Low-dielectric-loss flexible thermosetting binder and preparation method thereof

Abstract

The invention discloses a low-dielectric-loss flexible thermosetting binder and a preparation method thereof. The flexible thermosetting binder is prepared from the following components in a solvent-free manner: 10 to 30 parts by mass of bisphenol A cyanate ester, 10 to 40 parts by mass of allyl modified bismaleimide, 5 to 50 parts by mass of epoxy modified rubber, 0.005 to 1.0 part by mass of a curing accelerator and 0 to 40 parts by mass of filler, wherein the epoxy modified rubber is a product obtained by partially epoxidizing double bonds in a molecular chain of an SBS (Styrene Butadiene Styrene) block copolymer, an SIS (Styrene Isoprene Styrene) block copolymer or an SIBS (Styrene Isoprene Styrene) block copolymer, and the epoxy equivalent of the epoxy modified rubber is 1000-2500g / eq. The flexible thermosetting binder has high flexibility, extremely low dielectric constant, dielectric loss and water absorption rate, high peel strength and excellent dip soldering resistance when being used for flexible copper-clad plates, the adhesive force to copper foil is large, meanwhile, the raw material source is not limited, and the preparation method is simple and easy to implement.

Description

technical field [0001] The invention belongs to the field of special resin materials for flexible copper clad laminates, and in particular relates to a low dielectric loss flexible thermosetting adhesive and a preparation method thereof. Background technique [0002] With the rapid development of 5G communication and mobile Internet, antennas, data transmission and processing systems for mobile terminals, including mobile phones, tablets, and laptops, require flexible printed circuit boards with low dielectric constant, especially low dielectric loss. The demand for substrates (i.e. flexible copper clad laminates) has increased significantly. [0003] At present, the common flexible copper-clad laminates on the market are prepared by directly bonding flexible films such as polyimide or ethylene terephthalate as insulating base films, or bonding them to copper foil through adhesives. However, the currently used insulating base films and adhesives (acrylates and epoxy resins)...

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Problems solved by technology

[0004] In recent years, although low dielectric constant and low dielectric loss resins for flexible copper clad laminate substrates, represented by liquid crystal polymers and modified polyimides, have appeared on the market, the sources of the former raw material films are extremely limited. The processing performance is relatively poor, and the designability of the molecular structure is relatively simple, and the space for modification is small; although the latter has a good application foundation in the integrated circuit industry, it has low dielectric constant and low dielectric loss. Polyimide (microporous, fluorine-containing or non-fluorine type) currently has complex and demanding monomer synthesis and polymerization processes, or low mechanical strength, or high water absorption, or low binding force with copper, or halogen hazards, or limited sources, or high costs

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