Unlock instant, AI-driven research and patent intelligence for your innovation.

Process for improving polymer to metal adhesion

A technology of adhesion and composition, which is applied in the field of multi-layer combination and production of multi-layer printed circuit, and can solve the problems of easy separation/delamination

Inactive Publication Date: 2003-10-08
MACDERMID INC
View PDF11 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are other problems with regard to the adhesion between the dielectric layers and the metallic copper layers within the circuits, firstly because the bonding surface is metallic copper and secondly because metallic copper occurs primarily in different phases (i.e. , (1) copper reduced from copper oxide covers (2) copper of copper foil), during which separation / delamination is easy to occur along the phase interface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-15

[0063] A basic adhesion promoting solution was prepared comprising 2% by volume of sulfuric acid (98% by weight), 0.75% by volume of 50% by weight hydrogen peroxide, 4 g / L of benzotriazole, and the remainder water. In each example, add hydroxybenzotriazole hydrate and molybdic acid in the amount shown in Table 1, and treat the copper foil and board with the specific test solution and the temperature shown in each example according to the aforementioned standard cycle. Table 1 shows the appearance of the samples obtained in each example.

[0064] Example

[0065] After treatment, the panels and foils were baked at 230°F for 30 minutes and then laminated with NELCO 4205-2 Stage B (FR-4) material (available from NELCO Corporation) at 350°F and a pressure of 200 psi Pressed for 45 minutes, the B-stage material consisted of two sheets of 1080 glass sandwiching a sheet of 7628 glass. After lamination the board is imaged to form one inch wide strips, removing excess copper...

Embodiment 16

[0069] The process of Example 1 was repeated except that the concentration of benzotriazole in the test solution was increased from 4 g / L to 7 g / L in this example. As in Example 1, 1-hydroxybenzotriazole and molybdic acid were not used. The result is a uniform pink appearance. The peel strengths were 2.8 lb / in, 2.5 lb / in and 2.5 lb / in after 0 sec, 10 sec and 20 sec in solder at 550°F.

Embodiment 17

[0071] Heat to about 95°F a copper treating solution containing the following ingredients: 4.6 vol% sulfuric acid, 2.8 vol% 50% hydrogen peroxide, 6.3 g / L benzotriazole, about 15 mg / L sodium chloride , about 1 g / L of Carbowax MPEG 2000 ethylene oxide, and 21.6 g / L of copper ions (used to simulate an aged or used adhesion promoting composition such as the adhesion promoting composition for copper surface, build up copper ions in solution). A fresh pre-dip solution was prepared containing 2 g / L benzotriazole and 2 vol% 50% hydrogen peroxide. Copper clad resin panels approximately 1.5 inches wide by 3 inches high were weighed and subjected to the following processing cycle:

[0072] Acid cleaner (Metex 9271 * ), 10%, 125°F for 2 minutes

[0073]Rinse in cold water for 2 minutes

[0074] Presoak, room temperature 1 minute

[0075] Copper Treatment Solution, 95°F for 1 minute

[0076] Rinse in cold water for 1 minute

[0077] forced air drying

[0078] * Available from McD...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a method for increasing the adhesion of polymeric materials to metal surfaces by treating metal surfaces with a composition comprising an oxidizing agent, an acid, a corrosion inhibitor, a Benzotriazoles having electron-withdrawing groups that are stronger electron-withdrawing groups than hydrogen groups, optionally including a source of adhesion-enhancing substances selected from the group consisting of molybdates, tungstic acids Salts, tantalates, niobates, vanadates; isopolyacids or heteropolyacids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing.

Description

Background of the invention [0001] This invention relates to printed circuits, and more particularly to methods of making multilayer printed circuits. [0002] Printed circuits comprising one or more circuit inner layers are developed today primarily because of the increasing need for weight and space savings in electronic devices. [0003] In the conventional production of multilayer printed circuits, a patterned circuit inner layer is first made in a way, in which the conductive matrix material covered with copper foil is patterned with a resist according to the positive image of the desired circuit pattern , etch away the exposed copper. [0004] Any one or more inner circuit layers having a circuit pattern of a particular form, and which may constitute ground and power planes, between which one or more layers of partially cured dielectric matrix material are sandwiched (so-called "prepreg" layers) are combined to form a multilayer circuit. The composite is then subjecte...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/02C23C22/40C23C22/52H05K3/38
CPCC09J5/02C09J2400/163C09J2400/166C09J2400/226C09J2400/228C23C22/40C23C22/52H05K3/383C23F1/18
Inventor 唐纳德·费里尔
Owner MACDERMID INC