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Molding process for flexible coreless 3D printing integrated circuit

An integrated circuit and process technology, applied in the field of flexible coreless 3D printed integrated circuit molding process, can solve problems such as unconcerned issues, achieve the effects of reducing construction costs, improving mechanical strength, and being easy to remove

Pending Publication Date: 2022-01-28
苏州链芯半导体科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For example, Chinese patent CN 201810563822.9 discloses a chip package and a packaging method, including a lead frame, a plurality of chips and a first conductive sheet; the lead frame has a plurality of base islands and a plurality of negative pins; it is welded through the first conductive sheet In the negative electrode of all chips, its heat dissipation and ability to withstand high current are greatly improved, but it does not consider the problems that will arise in the manufacturing process of the substrate frame

Method used

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  • Molding process for flexible coreless 3D printing integrated circuit
  • Molding process for flexible coreless 3D printing integrated circuit
  • Molding process for flexible coreless 3D printing integrated circuit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] This embodiment introduces an integrated circuit carrier process in a flexible coreless 3D printed integrated circuit molding process.

[0055] Please refer to figure 1 , figure 1 A flow chart of integrated circuit carrier process in a flexible coreless 3D printed integrated circuit molding process provided by the present invention; please refer to image 3 , image 3 A schematic diagram of the requirements and operation of the squeegee strip in the molding process of a flexible coreless 3D printed integrated circuit provided by the present invention; please refer to Figure 4 , Figure 4 It is a schematic diagram of the printing operation of the backfill process in the molding process of a flexible coreless 3D printed integrated circuit provided by the present invention.

[0056] The integrated circuit carrier process flow includes:

[0057] 101. Lamination;

[0058] 102. exposure;

[0059] 103. Development;

[0060] 104. Electroplating;

[0061] 105. Photores...

Embodiment 2

[0073] Based on the above-mentioned embodiment 1, this embodiment introduces an integrated circuit assembly process in a flexible coreless 3D printed integrated circuit molding process.

[0074] Please refer to figure 2 , figure 2 A flow chart of integrated circuit assembly process in a flexible coreless 3D printed integrated circuit molding process provided by the present invention; please refer to Figure 5 , Figure 5 A schematic cross-sectional view of a silver-tin (Ag-Sn) alloy interlayer in a flexible coreless 3D printed integrated circuit molding process provided by the present invention; please refer to Image 6 , Image 6 The silver-tin (Ag-Sn) system equilibrium phase diagram in a kind of flexible coreless 3D printed integrated circuit molding process provided by the present invention; please refer to Figure 7 , Figure 7 It is a schematic diagram of an anti-etching process in a flexible coreless 3D printed integrated circuit molding process provided by the p...

Embodiment 3

[0084] Based on the above-mentioned embodiment 1 or 2, in order to further illustrate the technical effect of the technical solution of the present invention, this embodiment compares and analyzes the present invention and the traditional CSI process.

[0085] Please refer to Figure 8 , Figure 8 It is a comparison diagram of the substrate morphology of the CSI process and a flexible coreless 3D printed integrated circuit molding process provided by this application; in the initial process of the CSI technology, a stainless steel substrate is used and pretreated at a high temperature of 950°C. In order to provide an easy-to-adapt environment for the later silver paste. Under such high temperature conditions, stainless steel substrates start to deform and cause warping during die attach, wire bonding, and molding. The conceptual purpose of the present invention is to avoid material degradation due to repeated pretreatment of metal substrates using high temperature environmen...

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Abstract

The invention provides a molding process for a flexible coreless 3D printing integrated circuit, and the process comprises an integrated circuit carrier process and an integrated circuit assembly process, and the integrated circuit carrier process comprises the following steps: 101, laminating; 102, exposure; 103, development; 104, electroplating; 105, photoresist baking; 106, backfilling; and 107, firing / sintering. The integrated circuit assembly process flow comprises the following steps: 201, flip chip application; 202, molding; 203, back erosion. Compared with a traditional CSI process, the process has the advantages that the problem of material warping is effectively avoided by taking a series of measures, the problems of influence of silver softness on adhesiveness and silver discoloration are solved, the substrate is effectively and cleanly removed on the premise that damage is not generated, and meanwhile, the process has the advantage of saving material cost.

Description

technical field [0001] The invention relates to the field of integrated circuit design, in particular to a molding process for flexible coreless 3D printed integrated circuits. Background technique [0002] With the development of science and technology, chips exist in all aspects of life. Whether it is a computer or a mobile phone, Chinese chips have blazed their own path. Electronic packaging is an indispensable process for integrated circuit chips and a bridge from devices to systems. The production link of packaging has a great impact on the quality and competitiveness of microelectronics products. Packaging research is developing very rapidly around the world, and the challenges and opportunities it faces have never been encountered since the advent of electronic products; the number of issues involved in packaging is also rare in many other fields. It is a very comprehensive new high-tech discipline from materials to technology, from inorganic to polymer, from large-...

Claims

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Application Information

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IPC IPC(8): H01L21/48H01L21/56
CPCH01L21/4814H01L21/563H01L21/565
Inventor 杨志强陈健平
Owner 苏州链芯半导体科技有限公司