The invention relates to composition and preparation of a thick-film
copper conductor sintered at different temperatures and different atmospheres, and belongs to the field of
chemical preparation. Comprising the following steps: mixing 65-85% of
copper powder, 3.0%-15.0% of glass, 15.0%-35.0% of an organic
adhesive and 0.1-1.5% of an additive which is one or more of
titanium trioxide or
stannous oxide, cuprous
oxide and
copper oxide, rolling into
slurry, and
sintering at 850-950 DEG C under the protection of
nitrogen or
ammonia gas to obtain a
copper conductor. The medium-temperature copper paste is prepared by the following steps: mixing 60.0-85.0% of copper
powder, 3.0-13.0% of glass, 8.0-25.0% of an organic
adhesive and 0.2-1.6% of an additive which is one or more of
titanium sesquioxide or
stannous oxide, cuprous
oxide and
copper oxide, rolling into paste, and
sintering at 450-650 DEG C under the protection of
nitrogen or
ammonia gas to obtain a
copper conductor. The low-temperature copper paste is prepared by mixing 60.0-85.0% of copper
powder, 3.0-13.0% of glass, 8.0-25.0% of an organic binder and 0.1-2.0% of an additive which can be one or more of elemental elements of
magnesium,
zinc,
boron and
phosphorus or one or more of
nickel phosphide,
nickel boride, copper
phosphide and
copper oxide, rolling the mixture into paste, and
sintering the paste in air at 250-350 DEG C to obtain a
copper conductor.