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Composite material sheet for microwave circuit substrate, preparation method of composite material sheet and microwave circuit substrate

A technology for circuit substrates and composite materials, applied in circuit substrate materials, printed circuits, printed circuit components, etc., can solve the problems of high water absorption and difficult processing technology, and achieve the effect of increasing molding performance and reducing processing procedures.

Pending Publication Date: 2022-04-19
江西安缔诺科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a composite material sheet for microwave circuit substrates and its preparation method and microwave circuit substrates, which are used to solve the problems in the field of printed circuit board substrates in the prior art. The problems of difficult processing technology and high water absorption when using PTFE composite materials

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  • Composite material sheet for microwave circuit substrate, preparation method of composite material sheet and microwave circuit substrate

Examples

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Comparison scheme
Effect test

Embodiment 1

[0040] This embodiment provides a specific circuit substrate preparation method, including the following steps:

[0041] 1) Weigh 10 kg of PTFE dispersion material and 3 kg of modified silicon dioxide, and mix them for 1 hour with a high-speed blender at a speed of 600 rpm to obtain a uniformly mixed blend.

[0042] 2) Pass the above-mentioned blended material through 40-mesh and 70-mesh sieves respectively, then add kerosene, the amount of kerosene added is 30wt% of the total mass of the blended material, mix well and then mature at 90°C for 1h.

[0043] 3) Put the matured blend into a press to make a round billet, press at 10 MPa, keep the pressure for 5 min, and temperature 70° C. to obtain a cylindrical billet with a length of 100 mm and a diameter of 60 mm.

[0044] 4) Put the above-mentioned cylindrical blank into an extruder, extrude with a pressure of 10 MPa and a die opening width of 150 mm, and finally obtain a sheet with a width of 150 mm and a thickness of 5 mm.

...

Embodiment 2

[0048] This embodiment provides a specific circuit substrate preparation method, including the following steps:

[0049] 1) Weigh 10kg of PTFE dispersion material, 11kg of modified silica, and 1.4kg of composite ceramic powder at a speed of 600rpm, and mix them with a high-speed blender for 1 hour at a speed of 600rpm to obtain a uniformly mixed blend.

[0050] 2) Pass the above-mentioned blended materials through 40 mesh and 70 mesh screens respectively, then add isoparaffin solvent oil, the addition of the isoparaffin solvent oil is 30wt% of the total mass of the blend material, after mixing uniformly Mature at 90°C for 1h.

[0051] 3) Put the cured blend into a press to make a cylindrical billet, press at 15 MPa, keep the pressure for 5 minutes, and temperature 70° C. to obtain a cylindrical billet with a length of 100 mm and a diameter of 60 mm.

[0052] 4) Put the above-mentioned cylindrical blank into an extruder, extrude with a pressure of 15Mpa and a die width of 150mm,...

Embodiment 3

[0056] This embodiment provides a specific circuit substrate preparation method, including the following steps:

[0057] 1) Weigh 10kg of PTFE dispersion material, 11kg of modified silica, and 1.4kg of composite ceramic powder at a speed of 600rpm, and mix them with a high-speed blender for 1 hour at a speed of 600rpm to obtain a uniformly mixed blend.

[0058] 2) Pass the above blended materials through 40 mesh and 70 mesh screens respectively, then add isoparaffin solvent oil, the addition amount of the isoparaffin solvent oil is 30wt% of the blend material mass, mix evenly and mature at 90°C 1h.

[0059] 3) Put the matured blend into a press to make a round billet, press at 15 MPa, keep the pressure for 5 min, and temperature 70° C. to obtain a cylindrical billet with a length of 100 mm and a diameter of 60 mm.

[0060] 4) Put the above-mentioned cylindrical blank into an extruder, extrude with a pressure of 15Mpa and a die width of 150mm to obtain a sheet with a width of ...

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Abstract

The invention provides a composite material sheet for a microwave circuit substrate, a preparation method of the composite material sheet and the microwave circuit substrate. The preparation method comprises the following steps: blending polytetrafluoroethylene resin and a modified filler to obtain a blended material; adding solvent oil into the blended material, mixing and curing to obtain a cured material; pressing the cured material into a cylindrical blank, and extruding the cylindrical blank into a sheet; and finally, carrying out sintering treatment at 200-400 DEG C. According to the sheet for the microwave circuit substrate, industrial wastewater is not generated in the whole processing process; the die head is adopted to directly extrude sheets, and the width of the sheets can be controlled, so that the processing procedures are reduced; according to the manufacturing method, solvent oil is added and cured before blank pressing, the forming performance of an original blank is improved, a sheet is directly extruded subsequently, the solvent oil is extruded in the forming process, the porosity of the printed circuit board is reduced, and a final product has stable dielectric property and low water absorption rate.

Description

technical field [0001] The invention belongs to the field of printed circuit board substrates, in particular to a printed circuit substrate and a manufacturing method thereof. Background technique [0002] With the development of 5G technology, traditional resin substrates have been difficult to use in the high-frequency and high-speed millimeter wave field, so related companies and scientific research institutions have started research on LCP, PPO, PI and PTFE substrates. Due to the excellent dielectric properties of PTFE resin, it is the best choice for 5G materials; however, the difficulty of processing and high thermal expansion of PTFE resin hinders its promotion in the millimeter wave field. Therefore, how to process and shape PTFE resin and how to reduce its expansion coefficient has become the first problem to be solved. [0003] The main processing methods of sheet materials include: molding, turning, calendering, etc., but there are few reports on the use of extru...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08J3/205C08L27/18C08K9/00C08K3/36C08K3/38C08K3/34C08K3/22C08K3/00H05K1/03H05K1/05
CPCC08J5/18C08J3/205H05K1/0353H05K1/056C08J2327/18C08K9/00C08K3/36C08K2003/385C08K3/34C08K2003/2241C08K3/00
Inventor 钱勇军杜坤鹏韩瑞刘锋侯李明
Owner 江西安缔诺科技有限公司
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