Flexible temperature sensor comprising microstructure and preparation method

A temperature sensor and microstructure technology, applied in sensors, thermometers, thermometers, etc. with electrical/magnetic components directly sensitive to heat, can solve problems such as unfavorable temperature monitoring, artifacts, poor skin fit, etc., to avoid Motion artifacts, improved accuracy, reduced impact effects

Pending Publication Date: 2022-05-27
HANGZHOU DIANZI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As a commonly used sensor type, the temperature sensor is a semiconductor device that uses the characteristics of the resistance of NTC to change with temperature to convert non-electrical physical quantities into electrical quantities, so that precise temperature measurement and automatic control can be performed. It can be used to monitor human body temperature , with the development of flexible and wearable technology, the development of temperature sensors also tends to be flexible, but common temperature sensors are only flexible, can be bent, and can be attached to the skin for signal collection, but the temperature sensor will move when the human body moves, Poor adhesion to the epidermis, prone to motion artifacts, not conducive to long-term temperature monitoring
[0005] The Chinese patent with the publication number CN201922165742.0 discloses a flexible patch temperature sensor, including a flexible substrate, a wire mesh, a flexible insulating layer and a sensor array. Since the flexible substrate, the wire mesh and the flexible insulating layer are all flexible Therefore, these materials themselves can be bent under the action of external force, which can be suitable for complicated surface conditions such as complex structural design, limited layout space, or the position of measuring points of structural parts is curved surface, cylindrical surface, etc. The epidermis fits well, but under dynamic conditions, there will still be relative displacement with the epidermal tissue, which will cause artifacts and affect the accuracy of temperature monitoring

Method used

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  • Flexible temperature sensor comprising microstructure and preparation method
  • Flexible temperature sensor comprising microstructure and preparation method
  • Flexible temperature sensor comprising microstructure and preparation method

Examples

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preparation example Construction

[0040] Follow the preparation method 31 of a flexible temperature sensor 31 comprising a microstructure, the steps are as follows:

[0041] K1. Preparation of a monolithic substrate with microstructure:

[0042] Select the silicon wafer, clean it, soak it in acetone, and then use ethanol to clean the residual acetone, then wash it with deionized water, blow dry it with nitrogen, bombard the surface of the silicon wafer with argon and oxygen in a plasma cleaning machine, remove the oxide layer, spin the photoresist on the surface of the silicon wafer, and dry it on the heating plate or oven after spinning;

[0043] Photoetching using the first mask version for microstructure positioning as a lithography template:

[0044] K11. Lithography: open the lithography machine, place the first mask version for microstructure positioning as a lithography template on the lithography machine, place the sample on the stage, level the operation, adjust the sample position appropriately so that t...

Embodiment 1

[0065]One kind of flexible temperature sensor 31 comprising a microstructure, comprising a substrate 1 having a cone microstructure disposed sequentially from bottom to top, a first flexible layer 2, a conductive layer 3, a second flexible layer 6, the cone microstructure 4 is integrally molded in the substrate, the top of the cone microstructure 4 is convex from the second flexible layer 6, the conductive layer 3 comprises a temperature sensor 31, an output component 32 for outputting a temperature signal, the output assembly comprises a temperature signal interface 33, One end is connected to the temperature signal interface 33 and the other end is connected to the temperature sensor 31 of the temperature signal output wire 34.

[0066] The cone microstructure 4 comprises at least 4, the cone microstructure 4 is distributed around the temperature sensor 31.

[0067] The height of the cone microstructure 4 is equal.

[0068] The height of the cone microstructure 4 is 80-200 μm.

...

Embodiment 2

[0073] One kind of flexible temperature sensor 31 comprising a microstructure, comprising a substrate 1 having a cone microstructure disposed sequentially from bottom to top, a first flexible layer 2, a conductive layer 3, a second flexible layer 6, the cone microstructure 4 is integrally molded in the substrate, the top of the cone microstructure 4 is convex from the second flexible layer 6, the conductive layer 3 comprises a temperature sensor 31, an output component 32 for outputting a temperature signal, the output assembly comprises a temperature signal interface 33, One end is connected to the temperature signal interface 33 and the other end is connected to the temperature sensor 31 of the temperature signal output wire 34.

[0074] The cone microstructure 4 comprises at least 4, the cone microstructure 4 is distributed around the temperature sensor 31.

[0075] The height of the cone microstructure 4 is equal.

[0076] The height of the cone microstructure 4 is 80-200 μm. ...

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Abstract

The invention discloses a flexible temperature sensor comprising a microstructure and a preparation method, the flexible temperature sensor comprising the microstructure comprises a substrate, a first flexible layer, a conductive layer and a second flexible layer which are sequentially arranged from bottom to top, the substrate is provided with a conical microstructure, the conical microstructure is integrally formed on the substrate, the first flexible layer is arranged on the substrate, and the conductive layer is arranged on the second flexible layer. The top of the conical microstructure protrudes out of the second flexible layer, the conductive layer comprises a temperature sensor and an output assembly used for outputting a temperature signal, the output assembly comprises a temperature signal interface and a temperature signal output wire, one end of the temperature signal output wire is connected with the temperature signal interface, and the other end of the temperature signal output wire is connected with the temperature sensor. The flexible temperature sensor has high fitting degree with the skin, does not generate motion artifacts, and improves the accuracy of monitoring signals of the flexible temperature sensor.

Description

Technical field [0001] The present invention relates to the field of micromachining technology for flexible electronic devices, specifically to a flexible temperature sensor comprising a microstructure and a preparation method thereof. [0002] Technical background [0003] With the rapid development of electronic science and technology, portable smart wearable electronic products have gradually entered the public eye, especially in the aspects of human health tracking and real-time monitoring of physiological signals. In order to meet people's pursuit of a healthy body and a better life, more and more scientific researchers are based on the field of flexible electronics, committed to the development of flexible wearable devices that can be used for human physiological signal monitoring. [0004] Temperature sensor as a commonly used sensor type, is the use of NTC resistance with the temperature change characteristics, the non-electrical physical quantity into electrical quantity,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A61B5/01A61B5/00G01K7/16
CPCA61B5/01A61B5/685G01K7/16
Inventor 纪华伟王明雨杨帆徐泽吕博戚安琪
Owner HANGZHOU DIANZI UNIV
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