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Preparation method and application of micron copper powder

A technology of copper powder and copper source, applied in metal processing equipment, cable/conductor manufacturing, circuits, etc., can solve the problems of low system concentration and high resistivity of copper powder, improve reaction concentration, adjustable particle size, suitable for promotion applied effect

Pending Publication Date: 2022-07-15
苏州星翰新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] At this stage, the process of preparing copper powder by liquid phase reduction is faced with the problems of low system concentration and high resistivity of copper powder

Method used

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  • Preparation method and application of micron copper powder
  • Preparation method and application of micron copper powder
  • Preparation method and application of micron copper powder

Examples

Experimental program
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Effect test

Embodiment 1

[0061] This embodiment provides a preparation method of 0.4M reaction concentration micron copper powder, and the preparation method of the micron copper powder includes the following steps:

[0062] (1) 120g (0.48mol) copper sulfate pentahydrate, 144g polyvinylpyrrolidone K30, 14.4g β-cyclodextrin and 800mL solvent (the solvent is the combination of ethylene glycol and deionized water whose mass ratio is 1:2) ) mixed and stirred at 90°C for 0.8h to form solution I;

[0063] (2) Mix 42.2g of sodium hypophosphite, 4.22g of ascorbic acid and 400mL of solvent (the solvent is a combination of ethylene glycol and deionized water with a mass ratio of 1:2), and stir at 90°C for 0.8h to form solution II;

[0064] (3) Mix solution I and solution II uniformly, and react at 100 °C for 2 h to obtain solution III;

[0065] (4) Transfer solution III to a beaker, cool down to room temperature, settle naturally, remove the supernatant, then wash the bottom precipitate with deionized water fo...

Embodiment 2

[0068] This embodiment provides a preparation method of 0.6M reaction concentration micron copper powder, and the preparation method of the micron copper powder includes the following steps:

[0069] (1) 180g (0.72mol) copper sulfate pentahydrate, 216g polyvinylpyrrolidone K30, 21.6g β-cyclodextrin and 800mL solvent (the solvent is the combination of ethylene glycol and deionized water whose mass ratio is 1:2) ) mixed and stirred at 80°C for 0.9h to form solution I;

[0070] (2) Mix 63.3g of sodium hypophosphite, 6.33g of ascorbic acid and 400mL of solvent (the solvent is a combination of ethylene glycol and deionized water with a mass ratio of 1:1.8), and stir at 80°C for 0.9h to form solution II;

[0071] (3) Mix solution I and solution II uniformly, and react at 105 °C for 1.9 h to obtain solution III;

[0072] (4) Transfer solution III to a beaker, cool down to room temperature, settle naturally, remove the supernatant, then wash the bottom precipitate with deionized wate...

Embodiment 3

[0075] This embodiment provides a preparation method of 0.8M reaction concentration micron copper powder, and the preparation method of the micron copper powder includes the following steps:

[0076] (1) 240g (0.96mol) copper sulfate pentahydrate, 288g polyvinylpyrrolidone K30, 28.8g β-cyclodextrin and 800mL solvent (the solvent is the combination of ethylene glycol and deionized water whose mass ratio is 1:2) ) mixed and stirred at 70°C for 1 h to form solution I;

[0077] (2) Mix 84.4g of sodium hypophosphite, 8.44g of ascorbic acid and 400mL of solvent (the solvent is a combination of ethylene glycol and deionized water with a mass ratio of 1:1.9), and stir at 70°C for 1h to form solution II;

[0078] (3) Mix solution I and solution II uniformly, and react at 95°C for 2.3 hours to obtain solution III;

[0079] (4) Transfer solution III to a beaker, cool down to room temperature, settle naturally, remove the supernatant, then wash the bottom precipitate with deionized water...

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Abstract

The invention provides a preparation method and application of micron copper powder, and the preparation method comprises the following steps: (1) mixing a copper source, a dispersing agent and a solvent, and stirring to obtain a solution I; (2) mixing and stirring a reducing agent and a solvent to obtain a solution II; (3) mixing the solution I and the solution II, and reacting to obtain a solution III; and (4) the solution III is naturally settled, dried and ground, and micron copper powder is obtained. In the step (1) and the step (2), the solvent comprises a combination of ethylene glycol and deionized water. Ethylene glycol and water are used as a mixed solvent, so that the reaction concentration of a system is greatly improved, the yield of a large-scale production process is increased, the use amount of ethylene glycol is reduced, and the production cost is reduced; and the preparation route is simple, operability is high, the prepared copper powder is low in resistivity and adjustable in particle size, a universal preparation strategy is provided for the high-concentration and low-conductivity micron copper powder in a liquid phase system, and the preparation method is suitable for application and popularization.

Description

technical field [0001] The invention belongs to the field of new energy materials, and in particular relates to a preparation method and application of micron copper powder. Background technique [0002] The laboratory efficiency of HJT (heterojunction solar cells) can reach more than 26%, and the average mass production efficiency of manufacturers' large-scale production can reach 24%, which is higher than the previous generation of PERC (emitter and back passivation cells), thus becoming the next generation generation of solar cell technology. [0003] However, one of the problems that HJT faces is the high manufacturing cost (0.93-0.98 yuan / watt), and its cost expenditure is higher than that of PERC except for labor cost. In the cost ratio, excluding the cost of silicon wafers, the final proportion is low-temperature silver paste. The HJT process can only use low-temperature silver paste due to the influence of temperature, and the low-temperature silver paste products ...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F1/05H01B1/02H01B13/00
CPCB22F9/24H01B13/00H01B1/02Y02P10/20
Inventor 孙光辉刘成蔡世昌牛亮峰梁玮曾俊良
Owner 苏州星翰新材料科技有限公司
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