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Nickel electrode slurry, resistor and preparation method of resistor

A nickel electrode and resistor technology, applied in the field of electronic components, can solve problems such as weak conductivity, lower electrical performance of products, and increased cost, and achieve good electrical conductivity, reduce adverse effects, and low production costs

Active Publication Date: 2022-03-29
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the nickel electrode paste is used as a direct substitute for the silver electrode paste, the sintering of the production line of the thick film chip resistor is carried out in an air atmosphere (the silver electrode paste is sintered in the air atmosphere), while the nickel electrode paste is sintered in the air atmosphere. Oxidation reaction is easy to occur during sintering in the atmosphere, forming nickel oxide with weak conductivity, which reduces the electrical properties of the product
Therefore, if in order to ensure the performance of nickel electrodes, it is necessary to sinter in a reducing atmosphere or an inert gas environment, which is quite different from the original process production line, resulting in a significant increase in the cost of resistor products using nickel electrodes

Method used

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  • Nickel electrode slurry, resistor and preparation method of resistor
  • Nickel electrode slurry, resistor and preparation method of resistor
  • Nickel electrode slurry, resistor and preparation method of resistor

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preparation example Construction

[0073] In one embodiment, the preparation method of described coated nickel powder comprises the following steps:

[0074] Dissolving nickel source and boron source in a solvent, adding organic matter to prepare nickel boride organic precursor;

[0075] mixing and stirring the nickel boride organic precursor and nickel powder, evaporating the solvent, and preparing nickel powder coated with organic matter;

[0076] The organic matter is selected from one or more of perchlorethylene, polyvinyl alcohol and ethyl cellulose. Preferred is polyvinyl alcohol.

[0077] In one embodiment, the nickel source is Ni(CO) 4 , the boron source is boric acid.

[0078] Alternatively, the solvent can be acetone, which is subsequently removed by evaporation. Optionally the temperature at which the solvent is evaporated is 80°C ± 5°C.

[0079] It can be understood that after evaporating the solvent, a step of pulverizing and grinding the product is also included to adjust the size of the coat...

Embodiment 1

[0111] This embodiment provides a nickel electrode slurry, a resistor and a method for preparing the resistor, in parts by weight, the steps are as follows:

[0112] 1) Take the first nickel powder with a particle size of 0.1 μm to 1 μm, the second nickel powder with a particle size of 1 μm to 3 μm, and the third nickel powder with a particle size of 3 μm to 10 μm, and mix them in a weight ratio of 2:1.5:1 to obtain a mixture type nickel powder.

[0113] 2) In 1L of acetone, add 1L of Ni(CO) 4 and 300g of boric acid, then add 0.8L of polyvinyl alcohol, and mix thoroughly to obtain a nickel boride organic precursor, then add 800g of nickel powder, heat to 80°C, evaporate and dry to remove acetone, then pulverize and grind the product to obtain a particle size of 0.5μm~2μm nickel powder coated with organic matter.

[0114] 3) 1L of terpineol, 1L of mineral spirits and 2kg of ethyl cellulose were mixed, then heated to 90° C., and stirred at 90° C. for 2 hours to dissolve the et...

Embodiment 2

[0119] This embodiment provides a nickel electrode slurry, a resistor and a method for preparing the resistor, in parts by weight, the steps are as follows:

[0120] 1) Take the first nickel powder with a particle size of 0.1 μm to 1 μm, the second nickel powder with a particle size of 1 μm to 3 μm, and the third nickel powder with a particle size of 3 μm to 10 μm, and mix them in a weight ratio of 1:1:1 to obtain a mixture type nickel powder.

[0121] 2) In 0.8L acetone, add 1L Ni(CO) 4 and 200g of boric acid, then add 1L of polyvinyl alcohol, and mix thoroughly to obtain a nickel boride organic precursor, then add 600g of nickel powder, heat to 80°C, evaporate and remove acetone, and then pulverize and grind the product to obtain a particle size of 0.5μm~ 2μm nickel powder coated with organic matter.

[0122] 3) 1L of terpineol, 1L of mineral spirits and 2kg of ethyl cellulose were mixed, then heated to 90° C., and stirred at 90° C. for 2 hours to dissolve the ethyl cellul...

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Abstract

The invention relates to the technical field of electronic components, in particular to nickel electrode slurry, a resistor and a preparation method of the resistor. The nickel electrode slurry comprises the following components: 25-60 parts of mixed nickel powder; 30 to 50 parts of coated nickel powder; 5 to 15 parts of inorganic powder; 1-5 parts of an organic carrier; 3 to 15 parts of an additive; the mixed nickel powder comprises first nickel powder, second nickel powder and third nickel powder; the particle size of the first nickel powder is 0.1 mu m-1 mu m; the particle size of the second nickel powder is 1-3 [mu] m; the particle size of the third nickel powder is 3-10 [mu] m; the coated nickel powder is nickel powder coated with organic matter. The nickel electrode slurry disclosed by the invention can be sintered in an air atmosphere, has relatively good conductivity, is suitable for an existing resistor process production line, and reduces the production cost.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a nickel electrode paste, a resistor and a method for preparing the resistor. Background technique [0002] With the continuous development of global industry, a large amount of sulfur-containing gases are emitted, resulting in the accumulation of sulfur in the atmosphere, which has an adverse effect on the performance of resistors. In recent years, more and more chip thick film fixed resistor vulcanization failure feedbacks have appeared. The vulcanization failure of the resistor will cause the resistance value of the resistor to increase or even open circuit, resulting in the performance degradation or failure of the whole product. For chip resistors, especially resistors with a silver-containing conductive layer at the lead-out end, when exposed to air for 3 to 5 years, the silver ions in the lead-out end easily combine with sulfur in the air to form silver sulfi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01C1/142H01C7/00H01C17/065H01C17/28H01C17/30
CPCH01B1/16H01B1/22H01C7/003H01C1/142H01C17/065H01C17/281H01C17/30
Inventor 翁章钊周帅王斌罗道军王小强罗军陈毓彬
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST