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Preparation method of mixed fluid glass chip

A technology of glass chips and mixed fluids, applied in chemical instruments and methods, manufacturing tools, metal processing equipment, etc., can solve problems such as chipping, limited processing, and affecting the quality of structural edges, so as to ensure bonding tightness, Reduce processing difficulty, improve surface smoothness and cleanliness

Pending Publication Date: 2022-05-06
嘉兴普芯技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Mold imprinting is mainly used for the preparation of fluid chips of resin and other materials. This method puts forward strict requirements on the manufacturing accuracy and surface quality of the mold, and changing the structure requires remaking the mold. CNC machine tool processing and high-power laser ablation methods are used in processing When using brittle materials such as glass, it is easy to produce edge chipping and affect the quality of the edge of the structure. In addition, the traditional preparation method is limited by the processing process and cannot process any three-dimensional structure; therefore, a new solution needs to be proposed to solve this problem

Method used

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  • Preparation method of mixed fluid glass chip

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Embodiment one: a kind of preparation method of mixed fluid glass chip, comprises the following steps:

[0056] S1. Simulation structure segmentation step

[0057] S1.1. Design and finalize the fluid chip 1 through three-dimensional software to ensure that the flow channel meets the design requirements.

[0058] S1.2. Simulate and divide each layer structure 2 along the thickness direction of the designed and finalized fluid chip. The division requirement is to reduce the internal hollow structure of each layer structure 2 under the premise of avoiding independent components.

[0059] S2, single-layer glass preparation steps

[0060] S2.1. According to the specific structure and processing requirements of each layer structure 2, select a glass plate material with an appropriate size, and process the glass plate material by etching.

[0061] Etching processing method is ultrafast laser processing, which includes the following steps:

[0062] S2.1a.1. Write the control...

Embodiment 2

[0080] Embodiment 2: The difference between this embodiment and Embodiment 1 lies in the difference in etching method and processing method.

[0081] The etching processing method is an anisotropic wet etching processing, which includes the following steps:

[0082] S2.1b.1. Fully clean the surface of the selected flat glass material to remove organic and inorganic impurities, and place the flat glass material in a plasma cleaning machine for surface treatment.

[0083] S2.1b.2. Place the surface-treated glass plate material in an ultra-clean environment, and cover the surface with a mask material, which is any one of photoresist, metal film or semiconductor film.

[0084] S2.1b.3. Place the glass plate material under the laser system, place the structure with the mask facing the laser, fix the lower surface, focus the laser on the mask, and then scan and remove part of the mask material according to the designed structure , finally forming a mask pattern;

[0085] S2.1b.4. ...

Embodiment 3

[0087] Embodiment 3: The difference between this embodiment and Embodiment 1 and Embodiment 2 lies in the difference of etching method and processing method.

[0088] The etching processing method is a dry etching processing, which includes the following steps:

[0089] S2.1c.1. Fully clean the surface of the selected glass plate material to remove organic and inorganic impurities, and place the glass plate material in a plasma cleaning machine for surface treatment.

[0090] S2.1c.2. Place the surface-treated glass plate material in an ultra-clean environment, and cover its surface with a mask material.

[0091] S2.1c.3. Process a mask pattern on the mask material by using photolithography or laser scanning.

[0092] S2.1c.4. Use low-pressure reactive ion beam or electron beam to bombard the surface of the glass plate material, the area not covered by the mask material is etched and removed, and the area covered by the mask material is protected and will not be removed.

[...

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Abstract

The invention discloses a preparation method of a mixed fluid glass chip, relates to a fluid chip, and aims to solve the problem that a traditional preparation method is limited by a processing process and cannot be used for processing any three-dimensional structure, and the preparation method of the mixed fluid glass chip is characterized by comprising the following steps: S1, a simulation structure segmentation step; s2, a single-layer glass preparation step; and S3, a bonding step. According to the preparation method of the mixed fluid glass chip, a complex internal three-dimensional to-be-processed structure is divided into multiple layers of processing tasks, so that the technical effect of processing any three-dimensional structure can be achieved, a mold is not needed, the production flexibility is improved, edge breakage caused by hard processing is avoided, and the production efficiency is improved. And the quality of processing structure edges is improved.

Description

technical field [0001] The invention relates to a fluid chip, more specifically, it relates to a method for preparing a mixed fluid glass chip. Background technique [0002] In recent years, fields such as chemical production, biopharmaceuticals, and material synthesis have been developing in a green, sustainable, safe, and efficient direction. Drawing on the successful experience of miniaturization and integration of integrated circuit chips, fluidic chips can provide more precise fluid control and more efficient fluid processing. The fluid chip contains a large number of millimeter-scale and smaller-sized fluid channels, which can realize efficient mixing and precise temperature control of various fluid materials. Traditional methods for preparing fluidic chips include mold imprinting, CNC machining, and high-power laser ablation. [0003] Mold imprinting is mainly used for the preparation of fluid chips of resin and other materials. This method puts forward strict requi...

Claims

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Application Information

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IPC IPC(8): B01L3/00C03C15/00C03C23/00C03C27/10B24B29/02B24B9/10
CPCB01L3/502707C03C15/00C03C23/0075C03C23/0025C03C23/004C03C27/10B24B29/02B24B9/10
Inventor 王鹏
Owner 嘉兴普芯技术有限公司
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