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Preparation method of silver-tungsten composite copper alloy electric contact material

A technology of electrical contact material and silver layer, applied in the direction of contact material, metal material coating process, contact, etc., can solve the problems of affecting the bonding strength of copper and silver interface, increasing the amount of silver powder, and low bonding strength, etc., to achieve shortening The effect of production cycle, improved density, and high interface bonding strength

Pending Publication Date: 2022-05-13
WENZHOU LONGSUN ELECTRICAL ALLOY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this application, it is necessary to compound the silver layer on the silver-tungsten green body, and also need to plate silver on the copper sheet. These two steps all need to use a certain amount of silver, and the amount of silver powder will increase instead, which not only leads to an increase in cost, but also Its performance is not as good as that of direct composite silver layer
Second, when the copper sheet is silver-plated or when the AgW50 body is combined with the silver-plated Cu sheet, a small amount of oil and impurities may be easily introduced in the production process, which will affect the interface bonding strength between copper and silver, making the AgW50 layer and There is a phenomenon of low bonding strength in local areas between the welding Cu layers, and there is a risk of contact falling off during the use of electrical appliances

Method used

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  • Preparation method of silver-tungsten composite copper alloy electric contact material
  • Preparation method of silver-tungsten composite copper alloy electric contact material
  • Preparation method of silver-tungsten composite copper alloy electric contact material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] A preparation method of a silver-tungsten clad copper alloy electrical contact material, the preparation process is as follows figure 1 shown, including the following steps:

[0035] (1) According to parts by mass, 40 parts of tungsten, 2 parts of Ni, 1 part of La 2 o 3 , 57 parts of silver dry mixed, after mixing for 1.5h, mixed powder was obtained. The mixed powder is pressed into an ingot in an isostatic pressing device, the diameter of the ingot is 60 mm, the length is 150 mm, and the isostatic pressing pressure is 50 MPa. The ingot was sintered in a hydrogen atmosphere, the sintering temperature was 850°C, and the sintering time was 6 hours to obtain a silver-tungsten ingot.

[0036] (2) According to parts by mass, 4 parts of diamond and 3 parts of In 2 o 3 , 93 parts of copper were dry mixed, and after mixing for 1.5 hours, copper alloy powder was obtained.

[0037] (3) Sand blast the surface of the silver-tungsten ingot after lathing, the sand blasting meth...

Embodiment 2

[0042] This embodiment is basically the same as Embodiment 1, and its difference only lies in:

[0043] No turning step is performed.

Embodiment 3

[0045] This embodiment is basically the same as Embodiment 1, and its difference only lies in:

[0046] Cut off the head and tail of the strip obtained by reverse hot extrusion, and roll it to the required thickness on a cold rolling mill without annealing in the middle. The strip rolled to the desired thickness is punched out of the silver-tungsten / copper alloy electrical contact profile with a stamping die.

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Abstract

The invention relates to the technical field of electric contact materials, in particular to a preparation method of a silver-tungsten composite copper alloy electric contact material. Comprising the following steps that (1) silver, tungsten and a first additive are mixed and then subjected to ingot pressing and sintering to prepare a silver-tungsten ingot blank, and the first additive comprises one or more of transition metal and rare earth oxide; (2) mixing copper, diamond and a second additive to prepare copper alloy powder, wherein the second additive comprises oxide of ductile metal; (3) carrying out sand blasting treatment on the surface of the silver-tungsten ingot blank; (4) the surface of the silver-tungsten ingot blank subjected to sand blasting treatment is coated with the copper alloy powder, and after sintering, a copper-coated alloy ingot blank is prepared through hot repressing; and (5) the copper-clad alloy ingot blank is made into the profile. According to the method, through mixed use of the first additive, the second additive, the diamond and the blast sand, the interface bonding strength between the silver-tungsten ingot blank and the copper alloy layer is enhanced from the physical level and the chemical level, and the tightly-bonded copper-clad alloy ingot blank is obtained.

Description

technical field [0001] The invention relates to the technical field of electrical contact materials, in particular to a preparation method of a silver-tungsten-copper-clad alloy electrical contact material. Background technique [0002] Silver-tungsten electrical contact materials not only have the good electrical conductivity and thermal conductivity of silver, but also have the characteristics of high melting point, high hardness, high breaking, arc erosion resistance, wear resistance, welding resistance, and less material transfer of tungsten. They are widely used In universal circuit breakers, molded case circuit breakers, leakage circuit breakers and other fields. At present, there are two main methods for the preparation of silver-tungsten electrical contact materials: (1) solid-phase method: contact materials are obtained by mixing powder, forming, sintering, and repressing, but the silver-tungsten electrical contact materials prepared by this method are relatively T...

Claims

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Application Information

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IPC IPC(8): H01H11/04H01H1/04H01H1/0237C22C1/05C22C5/06C22C32/00C23C26/00
CPCH01H11/048H01H1/04H01H1/0237C22C1/05C22C5/06C22C32/0084C23C26/00
Inventor 蒋义斌蒋源于秀清郑大受陈文孝胡登炜
Owner WENZHOU LONGSUN ELECTRICAL ALLOY CO LTD
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