Use of bonding resin
A technology of adhesive resin and application, applied in the direction of starch adhesive, protein adhesive, polysaccharide adhesive, etc., can solve the problems of long pressing time and high pressing temperature
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Embodiment 1
[0028] First, a tannin solution was prepared by adding 70 g of powdered tannin (91% solids content) and 107 g of water to a 500 ml beaker at ambient temperature and stirring until the tannin was completely and uniformly dispersed. Then, 24 g of a 50% sodium hydroxide solution were added to the tannin dispersion. The composition was stirred for 120 minutes to ensure complete dissolution of the tannins in the alkaline medium.
Embodiment 2
[0030] An adhesive formulation was prepared by mixing 23.5 g of the tannin alkaline solution from Example 1 and 7.5 g of the polyglycerol polyglycidyl ether in a beaker for 20 minutes at room temperature using an overhead stirrer.
[0031] The adhesive formulations were tested in lap-joint tests using an Automated Bonding Evaluation System (ABES) tensile tester.
[0032] For this purpose a relatively thin beech veneer with a thickness of 0.6mm cut into 105x20mm pieces was used. The resin was applied to an area of 5mm x 20mm on one side of one end of the two blocks. The overlapping ends of the resin-coated series of test specimens were placed in a hot press at 5 kg / m 2 The pressure was pressed together, using a pressing time of 90 seconds at a pressing temperature of 150 °C. Average data from 5 test specimens are shown in Table 1.
[0033]
[0034]
[0035] Table 1: Shear Strength Using ABES
Embodiment 3
[0037] First, a starch solution was prepared by adding 27 g of powdered starch (90% solid content) and 49 g of water to a 500 ml beaker at a temperature of 80° C. and stirring for 60 minutes. Then, the temperature of the starch dispersion was lowered to 40° C. and 4.9 g of 50% sodium hydroxide solution were added to the starch dispersion. The composition was stirred for 120 minutes to ensure complete dissolution of the starch in the alkaline medium.
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Abstract
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Application Information
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