Preparation method of silver-tungsten composite copper alloy electric contact material

A technology of electrical contact material and silver layer, applied in the direction of contact material, metal material coating process, contact, etc., can solve the problems of affecting the bonding strength of copper and silver interface, increasing the amount of silver powder, and low bonding strength, etc., to achieve shortening The effect of production cycle, improved density, and high interface bonding strength

Pending Publication Date: 2022-05-13
WENZHOU LONGSUN ELECTRICAL ALLOY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this application, it is necessary to compound the silver layer on the silver-tungsten green body, and also need to plate silver on the copper sheet. These two steps all need to use a certain amount of silver, and the amount of silver powder will increase instead, which not only leads to an increase in cost, but also Its performance is not as good as that of direct composite silver layer
Second, when the copper sheet is silver-

Method used

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  • Preparation method of silver-tungsten composite copper alloy electric contact material
  • Preparation method of silver-tungsten composite copper alloy electric contact material
  • Preparation method of silver-tungsten composite copper alloy electric contact material

Examples

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[0033] Example 1

[0034] Preparation method of silver-tungsten complex copper alloy electrical contact material, such as preparation process Figure 1 shown, including the following steps:

[0035] (1) According to the mass part, 40 parts tungsten, 2 parts Ni, 1 part La 2 O 3 57 parts of silver dry mixing, mixing for 1.5h, to obtain a mixed powder. The mixed powder is pressed into ingot blanks in isostatic pressing equipment with a diameter of 60mm, a length of 150mm, and an isostatic pressure of 50MPa. The ingot blank is sintered in a hydrogen atmosphere, the sintering temperature is 850 °C, and the sintering time is 6h, and the silver tungsten ingot blank is obtained.

[0036] (2) According to the mass part, put 4 parts of diamond, 3 parts of In 2 O 3 93 parts of copper dry mixing, mixed for 1.5h, to obtain copper alloy powder.

[0037] (3) The surface of the silver tungsten ingot blank after the processing of the car is sandblasted, the sand blasting method is dry, the particle...

Example Embodiment

[0041] Example 2

[0042] The present embodiment is substantially the same as Example 1, the differences therein are only in:

[0043] The turning step is not performed.

Example Embodiment

[0044] Example 3

[0045] The present embodiment is substantially the same as Example 1, the differences therein are only in:

[0046] The head and tail of the strip obtained by reverse hot extrusion are cut off and rolled on a cold rolling mill to the desired thickness without annealing. The strip is rolled to the desired thickness using a stamping die to produce a silver tungsten / copper alloy electrical contact profile.

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Abstract

The invention relates to the technical field of electric contact materials, in particular to a preparation method of a silver-tungsten composite copper alloy electric contact material. Comprising the following steps that (1) silver, tungsten and a first additive are mixed and then subjected to ingot pressing and sintering to prepare a silver-tungsten ingot blank, and the first additive comprises one or more of transition metal and rare earth oxide; (2) mixing copper, diamond and a second additive to prepare copper alloy powder, wherein the second additive comprises oxide of ductile metal; (3) carrying out sand blasting treatment on the surface of the silver-tungsten ingot blank; (4) the surface of the silver-tungsten ingot blank subjected to sand blasting treatment is coated with the copper alloy powder, and after sintering, a copper-coated alloy ingot blank is prepared through hot repressing; and (5) the copper-clad alloy ingot blank is made into the profile. According to the method, through mixed use of the first additive, the second additive, the diamond and the blast sand, the interface bonding strength between the silver-tungsten ingot blank and the copper alloy layer is enhanced from the physical level and the chemical level, and the tightly-bonded copper-clad alloy ingot blank is obtained.

Description

technical field [0001] The invention relates to the technical field of electrical contact materials, in particular to a preparation method of a silver-tungsten-copper-clad alloy electrical contact material. Background technique [0002] Silver-tungsten electrical contact materials not only have the good electrical conductivity and thermal conductivity of silver, but also have the characteristics of high melting point, high hardness, high breaking, arc erosion resistance, wear resistance, welding resistance, and less material transfer of tungsten. They are widely used In universal circuit breakers, molded case circuit breakers, leakage circuit breakers and other fields. At present, there are two main methods for the preparation of silver-tungsten electrical contact materials: (1) solid-phase method: contact materials are obtained by mixing powder, forming, sintering, and repressing, but the silver-tungsten electrical contact materials prepared by this method are relatively T...

Claims

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Application Information

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IPC IPC(8): H01H11/04H01H1/04H01H1/0237C22C1/05C22C5/06C22C32/00C23C26/00
CPCH01H11/048H01H1/04H01H1/0237C22C1/05C22C5/06C22C32/0084C23C26/00
Inventor 蒋义斌蒋源于秀清郑大受陈文孝胡登炜
Owner WENZHOU LONGSUN ELECTRICAL ALLOY CO LTD
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