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High-silicon aluminum alloy material with high density and controllable components and preparation method

A high-silicon aluminum alloy and dense technology, applied in the field of alloy processing, can solve the problems of reducing strength, plasticity and wear resistance, deteriorating cutting performance, and a large number of holes in the alloy, so as to improve the strength and elastic modulus, and improve the final Density, the effect of high material density

Active Publication Date: 2022-04-08
HARBIN INST OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Several commonly used processes for preparing high-silicon aluminum alloy materials have the following problems: (1) The preparation of high-silicon aluminum alloy materials by smelting and casting will cause coarse plate-like primary silicon and needle-like eutectics in the structure Silicon, severely split the matrix, and stress concentration will occur at the tip, which reduces the strength, plasticity and wear resistance, and deteriorates the cutting performance; (2) the silicon phase in the material structure prepared by the spray deposition method is refined, but the alloy A large number of holes appear in the Si preform, and the density is low; (3) Although the pressure infiltration method can improve the density of the material, it is difficult to prepare the Si preform, and cracks are prone to appear under high pressure.
However, in the traditional single-solid-phase hot-pressing sintering process, the high-content Si phase hinders the diffusion of the AlMgSi10 matrix material, making it difficult to form a metallurgical bond; in the single-liquid-phase sintering process, the low-melting point liquid phase is easy to extrude during the pressurization process, making it difficult to accurately control the composition.

Method used

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  • High-silicon aluminum alloy material with high density and controllable components and preparation method
  • High-silicon aluminum alloy material with high density and controllable components and preparation method

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[0023] A method for preparing a high-density, composition-controllable high-silicon aluminum alloy material, comprising the following steps: including the following steps: AlMgSi 10 AlMgSi was prepared by mixing alloy powder and silicon powder by multi-stage hot pressing and sintering. X Alloys where X is greater than 10.

[0024] In some embodiments of the present invention, a method for preparing a high-density, composition-controllable high-silicon aluminum alloy material includes the following steps:

[0025] AlMgSi 10 Alloy powder and silicon powder are mixed in proportion to obtain mixed powder;

[0026] The mixed powder is subjected to multi-stage hot-press sintering: the parameters of the multi-stage hot-press sintering are: first stage: sintering at 350°C and 0MPa for 30min; second stage: sintering at 580°C and 25MPa for 30min; The third stage: sintering at 10°C above the liquidus temperature and 0 MPa for no more than 30 minutes; the fourth stage: sintering at 580...

Embodiment 1

[0039] AlMgSi10 alloy powder is used as the matrix, Si powder is added, the mixed powder is mixed evenly by planetary ball milling, the mass fraction of Si in the design alloy is 20wt.%, and a multi-stage hot-press sintering process is adopted; the parameters of the multi-stage hot-press sintering are: The first stage: sintering at 350°C and 0MPa for 30min; the second stage: sintering at 580°C and 25MPa for 30min; the third stage: sintering at 10°C higher than the liquidus temperature and 0MPa for no more than 30min; the fourth stage : Sintered at 580°C and 25MPa for 30min. AlMgSi20 alloy was obtained, the density of the alloy was as high as 99.86%, the compressive strength was 270.9MPa, the elastic modulus was 88.33GPa, and the thermal expansion coefficient was 17.2×10 -6 K -1 , The thermal conductivity is 186.4W / (m×K).

[0040] figure 2 It is the scanning diagram corresponding to Example 1. It can be seen from the figure that the primary silicon grains are fine, with a ...

Embodiment 2

[0042] combined with figure 1 , using AlMgSi10 alloy powder as the matrix, plus Si powder, the mixed powder is mixed evenly by planetary ball milling, the mass fraction of Si in the design alloy is 30wt.%, using multi-stage hot pressing sintering process (process parameters such as figure 1 shown); obtain AlMgSi30 alloy, the density of alloy is 98.06%, the compressive strength is 227.8MPa, the elastic modulus is 95.83GPa, and thermal expansion coefficient is 14.9×10 -6 K -1 , The thermal conductivity is 152.3W / (m×K).

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Abstract

The invention belongs to the technical field of alloy processing, and discloses a high-silicon aluminum alloy material with high compactness and controllable components and a preparation method. The preparation method comprises the following steps that after AlMgSi10 alloy powder and silicon powder are mixed, the AlMgSiX alloy is prepared through multi-section hot pressing sintering, and X is larger than 10. The high-silicon aluminum alloy material disclosed by the invention has relatively high strength, elasticity modulus and compactness.

Description

technical field [0001] The invention relates to the technical field of alloy processing, in particular to a high-density, high-silicon aluminum alloy material with controllable composition and a preparation method. Background technique [0002] High-silicon aluminum alloy materials have many outstanding advantages such as low thermal expansion coefficient, good thermal conductivity, high hardness, high specific strength, good wear resistance, and small specific gravity. They are widely used in automobiles, electronics, aviation, aerospace and other fields, especially in Electronic packaging materials and automotive engine piston materials have a wide range of application potential. Several commonly used processes for preparing high-silicon aluminum alloy materials have the following problems: (1) The preparation of high-silicon aluminum alloy materials by smelting and casting will cause coarse plate-like primary silicon and needle-like eutectics in the structure Silicon, se...

Claims

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Application Information

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IPC IPC(8): C22C1/04C22C21/02B22F3/14C22C28/00
Inventor 黄陆军张财伟安琦陈润王存玉胡昌宇王帅耿林张宏伟
Owner HARBIN INST OF TECH
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