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Curable composition containing polyphenylene ether, dry film, preform, cured product, laminate, and electronic component

A technology of curable composition and polyphenylene ether, which is applied in printed circuit components, electrical components, electronic equipment, etc., can solve the problems of increased transmission loss, signal attenuation, heat release, etc., and achieve excellent mechanical properties, excellent low Effect of Dielectric Properties

Pending Publication Date: 2022-05-13
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the case of using epoxy resin or the like as a circuit board material, since the relative permittivity (Dk) and dielectric loss tangent (Df) are not sufficiently low, the higher the frequency, the more transmission due to dielectric loss will be caused. The increase of loss has caused problems such as signal attenuation and heat release.

Method used

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  • Curable composition containing polyphenylene ether, dry film, preform, cured product, laminate, and electronic component
  • Curable composition containing polyphenylene ether, dry film, preform, cured product, laminate, and electronic component
  • Curable composition containing polyphenylene ether, dry film, preform, cured product, laminate, and electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0454] To branched PPE resin-1: 17.4 parts by mass and styrene elastomer (Asahi Kasei Corporation: trade name "H1051"): 5.7 parts by mass, add cyclohexanone as a solvent: 60 parts by mass, and mix at 40°C For 30 minutes, stir to completely dissolve.

[0455] To the PPE resin solution thus obtained, TAIC (manufactured by Mitsubishi Chemical Corporation): 11.6 parts by mass and spherical silica (manufactured by Admatechs Corporation: trade name "SC2500-SVJ") were added as a crosslinking type curing agent: 94.4 parts by mass, OP935 (manufactured by Clariant Chemicals Ltd.) as a flame retardant: 11.1 parts by mass, maleimide resin (manufactured by Designer Molecules Inc.: trade name "DMI-7005", Mw=49000, solid content 25 Mass %): 23.2 mass parts, after mixing this, it disperse|distributed with a three-roll mill.

[0456] Finally, 0.58 parts by mass of α,α'-bis(t-butylperoxym-isopropyl)benzene (manufactured by NOF Corporation: trade name "PERBUTYL P") was blended as a peroxide, an...

Embodiment 2-8

[0458]

[0459] As shown in Table I-1, the resin compositions of Examples 2-8 and Comparative Examples 1-3 were obtained in the same manner as in Example 1, except that the PPE resin and maleimide resin used and their contents were changed. of varnish.

[0460] The maleimide resins shown in Table I-1 are as follows.

[0461] BMI-689: Made by Designer Molecules Inc., Mw=689

[0462] BMI-3000J: Made by Designer Molecules Inc., Mw=3000

[0463] BMI-1500: Made by Designer Molecules Inc., Mw=1500

[0464]BMI-4000: Made by Daiwa Chemical Industry Co., Ltd., Mw=570

[0465] For the organic solvent of the varnish of each resin composition, when using branched PPE resins soluble in cyclohexanone-1 and 2, use cyclohexanone, and use non-branched PPE resin A that is insoluble in cyclohexanone , In the case of B, use chloroform.

[0466] >

[0467] The following evaluation was performed about the varnish of the resin composition of each Example and each comparative example.

[046...

Embodiment 2-4

[0611]

[0612] As shown in Table III-1, the resin composition of Example 2-4 and Comparative Example 1-2 was obtained similarly to Example 1 except having changed the PPE used, polystyrene copolymer, and its content.

[0613] The reactive styrene copolymers shown in Table III-1 are as follows.

[0614] Product name: Epocros (manufactured by Nippon Shokubai Co., Ltd.)

[0615] Styrene Copolymers Containing Oxazoline Groups

[0616] Number average molecular weight: 70000

[0617] PDI: 2.28

[0618] Oxazoline group amount: 0.27mmol / g

[0619] Product name: SMA Resin (manufactured by Nippon Shokubai Co., Ltd.)

[0620] Styrene copolymers containing anhydride groups (maleic anhydride groups)

[0621] Weight average molecular weight: 14400

[0622] Acid anhydride group amount: 0.27mmol / g

[0623] As the organic solvent of each resin composition, cyclohexanone was used when branched PPE soluble in cyclohexanone was used, and chloroform was used when unbranched PPE insoluble...

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Abstract

Provided is a curable composition which maintains low dielectric properties, is soluble in various solvents (organic solvents other than highly toxic organic solvents, such as cyclohexanone), and which has a cured film having excellent mechanical properties. Provided is a curable composition characterized by containing: a polyphenylene ether which is obtained from a starting material phenol containing a phenol satisfying at least condition 1 (having a hydrogen atom in an ortho-position and a para-position), has a slope of less than 0.6 as calculated from a conformational map, and has a functional group containing an unsaturated carbon bond; and at least one of a compound containing at least one maleimide group in one molecule, a triazine compound containing at least one thiol group, and crosslinked polystyrene particles.

Description

technical field [0001] The present invention relates to a curable composition containing polyphenylene ether, and further relates to a dry film, a preform, a cured product, a laminate, and an electronic component using the curable composition. Background technique [0002] Due to the spread of large-capacity high-speed communication represented by the fifth-generation mobile communication system (5G) and millimeter-wave radar for ADAS (advanced driver assistance system) for automobiles, the frequency of communication equipment signals is gradually increasing. [0003] However, in the case of using epoxy resin or the like as a circuit board material, since the relative permittivity (Dk) and dielectric loss tangent (Df) are not sufficiently low, the higher the frequency, the more transmission due to dielectric loss will be caused. The increase in loss causes problems such as signal attenuation and heat release. Therefore, polyphenylene ether having excellent low dielectric pr...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L25/08C08K3/36C08K7/18C08J5/24H05K1/03B32B27/28B32B15/08
CPCC08L71/12C08J5/24H05K1/03H05K1/0373H05K1/0366B32B15/08B32B27/285C08L25/08C08K3/36C08K7/18B32B5/00B32B5/28B32B27/00C08L35/00C08J5/244C08J5/246C08J5/18C08J2371/12C08J2409/06C08L71/126C08G65/485C08L53/025B32B17/04B32B5/24B32B15/14C08K5/3415C08K5/3477C08K5/378C08L25/06B32B2305/076B32B2260/021B32B2260/046B32B2262/101B32B2457/00C08F212/08C08G2650/20C08J2325/06C08J2371/02C08K5/3492C08K5/37
Inventor 能坂麻美松村聪子石川信广
Owner TAIYO INK MFG
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