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Radiation-sensitive resin composition

A resin composition, sensitive technology, applied in instruments, opto-mechanical equipment, optics, etc., can solve problems such as ignorance, pre-baking oven dirty, impurity pollution, etc.

Inactive Publication Date: 2001-05-30
MERCK PERFORMANCE MATERIALS GK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

That is to say, there is still a problem that, when prebaking is performed after coating the radiation-sensitive resin composition on the substrate, the monomers and dimers in the alkali-soluble resin will be degraded during the prebaking process. Vaporizes with the solvent and makes the inside of the pre-baking oven dirty, resulting in contamination of impurities in the steps of the production unit
However, it is not known that this thin film distillation technique can be used for binder resins in radiation-sensitive resin compositions.
Although the above-mentioned Japanese Unexamined Patent Application 230164 / 1991 believes that the small molecular components of novolac resin can be removed by thin film distillation, it only illustrates an equivalent technology as a solvent fractionation method, and does not disclose treatment conditions, etc.

Method used

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Examples

Experimental program
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Effect test

Embodiment approach

[0031] The present invention is further illustrated by the following examples, but the examples are not intended to limit the protection scope of the present invention.

[0032] Synthesis Example 1: Synthetic raw material novolak resin A-1

[0033] Add 58.69 m-cresol, 42.89 p-cresol, 15.89 2,5-xylenol, 6.1 g 2,4-xylenol, 85.29 37% formalin aqueous solution and 0.9869 oxalic acid to In a 1 L separable flask equipped with a stirrer, a condenser and a thermometer, the reaction was carried out at 95-100° C. for 5 hours under stirring. Thereafter, the temperature was raised to 180° C. and steamed for 1 hour to distill off water and unreacted monomers, then the pressure was gradually reduced to 10 mmHg and the temperature was raised to 195° C. to remove as much water, unreacted monomers, Formaldehyde, oxalic acid, and then, the temperature is lowered to about room temperature to recover the novolac resin. Carry out gel permeation chromatography (GPC) at the detection wavelength of...

Embodiment 1

[0046] Embodiment 1, Comparative Examples 1 and 2

[0047] The novolak resins A-1 to A-3 obtained in the synthesis examples and the photosensitizer B-1 were mixed at the ratios described in Table 1 below, and the surfactant MegafacR-08 (manufactured by Dainippon Ink Chemical Industry, Co., Ltd.) was added thereto. .production), and the resulting mixture was dissolved in PGMEA, respectively. Then, each solution was filtered through a 0.5 μm membrane polytetrafluoroethylene filter to obtain the radiation-sensitive resin compositions of Example 1 and Comparative Examples 1 and 2.

[0048] Each of these radiation-sensitive resin compositions was coated onto an HMDS-treated 4-inch silicon wafer using a spin coater, LARC ULTIMA-1000 manufactured by Lithotech Japan Co., for coating Pre-baked on a heating plate at 100° C. for 90 seconds to form a photoresist coating with a thickness of 1.5 μm. The thickness of the coating was measured using a film thickness measuring device, Lambda ...

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Abstract

The present invention provides a radiation-sensitive resin composition that has excellent properties required for photoresists, such as sensitivity, pattern shape, and heat resistance, and has an excellent balanced combination of these properties. The composition comprises an alkali-soluble resin and a photosensitizer having a quinonediazide group, wherein the alkali-soluble resin comprises a novolac resin that selectively removes monomers and dimers through thin-film distillation treatment. The thin film distillation process is preferably carried out so that the novolac resin before and after the treatment is detected at 280 nm in gel permeation chromatography, and the pattern obtained satisfies the following relationship: B 2 / B 1 ≥0.95,C 2 / (A 2 +B 2 +C 2 )≤0.060; where, A 1 , B 1 and C 1 are the high-molecular region, middle-molecular region and monomer / dimer region in the untreated novolac pattern, respectively, while A 2 , B 2 and C 2 are respectively the high molecular region, the middle molecular region and the monomer / dimer region in the treated novolak pattern.

Description

field of invention [0001] The present invention relates to a kind of new radiation-sensitive resin composition, more particularly, the present invention relates to a kind of radiation-sensitive resin composition comprising alkali-soluble novolak resin, and this composition is suitable for producing semiconductor, and is prepared in liquid crystal display Display surfaces in panels, suitable for the production of circuit substrates for thermal head etc. and similar uses. Background of the invention [0002] Photolithography has been used to form micro components or perform fine processing in a wide range of applications such as production of semiconductor integrated circuits such as LS1, preparation of display surfaces in liquid crystal display panels, production of circuit substrates for thermal head etc. In photolithography, a photoresist pattern is formed using a positive or negative radiation-sensitive resin composition. Of these radiation-sensitive resin compositions, t...

Claims

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Application Information

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IPC IPC(8): H01L21/027C08F2/48C08F2/50G03F7/023
CPCG03F7/0236C08G8/08G03F7/0007G03F7/0045G03F7/0226G03F7/023G03F7/0233G03F7/0392
Inventor 荒野明男山元研二
Owner MERCK PERFORMANCE MATERIALS GK
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