Preparation method of ultrathin soft soldering modified layer on surface of graphene film
A graphene film and modified layer technology, applied in welding equipment, welding equipment, non-electric welding equipment, etc., can solve the problems of poor wettability, difficulty in ensuring low temperature, high-quality connection, easy peeling of graphene film, etc., to achieve wetness Improved wettability, good wetting and metallurgical bonding, and high stability
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Embodiment 1
[0036] Step (1) In this embodiment, the thickness of the graphene film is 18 μm, and the size of the area to be modified is 20 mm×15 mm. A laser cutting machine is used to punch holes in the area to be modified. The diameter of the circular hole is 600 μm, and the distance between the centers of the circles is 1 mm. , in a regular array covering the area to be modified, for details, please refer to the attached figure 1 ;
[0037] Step (2) The active solder alloy is Ag-27Cu-3.3Ti (wt%) with a thickness of 80 μm, cut it into a rectangle with a size of 20mm×15mm with a laser cutting machine, and cut it in half with sandpaper with a mesh number of 800 The active solder alloy is subjected to surface grinding treatment, and after the surface oxide film is removed, it is put into a beaker equipped with absolute ethanol and ultrasonically cleaned for 3 minutes; the cleaned active solder alloy is tiled on the graphene thin to be modified area On the bottom of the modified area, a lay...
Embodiment 2
[0046] Step (1) In this embodiment, the thickness of the graphene film is 18 μm, and the size of the area to be modified is 20 mm×15 mm. A laser cutting machine is used to punch holes in the area to be modified. The diameter of the circular hole is 300 μm, and the distance between the centers of the circles is 1 mm. , covering the area to be modified in a regular array;
[0047] Step (2) The active solder alloy is Ag-27Cu-3.3Ti (wt%) with a thickness of 80 μm, cut it into a rectangle with a size of 20mm×15mm with a laser cutting machine, and cut it in half with sandpaper with a mesh number of 800 The active solder alloy is subjected to surface grinding treatment, and after the surface oxide film is removed, it is put into a beaker equipped with absolute ethanol and ultrasonically cleaned for 3 minutes; the cleaned active solder alloy is tiled on the graphene thin to be modified area On the bottom of the modified area, a layer of graphene film is laid on the bottom of the modif...
Embodiment 3
[0051] Step (1) In this embodiment, the thickness of the graphene film is 18 μm, and the size of the area to be modified is 20 mm × 15 mm. A laser cutting machine is used to process circular pits on the surface of the area to be modified, and the diameter of the circular hole pits is 300 μm. , with a distance of 1 mm between the centers of the circles, and the area to be modified is covered in a regular array;
[0052] Step (2) The active solder alloy is Sn-5Ti (wt.%) with a thickness of 100 μm, cut it into a rectangle with a size of 20 mm × 15 mm with a laser cutting machine, and use sandpaper with a mesh number of 800 to cut the active solder. The solder alloy is surface polished, and after the surface oxide film is removed, it is placed in a beaker filled with absolute ethanol and ultrasonically cleaned for 3 minutes; the cleaned active solder alloy is tiled on the graphene thin area to be modified. Vacuum brazing is carried out on the graphene film and the active solder al...
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Abstract
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