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High-temperature-resistant photocuring 3D printing resin material, preparation method, printing method and application

A 3D printing and resin material technology, applied in the direction of additive processing, etc., can solve the problems such as temperature resistance, mechanical strength and flexibility that cannot be comprehensively considered, affect the accuracy and surface state of printed parts, and cannot be applied in the medical field on a large scale. , to achieve the effect of being conducive to industrial production and manufacturing, fast curing speed and good toughness

Pending Publication Date: 2022-05-20
湖南增材精准医疗研究院有限公司
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  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, most of the existing high-temperature photocurable resins are mainly used in SLA (stereolithography), and there are properties such as temperature resistance, mechanical strength, and flexibility that cannot be comprehensively considered. Bacteria can only be sterilized by low-temperature sterilization technology, and the curing reaction rate of the entire resin system is slow, and the shrinkage is large after complete curing, which affects the accuracy and surface state of the printed parts
Although the Chinese published patent texts CN 110724236A and CN 109957213A have good high temperature resistance and mechanical properties, but the toughness is not high, they are not suitable for printing medical guide plates, which will cause the guide plates to break during actual use, seriously affecting the utility, and the formula The high content of photoinitiator in the medium will lead to excessive residual toxic substances, which is not suitable for application in the medical field, and the formulation components are diverse, some components are costly, and the preparation process is relatively complicated, so it cannot be used in the medical field on a large scale

Method used

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  • High-temperature-resistant photocuring 3D printing resin material, preparation method, printing method and application

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preparation example Construction

[0032] The present invention provides a method for preparing the above-mentioned high temperature resistant photocurable 3D printing resin material, comprising the following steps:

[0033] (1) Stir and mix the reactive diluent monomer and photoinitiator under light-shielding conditions until completely transparent;

[0034] (2) After the material system in step (1) is transparent, under heating conditions, add high-temperature-resistant monomers and polyurethane acrylate oligomers in turn and stir until the system is completely transparent;

[0035] (3) Under the same heating conditions, mechanically stir for 60-90min, control the speed of 500-1000rpm, disperse evenly, and perform vacuum defoaming to obtain a high-temperature resistant light-curable 3D printing resin material.

[0036] The heating conditions in steps (2)-(3) refer to heating to 40-60°C.

[0037] The present invention also provides a 3D printing method for the above-mentioned high-temperature-resistant light-...

Embodiment 1

[0039] A high temperature resistant photocurable 3D printing resin material is prepared by the following steps:

[0040] (1) Weigh 50g of N-acryloylmorpholine (reactive diluent monomer) and 5g of (2,4,6-trimethylbenzoyl)diphenylphosphine oxide (photoinitiator) under light-shading conditions Stir to mix until completely transparent;

[0041] (2) After the material system in step (1) is transparent, add 60g of tris(2-hydroxyethyl)isocyanurate triacrylate (high temperature resistant monomer) and 90g of trifunctional phenolic aldehyde under heating conditions Epoxy resin (oligomer, viscosity 20000-30000cps / 25°C), stirred until the system is completely transparent, vacuum defoaming after mechanical stirring is completely uniform, and high temperature resistant photocurable 3D printing resin material is obtained.

[0042] Put the obtained 3D printing resin material into the resin tank of the DLP type 3D printer, set the printing model and parameters, the printing model is a mechani...

Embodiment 2

[0044] A high temperature resistant photocurable 3D printing resin material is prepared by the following steps:

[0045] (1) Weigh 50g of N-acryloylmorpholine (reactive diluent monomer) and 5g of (2,4,6-trimethylbenzoyl)diphenylphosphine oxide (photoinitiator) under light-shading conditions Stir to mix until completely transparent;

[0046] (2) After the material system in step (1) is transparent, add 60g of tris(2-hydroxyethyl)isocyanurate triacrylate (high temperature resistant monomer) and 90g of hexafunctional polyurethane in turn under heating conditions Acrylate (oligomer, viscosity 20,000-40,000cps / 25°C) is stirred until the system is completely transparent. After the mechanical stirring is completely uniform, vacuum defoaming is obtained, and a high temperature resistant light-curable 3D printing resin material is obtained.

[0047] Put the obtained 3D printing resin material into the resin tank of the DLP type 3D printer, set the printing model and parameters, the pr...

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Abstract

The invention discloses a high-temperature-resistant photocuring 3D printing resin material which is prepared from the following components in parts by mass: 15 to 25 parts of active diluent monomer, 30 to 40 parts of high-temperature-resistant monomer, 40 to 55 parts of urethane acrylate oligomer and 1 to 3 parts of photoinitiator, the high temperature resistant monomer is one or more of tris (2-hydroxyethyl) isocyanuric acid triacrylate, tricyclodecane dimethyl alcohol diacrylate and isobornyl methacrylate; and the polyurethane acrylate oligomer is one or more of two-functionality aliphatic polyurethane acrylate, two-functionality aromatic polyurethane acrylate, six-functionality polyurethane acrylate, three-functionality polycarboacrylate and three-functionality novolac epoxy resin. The high-temperature-resistant light-cured 3D printing resin material disclosed by the invention is relatively low in viscosity, high in curing speed, excellent in temperature resistance and good in mechanical strength and flexibility. The invention further discloses a preparation method, a printing method and application of the high-temperature-resistant photocuring 3D printing resin material.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a high-temperature-resistant photocurable 3D printing resin material, a preparation method, a printing method and an application. Background technique [0002] 3D printing technology can also be called additive manufacturing technology. It first appeared in the 1980s. Revolutionary processing and manufacturing technology. The basic principle is to design and reconstruct a three-dimensional digital model, slice the model layer by layer, and use lasers, electron beams, and ultraviolet light sources to print and accumulate metal powder, ceramic powder, plastics, and other materials layer by layer, and finally superimpose and shape them. physical product. [0003] After decades of development, 3D printing technology has achieved rapid development in the fields of biomedicine, aerospace and automobile manufacturing, and cultural and creative education. The key application...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/10C08F283/00C08F220/58C08F222/22C08F222/14C08F2/48B33Y70/00
CPCC08F283/105C08F283/008C08F2/48B33Y70/00C08F220/58C08F222/103C08F222/102
Inventor 李江洪陈少博马致远王志峰
Owner 湖南增材精准医疗研究院有限公司
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