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Conductive paste, lamina ceramic electronic element producing method and lamina ceramic electronic element

A technology of ceramic electronic components and conductivity, which is applied in the field of laminated ceramic electronic components, and can solve problems such as inability to obtain electrostatic capacity, difficult bonding, and difficult solder connection of sintered electrodes.

Inactive Publication Date: 2003-03-26
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, Ni and Ag are insoluble in each other
For this reason, if Ni is used as the internal electrode of the multilayer ceramic capacitor and Ag is used as the terminal electrode, there is a problem that it is difficult to join between the internal electrode and the terminal electrode, and the desired capacitance cannot be obtained.
However, there is a problem that these sintered electrodes composed of Al and Zn are not easily soldered and if one tries to plate on them, the Al and Zn electrodes themselves tend to dissolve in the plating solution

Method used

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  • Conductive paste, lamina ceramic electronic element producing method and lamina ceramic electronic element
  • Conductive paste, lamina ceramic electronic element producing method and lamina ceramic electronic element

Examples

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Embodiment 1

[0038] In this first embodiment, the case of a multilayer ceramic capacitor of a chip electronic component will be described.

[0039] First, as the initial raw material, weigh out the specified amount of TiCl 4 and Ba(NO 3 ), react it with oxalic acid to obtain barium titanyl oxalate (BaTiO(C 2 o 4 )·4H 2 O) precipitate, the precipitate is thermally decomposed at a temperature above 1000°C, and BaTiO is synthesized as the main component 3 .

[0040] In addition, with 0.25Li 2 O-0.65 (0.30TiO 2 0.70SiO2 2 )-0.10Al 2 o 3(Molar ratio), the oxides, carbonates or hydroxides of each component are weighed out, mixed and pulverized to obtain a powder. The mixed powder was heated to 1500° C. in a platinum crucible, cooled rapidly, and then pulverized to obtain an oxide powder as a first subcomponent having an average particle diameter of 1 μm or less.

[0041] Then, with 0.66SiO2-0.17TiO 2 -0.15BaO-0.02MnO (molar ratio), weigh out the oxides, carbonates or hydroxides of ea...

Embodiment 2

[0052] In this second embodiment, the case of a laminated forward thermistor of a chip electronic component will be described.

[0053] First, as a raw material, in order to obtain (Ba 0.9998 SM 0.0002 )TiO 3 And weigh BaCO3, TiO 2 and Sm 2 o 3 . Pure water was added to the obtained powder, mixed and pulverized together with cobalt oxide balls in a ball mill for 16 hours, dried and then calcined at 1200° C. for 2 hours to obtain a calcined powder.

[0054] Add polyvinyl butyral as a binder and ethanol as a solvent to the calcined body obtained above, and mix in a ball mill to obtain a ceramic crystal slurry. Then, sheet forming was performed by the doctor blade method using this crystallization slurry to obtain a rectangular ceramic printed circuit board having a thickness of 35 μm.

[0055] Then, a conductive paste containing Ni as a main component was printed on the ceramic printed circuit board to form a conductive paste layer as a layer for internal conductors.

[...

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Abstract

Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used as the internal conductor of a laminated ceramic electronic component. The conductive paste includes at least one of an Ag powder and an Ag alloy powder, a nickel boride powder, an inorganic binder and an organic vehicle, wherein the quantity of the nickel boride powder is within the range of about 5% by weight or more, but less than about 60% by weight of the total paste.

Description

technical field [0001] The present invention relates to a conductive paste, and in particular to a conductive paste suitable for forming terminal electrodes of laminated ceramic electronic components such as laminated ceramic capacitors and laminated forward thermistors. Moreover, this invention relates to the manufacturing method of the laminated ceramic electronic component using this conductive paste, and the obtained laminated ceramic electronic component. Background technique [0002] Conventionally, Ag, Ag-Pd, etc. have been used as internal electrode materials of multilayer ceramic capacitors, which are one type of multilayer ceramic electronic components. However, since these internal electrode materials are expensive, relatively inexpensive base metal Ni has been used. As the terminal electrode material of the laminated ceramic capacitor, Ag, which has good conductivity and can be sintered at low temperature, is used. Furthermore, for example, a Ni layer is formed...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/12C03C8/18H01B1/16H01B1/22H01C7/02H01G4/232H01G4/30
CPCC03C8/18H01B1/16Y10T29/435Y10T29/43H01G4/2325H01G4/12
Inventor 三木武野田悟
Owner MURATA MFG CO LTD
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