Polishing film and its preparing process

A polishing film and diamond technology, applied in the field of polishing film, can solve the problems of limited application range, few sources of natural diamond, high cost of grinding and polishing, etc., and achieve the effects of reducing processing costs, facilitating popularization and application, and enhancing mechanical strength

Inactive Publication Date: 2005-06-22
BEIJING GRISH HITECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Because diamond has the highest hardness, the diamond polishing film has the best grinding efficiency and comprehensive polishing performance, but the source of natural diamond is few, and the price is too expensive to be used as abrasive for polishing film, while the synthetic diamond is relatively cheap and processed into Diamond polishing film has been applied in many aspects, but compared with abrasives such as white corundum and silicon carbide, the price is still too high, resulting in high cost of grinding and polishing, which limits the scope of application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0021] The diamond micropowder of 6 microns of average particle size and the silicon carbide micropowder of 3 microns of average particle size are mixed with 1: 1 weight ratio, take by weighing 2kg of this mixture, add polyester glue (solid content 30% of glue) 7kg, add toluene, A mixed solution of methyl ethyl ketone and ethyl acetate (1:1:1) was 0.8kg, and the above-mentioned mixed solution was dispersed for 24 hours by a ball mill, and then the viscosity was adjusted to 80CP, and the above-mentioned coating was applied on 75 After drying at 120°C for 2 minutes on a micron-thick polyester film, a 10-micron-thick coating is formed, which is the hybrid diamond polishing film of the present invention. The polishing film had a total thickness of 85 μm and a surface roughness Ra of 1.4 μm.

example 2

[0023] The average particle size is that the diamond micropowder of 10 μ m is mixed with the silicon oxide powder that the average particle size is 8 microns with a weight ratio of 2: 8, takes by weighing 1 kg of the mixture and adds 4 kg of polyester glue (solid content of glue 30%), then adds toluene / methyl ethyl ketone / Ethyl acetate (1:1:1) mixed solvent 0.5kg, use the ball mill to disperse and adjust the viscosity to 60CP with the mixture, apply the above coating on a 100μm polyester film, dry at 85°C for 10 minutes to form a 20μm Thick coating, promptly makes the hybrid diamond polishing film of the present invention.

example 3

[0025] The diamond micropowder with an average particle size of 10 μm and the white corundum with an average particle size of 5 μm are mixed in a weight ratio of 7.5: 2.5, using the mixing and coating method of Example 2, and dried at 100 ° C for 5 minutes to obtain a polished coating with a thickness of 16 μm. membrane.

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PUM

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Abstract

The invention is a kind of polishing film, which is characterized in that powdery or granular resin is dissolved in an organic solvent to make a resin glue, and then diamond and other commonly used abrasive particles are mixed with the resin glue to make a coating, and then the The paint is evenly coated on the surface of the plastic film base belt, and the hybrid diamond polishing film is obtained after drying. Because the present invention disperses the diamond with larger particle size in other common abrasives with smaller particle size, it not only increases the abrasive filling degree in the resin glue, enhances the mechanical strength of the coating, but also maintains the unique grinding and polishing effect of diamond, and at the same time has a large Significantly reduce the manufacturing cost of diamond polishing film.

Description

technical field [0001] The invention relates to a polishing film, more specifically, a hybrid diamond polishing film. Background technique [0002] The precision processing of many high-tech components is inseparable from grinding and polishing, and the processing methods using polishing tape or polishing sheet tend to increase, such as disks, magnetic tapes, magnetic heads, optical fiber connectors, optical fiber couplers, Optical fiber terminators, monocrystalline silicon wafers and other precision hard devices; the polishing film is not only for grinding and polishing, but also for cleaning foreign matter on the surface of the device, such as test probes for semiconductor silicon wafers, integrated block test sockets, and liquid crystal display panels. Polishing films are used for cleaning. [0003] The commonly used polishing film is made of plastic film as the base band, mixed with resin glue with solvent and curing agent, mixed with abrasive, then coated on it, and dr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/14
Inventor 王振国孙占华廖华瑞谭旭升
Owner BEIJING GRISH HITECH
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