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Preparation method and application of light-cured epoxy polyimide

A technology of epoxy polyimide and polyimide powder, which is applied in the direction of organic chemistry, can solve the problems of oxygen inhibition, molecular oxygen sensitivity, etc., and achieve good thermal stability, simple method, and low dielectric constant. Effect

Pending Publication Date: 2022-06-03
SUN YAT SEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since most of the existing photocurable polyimide materials are prepared by free radical photoinitiators and free radical photoinitiated polymerization, they are sensitive to molecular oxygen and prone to oxygen inhibition.

Method used

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  • Preparation method and application of light-cured epoxy polyimide
  • Preparation method and application of light-cured epoxy polyimide

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1 A kind of preparation method of photocurable epoxy polyimide

[0042] The preparation method specifically includes the following steps:

[0043] (1) 4,4'-diaminodiphenyl ether (1.0012g, 0.005mol) was added to 30mL of N,N-dimethylacetamide, and after stirring at room temperature to dissolve, cis-1,2,3, 6-Tetrahydrophthalic anhydride (1.9779g, 0.013mol) was stirred and dissolved and reacted at room temperature for 6h to obtain a soluble polyamic acid solution;

[0044] (2) 2 mL of isoquinoline and 2 mL of triethylamine were added to 30 mL of polyamic acid solution (30 mL) in step (1), and N 2 , and the reaction was stirred at a constant temperature of 180 °C for 12 h to obtain a polyimide solution. After the reaction, the product was poured into deionized water, and after precipitation, the precipitate was collected by suction filtration, and dried in a vacuum oven for 24 hours to obtain small-molecule polyimide powder;

[0045] The molecular weight of the...

Embodiment 2

[0051] Embodiment 2 A kind of preparation method of photocurable epoxy polyimide

[0052] The preparation method specifically includes the following steps:

[0053] (1) 2,2-bis[4-(4-aminophenoxyphenyl)]propane (2.0526g, 0.005mol) was added to 30mL of N,N-dimethylacetamide, and after stirring and dissolving at room temperature, Then add cis-1,2,3,6-tetrahydrophthalic anhydride (1.9779g, 0.013 mol), stir and dissolve, and react at room temperature for 6h to obtain a soluble polyamic acid solution;

[0054] (2) 2 mL of isoquinoline and 2 mL of triethylamine were added to 30 mL of polyamic acid solution (30 mL) in step (1), and N 2 , and the reaction was stirred at a constant temperature of 180 °C for 12 h to obtain a polyimide solution. After the reaction, the product was poured into deionized water, and after precipitation, the precipitate was collected by suction filtration, and dried in a vacuum oven for 24 hours to obtain small-molecule polyimide powder;

[0055] The molec...

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Abstract

The invention belongs to the technical field of high polymer materials, and relates to a polyimide high polymer material, in particular to a preparation method and application of light-cured epoxy polyimide. The preparation method comprises the following steps: firstly, carrying out polymerization reaction on diamine and monoanhydride containing unsaturated double bonds to prepare micromolecular polyamide acid, then carrying out high-temperature chemical imidization reaction on the polyamide acid to prepare micromolecular polyimide, dissolving the polyimide in a solvent, and then carrying out room-temperature reaction with an oxidizing agent to obtain an epoxy polyimide monomer; and finally, preparing the light-cured polyimide from the epoxy polyimide monomer, a diluent, a photoinitiator and a photosensitizer through a cationic ultraviolet light curing method. The method is simple and efficient, and the prepared light-cured polyimide has the characteristic of low dielectric constant, good thermal stability and good anti-oxygen polymerization inhibition effect, and has wide application prospects in the fields of 5G high-frequency electronic circuit boards and the like.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, relates to a polyimide polymer material, and in particular relates to a preparation method and application of a light-cured epoxy polyimide. Background technique [0002] Polyimide is a polymer material with an imide ring in the main chain and excellent comprehensive properties. Due to the existence of the conjugation effect of nitrogen five-membered heterocyclic ring and aromatic heterocyclic ring in the molecular structure and the formation of charge transfer complexes between and within the molecular chain, it has strong intermolecular force, good thermal performance, good good mechanical properties, low thermal expansion coefficient, low dielectric constant, and good chemical stability to acids and redox agents, etc. Therefore, polyimide is often used in the preparation of engineering plastics, packaging materials, photoresists, fibers, separation films, etc. Wide range of applica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D519/00C08G59/26C08G59/24C08L63/00C08J5/18
CPCC07D519/00C08G59/26C08G59/24C08J5/18C08J2363/00
Inventor 丁羽杨建文曾兆华
Owner SUN YAT SEN UNIV