LED epitaxial structure with nitrogen polarity contact layer and preparation method thereof
A technology of epitaxial structure and nitrogen polarity, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of P-type ohmic contact and hole supply, crystal defects, and acceptor impurity magnesium ionization difficulties, etc., to achieve the solution of P Type ohmic contact, enhanced bonding ability, and the effect of solving the difficulty of hole supply
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[0042] Another aspect of the present application provides a method for fabricating an LED epitaxial structure with a nitrogen polar contact layer, comprising:
[0043] obtain a substrate;
[0044] A buffer layer, a three-dimensional nucleation layer, an undoped GaN layer, an N-type GaN layer, an InGaN / GaN multiple quantum well layer, a P-type AlGaN electron blocking layer, a P-type GaN layer and a nitrogen electrode are sequentially grown on the substrate P-type ohmic contact layer;
[0045] Wherein, when growing the nitrogen-polar P-type ohmic contact layer, the growth method includes growing nitrogen-polar P-type In on the P-type GaN layer a Ga 1-a N layer to grow the nitrogen-polar P-type ohmic contact layer; or alternately grow a plurality of nitrogen-polar P-type In a Ga 1-a N layer and SiN X mask layer to grow the nitrogen polar P-type ohmic contact layer.
[0046] Specifically, the substrate is one of sapphire, aluminum nitride, silicon or silicon carbide.
[004...
Embodiment 1
[0060] In order to facilitate the understanding of the present invention, the following describes the preparation method of the LED epitaxial structure with a nitrogen polar contact layer in the present application with a specific embodiment, and the method includes the following steps:
[0061] Prepare buffer layer on substrate: deposit AlN buffer layer or GaN buffer layer or AlGaN buffer layer on the substrate by metal organic vapor chemical deposition method, pass high-purity NH 3 As N (nitrogen) source, pass trimethyl gallium (TMGa) as Ga source, pass trimethyl aluminum (TMAl) as aluminum source, and the reaction chamber growth pressure is 60-200torr to deposit AlN buffer on the substrate layer or GaN buffer layer or AlGaN buffer layer.
[0062] Preparation of three-dimensional nucleation layer: using metal organic vapor chemical deposition method to pass trimethyl gallium (TMGa) as a Ga source on the buffer layer, the growth temperature is increased to 1060-1090 ° C, to g...
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