Torque mirror driver of micro electromechanical system, producing method and use

A technology of micro-electro-mechanical systems and manufacturing methods, applied in the direction of generators/motors, relays, electromagnetic relays, etc., can solve the problems of increasing the difficulty of manufacturing processes, large polarization-related losses, and increased power consumption of devices, achieving high reliability, Effect of low optical insertion loss and low driving voltage

Inactive Publication Date: 2006-10-11
QST CORP
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AI-Extracted Technical Summary

Problems solved by technology

This kind of reflective optical attenuator needs to be made into a reflective film that changes linearly or a movable reflector whose reflective area changes linearly, which increases the difficulty of the manufacturing process, and the reflective optical attenuator and light-blocking attenuator that mo...
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Method used

[0044] 10. Utilize the sputtering process to sputter a few thousand angstroms thick gold film layer...
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Abstract

The invention relates to a micro-electromechanical system torsion mirror driver, a manufacturing method and an application. It is characterized in that the twisted micro-mirror is located in the isolation space formed by the upper electrode and the lower electrode, and its twisted angle is adjusted according to the voltage applied by the upper electrode and the lower electrode of the driver. The production method is to first create a space between the upper electrode and the lower electrode of the twisted mirror on the back of the silicon wafer to form the twisted space of the twisted mirror, then make the lower electrode of aluminum on the glass, and then align the back of the silicon wafer with the glass Bonding together, thinning the bonded silicon-glass bonding sheet, and finally making thin beams fixed at both ends of the torsion mirror, the upper electrode of the driver and the torsion micro-mirror on the thinned silicon layer After the silicon chip is diced, a single electrostatic mirror-driven driver is obtained; it has the advantages of small size, simple process, low driving voltage, high reliability, fast response speed and integration.

Application Domain

Piezoelectric/electrostriction/magnetostriction machinesDecorative surface effects +7

Technology Topic

Voltage regulationAluminium +6

Image

  • Torque mirror driver of micro electromechanical system, producing method and use
  • Torque mirror driver of micro electromechanical system, producing method and use
  • Torque mirror driver of micro electromechanical system, producing method and use

Examples

  • Experimental program(1)

Example Embodiment

[0033] In the following, the manufacturing process steps of the MEMS torsion mirror provided by the present invention are further explained in conjunction with the accompanying drawings to describe the specific structure of the torsion mirror driver provided by the present invention and its application as a tunable optical attenuator.
[0034] The specific implementation steps of the present invention are as follows:
[0035] 1. Grow a layer of silicon dioxide film with a thickness of about 1000 angstroms to 5000 angstroms on the upper and back surfaces of the silicon wafer. Such as Figure 4 (b) Shown.
[0036] 2. Use the photolithography, development and silicon dioxide etching processes in MEMS technology to produce the required patterns on the silicon dioxide film. Such as Figure 4 (c) Shown.
[0037]3. Put the silicon wafer into a potassium hydroxide solution or TMAH solution with a solution concentration of 40% and a temperature of 40°C. The pattern on the back of the silicon wafer is anisotropically etched into a 10um deep pattern in the potassium hydroxide solution, which serves as the upper electrode and the lower electrode. The space between the electrodes and the corroded space can also provide overload protection for the torsion mirror. Such as Figure 4 (d) Shown.
[0038] 4. Use a silicon dioxide etching process to remove the remaining silicon dioxide film on the silicon wafer.
[0039] 5. Use a sputtering process on the glass sheet to sputter a layer of about 1um aluminum electrode on the glass. Such as Figure 4 (e) Shown.
[0040] 6. Use photolithography, development and aluminum etching processes to etch the required lower electrode pattern on the aluminum film. Such as Figure 4 (f) Shown.
[0041] 7. After the isolation space between the upper electrode and the lower electrode corroded on the back of the silicon wafer is registered with the aluminum lower electrode made on the glass, the silicon-glass bonding technology is used for integral bonding, so that the silicon wafer and the glass become a whole. Such as Figure 4 (g) Shown.
[0042] 8. Put the silicon glass bonding wafer into the potassium hydroxide etching solution to thin the silicon wafer as a whole, so that the silicon wafer device layer on the glass remains at about tens of microns. Such as Figure 4 (h) Shown.
[0043] 9. On the thinned silicon wafer device layer, through photolithography and development, the required torsion mirror surface and the pattern of the upper electrode are produced.
[0044] 10. Use a sputtering process to sputter a few thousand angstroms thick gold film on the exposed pattern area of ​​the silicon wafer to improve the reflectivity of the mirror surface.
[0045] 11. On the thinned silicon device layer, the required torsion mirror surface, upper electrode and fixed beam patterns at both ends are produced by photolithography and development again. A plasma silicon deep etching process is used to etch through the silicon chip device layer to obtain a separated twisted micro mirror surface, an upper electrode and a thin beam structure fixed at both ends. Such as Figure 4 (i) Shown.
[0046] 12. Dicing the entire silicon wafer to obtain a single electrostatic drive, which is mainly used in the torsion micromirror driver of the reflective adjustable optical attenuator of the dual-fiber collimator.
[0047] In the manufactured MEMS torsion mirror driver, the angle of mirror twist can be adjusted with the voltage applied by the upper electrode and the lower electrode of the driver. The applied voltage ranges from a few volts to tens of volts. The manufactured MEMS torsion mirror driver is such as Figure 5 Shown.
[0048] The MEMS torsion mirror driver prepared by the present invention is driven by static electricity. By applying a lower voltage, the mirror is twisted to a certain angle, thereby changing the optical coupling. The change of the different angle causes the corresponding optical signal attenuation, so it is a kind of A reflective tunable optical attenuator made by MEMS technology.
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Description & Claims & Application Information

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Classification and recommendation of technical efficacy words

  • The process is simple and feasible
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