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Surface-mounted power inductor and preparation method thereof

A power inductor and chip technology, which is applied in the field of chip power inductors and their preparation, can solve the problems of difficulty in increasing inductance, large coil size, and difficulty in reducing the size of finished inductor products, so as to improve the inductance value, coil size, etc. The effect of reducing the number of turns and reducing the number of coil turns

Pending Publication Date: 2022-04-15
NINGBO ZHONGKE BIPULASI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] One purpose of the present invention is to provide a new type of SMD power inductor design, which solves the problems of large coil size, difficulty in reducing the size of the finished inductor, and difficulty in increasing the inductance in the current SMD power inductor design.

Method used

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  • Surface-mounted power inductor and preparation method thereof
  • Surface-mounted power inductor and preparation method thereof
  • Surface-mounted power inductor and preparation method thereof

Examples

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Effect test

Embodiment 1

[0058] In this embodiment, the soft magnetic alloy center column material is Fe-Si-B-P-Cu amorphous soft magnetic alloy block material, and the soft magnetic alloy composite powder is a composite powder mixed with Fe-Ni soft magnetic alloy powder and iron powder. The agent is epoxy resin, the lubricant used is zinc stearate, and the composite powder is mixed with binder, lubricant and acetone and screened to obtain the target soft magnetic composite powder. The preparation method of the chip power inductor in this embodiment Specifically include the following steps:

[0059] S1. Prefabricated soft magnetic alloy center column: Weigh a certain amount of Fe-Si-B-P-Cu master alloy according to the mass ratio and place it in a vacuum melting furnace for complete melting, pour the soft magnetic alloy liquid into the center column mold, and cool it rapidly Obtain the soft magnetic alloy center column green body, remove the green body and process it to obtain a center column green bo...

Embodiment 2

[0091] In this embodiment, the dimensions of the SMD power inductor are the same as in Embodiment 1, only the number of turns of the coil is reduced to 5.5 turns, and the soft magnetic alloy composite powder is selected from Fe-Si-B-Nb-Cu nanocrystalline soft magnetic alloy The composite powder mixed with powder and iron powder, and the rest of the inductance structure parameters, raw materials, preparation technology and process parameters are the same as those in Example 1, see Example 1 for details. After obtaining the SMD power inductor sample, the average inductance Ls of the sample under the condition of 1V / 1MHz was measured by an impedance analyzer to be 1.032μH, the average saturation current Isat was 4.8A, and the average DC resistance Rdc was 28.2mΩ.

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Abstract

The invention discloses a patch type power inductor which comprises a soft magnetic alloy middle column, a coil, a magnetic powder part and end electrodes. The coil is wound on the magnetically soft alloy middle column, and the magnetic powder part is coated outside an assembly of the magnetically soft alloy middle column and the coil; and two ends of the coil are led out of the magnetic powder part and are respectively connected with the corresponding end electrodes. According to the invention, the amorphous magnetically soft alloy block and the nanocrystalline magnetically soft alloy block are utilized to prepare the middle column of the patch type power inductor, so that the middle column has higher magnetic conductivity than a middle column prepared from magnetically soft alloy powder in the prior art, and the inductance value of the middle column can be greatly improved under the condition that the size of the inductor is not changed or even reduced; or under the condition that the inductance value is kept unchanged, the number of turns of the coil is remarkably reduced, the size of the middle column is reduced, the size of the inductor is reduced, the comprehensive performance is improved, and the surface-mounted power inductor can be developed towards the directions of miniaturization, lightness, thinness, high current, low electromagnetic interference and the like.

Description

technical field [0001] The invention relates to the technical field of inductance elements, in particular to a patch type power inductor and a preparation method thereof. Background technique [0002] SMD power inductors, as a basic electronic component, are widely used in various electronic devices or electronic control circuits. At present, various electronic devices are developing towards miniaturization, light weight, and multi-functionalization. The number of chip power inductors used is increasing, but at the same time, miniaturization, low installation Thickness, large inductance and other new requirements. [0003] The current SMD power inductor is mainly composed of soft magnetic materials, coils, terminal electrodes and other parts, and the soft magnetic materials penetrate the coil and also wrap the outside of the coil to shield the electromagnetic field. The soft magnetic material used in SMD power inductors is generally made of soft magnetic alloy powder throu...

Claims

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Application Information

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IPC IPC(8): H01F27/24H01F27/255H01F27/30H01F41/02
Inventor 余凡陈宏杰龚亚辉
Owner NINGBO ZHONGKE BIPULASI NEW MATERIAL TECH CO LTD
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