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Anti-oxidation production process of circuit board

A production process and anti-oxidation technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of anti-oxidation film high temperature resistance, poor compactness, etc., to improve the force and high temperature resistance and compactness, the effect of improving compactness

Pending Publication Date: 2022-02-08
GUANGDE BAODA PRECISION CIRCUIT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an anti-oxidation production process for circuit boards to solve the problems of existing anti-oxidation films with poor high temperature resistance and compactness

Method used

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  • Anti-oxidation production process of circuit board
  • Anti-oxidation production process of circuit board
  • Anti-oxidation production process of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Preparation of imidazole derivatives:

[0033] Step 1: Add 0.01mol of pyridine-4-carbaldehyde, 0.025mol of benzyl alcohol and 10-20mL of glacial acetic acid into a three-necked flask in turn, stir evenly, cool to 0°C, and slowly add 25mL of concentrated sulfuric acid and glacial acetic acid dropwise while stirring The mixed solution, the dropping speed is 1 drop / second, continue to stir and react at 0°C for 48h after the dropwise addition is complete, then pour into ice water, stir for 50min, filter, take the filter cake and wash and filter repeatedly with ice water until the filtrate Neutral, then vacuum-dry the filter cake to constant weight to obtain benzyl alcohol derivatives, wherein the mixed solution of concentrated sulfuric acid and glacial acetic acid is a mixture of concentrated sulfuric acid and glacial acetic acid with a mass fraction of 98% in a volume ratio of 1:5 made;

[0034] In the second step, after mixing 0.1mol of benzyl alcohol derivatives and eth...

Embodiment 2

[0038] Preparation of imidazole derivatives:

[0039] Step 1: Add 0.01mol of pyridine-4-carbaldehyde, 0.03mol of benzyl alcohol and 20mL of glacial acetic acid into a three-necked flask in turn, stir evenly, cool to 0°C, and slowly add 35mL of concentrated sulfuric acid and glacial acetic acid dropwise while stirring Solution, the dropping rate is 1 drop / second, after the drop is complete, continue to stir and react at 0°C for 48h, then pour into ice water, stir for 50min, filter, take the filter cake and wash and filter repeatedly with ice water until the filtrate is medium Then vacuum-dry the filter cake to constant weight to obtain benzyl alcohol derivatives, wherein the mixed solution of concentrated sulfuric acid and glacial acetic acid is formed by mixing concentrated sulfuric acid and glacial acetic acid with a mass fraction of 98% in a volume ratio of 1:5 ;

[0040] The second step, after mixing 0.1mol benzyl alcohol derivatives and ether, stir slightly until the benz...

Embodiment 3

[0044] A production process for circuit board anti-oxidation, comprising the following steps:

[0045] Step 1. Alkaline cleaning: Soak the PCB board with 5% sodium hydroxide solution at 20°C for 10 minutes, then rinse it with water for 10 minutes to remove the grease on the surface of the PCB board, and obtain the PCB board with alkali cleaning;

[0046] Step 2. Acid neutralization: wash the alkaline-washed PCB board with 5% dilute sulfuric acid at 20°C for 24 minutes, and then rinse it with water for 8 minutes to obtain an acid-neutralized PCB board;

[0047] Step 3, microetching: immerse the acid-neutralized PCB board in a microetching solution at 20°C for 4 minutes, then rinse with water for 4 minutes, and dry to obtain a microetching PCB board. The microetching solution includes 5% sulfuric acid and mass fraction 5% hydrogen peroxide is mixed according to the volume ratio of 2:1;

[0048] Step 4. Weigh the following raw materials by weight: 2 g of imidazole derivatives pr...

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Abstract

The invention relates to an anti-oxidation production process of a circuit board and belongs to the technical field of circuit board processing. The anti-oxidation production process comprises the following steps that : step 1, alkali washing is performed; step 2, acid neutralization is performed; step 3, micro-etching is performed; and 4, anti-oxidation treatment is performed, specifically, a micro-etched PCB is immersed in an anti-oxidation liquid at 35-45 DEG C for 1-2 min, the micro-etched PCB is taken out , the micro-etched PCB is cleaned with water for several times, and the micro-etched PCB is dried by blowing to obtain the circuit board, wherein the anti-oxidation liquid comprises the following raw materials of an imidazole derivative, acetic acid, formic acid, copper sulfate and water. On one hand, alkali washing, acid neutralization, micro-etching and other processes are utilized to pre-treat the PCB to obtain the micro-etched PCB, the surface roughness of the micro-etched PCB is increased, the acting force between an anti-oxidation film obtained through subsequent treatment and the PCB is increased, and the compactness of the obtained anti-oxidation film is improved; and on the other hand, the imidazole derivative is introduced into the anti-oxidation liquid, so that the high temperature resistance and compactness of the anti-oxidation film are improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a production process for anti-oxidation of circuit boards. Background technique [0002] A printed circuit board (PCB) is a circuit board in which electrical conductors are formed on insulators by means of mechanical and chemical processing, surface treatment, etc., according to circuit design, drawing wiring patterns for conductive wiring connecting circuit parts. The above-mentioned circuit patterns are formed by printing, lithography, etching, electroplating and other technologies to form precise wiring, and serve as an assembly platform for supporting electronic components and interconnecting circuits between components. With the development of the economy, electronic products are developing in the direction of lightness, thinness, shortness, miniaturization, and multi-function, and the circuit board is also developing in the direction of high pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/282H05K3/285
Inventor 沈剑祥陈云峰董涛周萌
Owner GUANGDE BAODA PRECISION CIRCUIT CO LTD
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