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Copper alloy foil for laminated board

A copper alloy foil and laminated board technology, applied in the improvement of metal adhesion of insulating substrates, layered products, metal layered products, etc., can solve the problem of poor wettability, unstable varnish adhesion, difficult polyimide film thickness Uniformity and other issues to achieve the effect of high conductivity and strength

Inactive Publication Date: 2003-02-19
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, it was found that due to the different surface conditions of the copper alloy foil, the wettability with the varnish containing polyamic acid is sometimes poor, and the amount of varnish adhesion is unstable, and it is difficult to make the thickness of the polyimide film formed after heating and curing uniform.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

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[0042] Table 2

[0043]On the other hand, No. 15 of the comparative example shown in Table 1 is the rolled copper foil to which the alloy component of this invention was added. An ingot made by melting and casting oxygen-free copper in an Ar atmosphere is processed into a foil, which is bonded with polyimide. Since the raw material is pure copper, it has good electrical conductivity, but the 180°peel strength is 7.5N / cm, which does not reach a sufficiently high adhesive strength. Therefore, peeling may occur after it is made into a printed circuit board.

[0044] No. 16 and No. 17 of the comparative example were processed into foils in the same manner as in the examples after adding only one selected from Cr and Zr. Because the concentration of Cr and Zr is less than 0.01% by weight, therefore, the effect of improving the strength is not satisfactory, and the tensile strength is low, less than 600N / mm 2 .

[0045] In Comparative Example No....

Embodiment 2

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[0051] Table 4

[0052] On the other hand, No. 33 of the comparative example shown in Table 3 is the rolled copper foil which added the alloy component of this invention. An ingot made by melting and casting oxygen-free copper in an Ar atmosphere is processed into a foil, which is bonded with polyimide. Since the raw material is pure copper, it has good electrical conductivity, but the 180°peel strength is 7.5N / cm, which does not reach a sufficiently high adhesive strength. Therefore, peeling may occur after it is made into a printed circuit board. In addition, due to the low tensile strength, less than 650N / mm 2 , so manual handling is poor.

[0053] No. 34 and No. 35 of the comparative example were processed into foils by the same method as the examples after adding Ni and Si. As No.34, since the concentration of Si is less than 0.2% by mass, the tensile strength is low, less than 650N / mm 2 , The electrical conductivity is also ...

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Abstract

For a two-layer printed wiring board including a polyimide substrate produced with varnish containing polyamic acid as the raw material for the polyimide and a copper alloy foil laminated with the polyimide substrate, there is provided, as the copper alloy foil, a copper alloy foil having good wettability with the varnish and a low surface roughness that enables direct bonding with polyimide without roughening plating processing of the copper alloy foil. The copper alloy of the foil contains the given element. Good wettability with the varnish is obtained by setting the thickness of anticorrosive coating on the copper alloy foil to less than 5 nm; the surface roughness is less than 2 mum expressed as ten-point average surface roughness (Rz); and, without roughening and plating processing, the 180 DEG C peel strength when peeling from film of the polyimide as the substrate obtained by thermosetting polyamic acid is greater than 8.0 N / cm.

Description

technical field [0001] The present invention relates to a copper alloy foil used for a laminate for a printed wiring board. Background technique [0002] Electronic circuits of electronic equipment often use printed circuit boards. According to the type of resin constituting the base material, printed wiring boards can be classified into two types: hard laminated boards (rigid substrates) and flexible laminated boards (flexible substrates). Flexible substrates are characterized by their flexibility. In addition to being used as wiring for moving parts, flexible substrates are also used as space-saving wiring materials because they can be incorporated into electronic equipment in a bent state. In addition, because the substrate itself is very thin, it can also be used as a plug-in selection finger for semiconductor packages or an IC chip carrier for liquid crystal displays. For flexible substrates, polyimide resin is often used as the resin constituting the base material, a...

Claims

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Application Information

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IPC IPC(8): B32B15/08B32B15/088C22C9/00C22C9/06C23G1/10H05K1/03H05K1/09H05K3/38
CPCC22C9/06H05K2201/0154Y10T428/24355H05K1/0346B32B15/08H05K1/09Y10T428/31551C23G1/103C22C9/00Y10T428/31605H05K2201/0355
Inventor 永井灯文野中俊照
Owner JX NIPPON MINING & METALS CO LTD