compound and ultraviolet light / heat dual curing resin composition and its preparation method and application. Background technique [0002] Epoxy resin has excellent performance in terms of mechanical properties, heat resistance, chemical resistance and bonding strength, and the epoxy resin monomer is odorless and low-toxic, and the shrinkage of epoxy ring-opening polymerization is small, so it is widely used in adhesives. in the adhesive. With the rapid development of the electronic field, the requirements for fast positioning and bonding strength performance of bonding and sealing materials are increasing. The traditional epoxy resin composition used in adhesives and sealants for electronic components usually has high bonding strength, but the curing speed is slow, which cannot realize the fast positioning of the bonded parts, wh...

Claims

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Application Information

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IPC IPC(8): C07D303/27C09J4/06
CPCC07D303/27C09J4/06
Inventor 陈长敬林鸿腾刘涛李帅
Owner XIAMEN WELDTONE TECH CO LTD