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Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates

A technology of polyimide resin and electronic components, applied in the direction of circuit substrate materials, printed circuit parts, conductive layers on insulating carriers, etc., can solve the problems of metal ion migration, loss of resin insulation, etc.

Inactive Publication Date: 2006-02-01
TORAY ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] However, the method described in Japanese Patent Publication No. 5-61296 has many safety problems such as explosion and toxicity of reducing gas.
In the method described in Japanese Patent Application Laid-Open No. 5-306469, since the addition amount of the metal compound must be as high as about 200 parts by weight per 100 parts by weight of the resin, the properties of the resin (strength, insulation, etc.) are lost as a result, or the metal compound is completely lost. It remains in the resin without being reduced, and sometimes it is easy to cause insulation problems such as metal ion migration

Method used

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  • Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
  • Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates
  • Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates

Examples

Experimental program
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Embodiment 1

[0052] A solution in which a commercially available palladium acetylacetone complex (hereinafter referred to as a palladium complex) was dissolved in N-methyl 2-pyrrolidone (hereinafter referred to as NMP) was added to the polyimide compound of Toray Co., Ltd. In the amine resin precursor varnish "Treni-su" #3000, the varnish solution was adjusted so that the palladium complex content of the average varnish solution was 1 wt / vol%. The varnish solution contained a palladium complex at an average polyimide resin precursor of approximately 5 wt / vol%.

[0053] Furthermore, the so-called 1 wt / vol% refers to, for example, the concentration at which 0.01 g of the palladium complex is dissolved in 1 ml of "Treni-su" varnish solution.

[0054] Next, a 10×10 cm (thickness: 50 μm) test piece of polyimide substrate “U-Pilex-S” produced by Ube Industries, Ltd. was treated with a 1% NaOH aqueous solution and a 1% HCl aqueous solution, and washed with pure water. After drying, the above-men...

Embodiment 2

[0061] The palladium complex content of the polyimide resin precursor solution in Example 1 was changed to 0.5 wt / vol%, and the same treatment was performed to obtain a substrate for electronic components with a copper film thickness of 22 μm. As a result of measuring the peel strength between the metal portion of the obtained base material and the polyimide resin layer by the method specified in JISC-6481, it was 12 N / cm (1200 gf / cm).

Embodiment 3

[0063] The ultraviolet irradiation dose of embodiment 1 is changed to 7500mJ / cm 2 , perform the same processing.

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Abstract

Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Description

technical field [0001] This invention relates to the manufacturing method of the electronic component material and base material for microfabrication which have a polyimide resin layer. Background technique [0002] Copper-clad polyimide substrates are used as flexible printed circuit boards, TAB materials, and CSP materials. However, with the miniaturization of equipment and the increase in signal transmission speed, etc., high-density fine wiring and fine vias are required. Microfabrication, and materials with high adhesion strength of metal films are increasingly required. [0003] In the past, in order to obtain a copper-clad polyimide substrate with high adhesion strength, the method used was to attach nickel to the polyimide surface by sputtering after dry pretreatment such as ion bombardment and corona discharge. and chromium and other underlying metals, and then perform electroless plating (electroless plating) and electrolytic plating on it to form a metal film. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K5/00C23C18/20H01B5/14H01B13/00H05K1/03
CPCC23C18/204C23C18/2086C23C18/30
Inventor 泉田信也伊藤釭司小山稔铃木笃
Owner TORAY ENG CO LTD