Process for preparing Ba TiO2 base laminated sheet type PTC thermosensitive resistor

A thermistor and preparation technology, applied in the direction of resistors with positive temperature coefficients, etc., can solve the problems of low mechanical strength of PTC ceramic sheets, it is difficult to ensure the contact between electrodes and ceramic sheets, etc., and the method is flexible and simple, The effect of high consistency, improved performance and reliability

Inactive Publication Date: 2004-04-28
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that since the PTC effect utilizes the grain boundary effect of polycrystalline ceramics, the thickness of the chip PTC cannot

Method used

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  • Process for preparing Ba TiO2 base laminated sheet type PTC thermosensitive resistor
  • Process for preparing Ba TiO2 base laminated sheet type PTC thermosensitive resistor
  • Process for preparing Ba TiO2 base laminated sheet type PTC thermosensitive resistor

Examples

Experimental program
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Effect test

example 1

[0029] (1) Ingredients and pre-burning

[0030] The composition of the PTC sample material is: (Ba 0.8 Sr 0.2 ) Ti 1.01 o 3 +1.5mol% SiO 2 +0.5mol%Al 2 o 3 +0.3mol%Y 2 o 3 +0.1mol%Mn(NO 3 ) 2 . After batching according to the above proportions, mix by ball milling, and pre-calcine at 1155°C for 2 hours.

[0031] (2) rolling film forming

[0032] The pre-burned PTC powder is ball milled and passed through a 60-mesh sieve. Take 50g of powder, add 17g of mass percent concentration of 18% polyvinyl alcohol (PVA) aqueous solution as adhesive, and add 6ml of glycerin as plasticizer, knead to form a plastic mass, and place it between the two rolls of the rolling machine. Repeated rolling in between, until it reaches a certain uniformity, density, smoothness and flexibility, then take it off, the thickness of the film is 0.3mm, and punch it into 55×40mm.

[0033] (3) Sputtering inner electrode

[0034] Cover the mask plate (the thickness is 1mm, and the plane size of ea...

example 2

[0041] The same method as in Example 1 was used to make the PTC green body, sputter the nickel electrode in the sputtering station, slice it and laminate it, and make the terminal electrode after hot pressing and reoxidation treatment in the reducing atmosphere furnace. Corresponding parameter is as follows respectively: the mass percent concentration of the PVA aqueous solution that chooses in the rolling film forming is 15% (wherein added the glycerin that accounts for PVA aqueous solution 4wt%), and its amount of adding accounts for about 37wt% of powder, and the film thickness of preparation is 0.2mm; H 2 -N 2 H in the mixed gas 2 / N 2 = 4% at 1325°C and 10 -10 Firing at an oxygen partial pressure of Mpa for 1.5 hours, then lowering the temperature to 1000°C at a rate of 280°C / h, and oxidizing in air for 45 minutes, then turning off the power and naturally cooling to room temperature.

[0042] The layer number of the laminated PTC element is 5, the final size is 11×8×0...

example 3

[0044] The same method as in Example 1 was used to make the PTC green body, sputter the nickel electrode in the sputtering station, slice it and laminate it, and make the terminal electrode after hot pressing and reoxidation treatment in the reducing atmosphere furnace. Corresponding parameter is as follows respectively: the mass percent concentration of the PVA aqueous solution that chooses in the rolling film forming is 16% (wherein added the glycerin that accounts for PVA aqueous solution 5wt%), and its amount of adding accounts for 34wt% of powder material, and the film thickness of preparation is 0.4mm; H 2 -N 2 H in the mixed gas 2 / N 2 = 5% at 1320°C and 10 -11 Firing under the oxygen partial pressure of Mpa for 2 hours, then lowering the temperature to 900°C at a rate of 300°C / h, and oxidizing in air for 60 minutes, then turning off the power and naturally cooling to room temperature.

[0045] The layer number of the laminated PTC element is 9, the final size is 11...

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Abstract

This invention discloses a preparation technology for BaTiO3 base laminated sheet PTC thermistors including 1. applying film grinding formation technology to prepare PTC sheet green compact, 2. sputtering internal electrodes, 3 co-sintering, 4 forming end-electrodes. Advantages: taking water as the solvent to prepare sheet PTC green compact with a film-grinding formation method results in little pollution, low cost and uniform, tight and smooth compact sheets. Good ohmic contact is formed during hot press sintering and oxidation problem of metallic electrodes is solved to form good PTC effect.

Description

technical field [0001] The invention belongs to the technical field of preparation of electronic ceramic components, and in particular relates to a preparation process of a BaTiO3-based laminated chip PTC thermistor. Background technique [0002] In recent years, with the development of communication technology and surface mount technology, various electronic components are urgently required to develop in the direction of small size, low power consumption and chip type. For PTC thermistors, in addition to requiring miniaturization, they must also have a lower room temperature resistance and a larger lift-to-drag ratio. However, due to the high resistivity of PTC materials, the room temperature resistance of traditional bulk PTC components cannot be too low, and it is difficult to further reduce the resistance. The laminated chip PTC thermal element can achieve low resistance through multi-layer parallel connection, and can significantly improve the resistance-temperature hy...

Claims

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Application Information

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IPC IPC(8): H01C7/02
Inventor 龚树萍周东祥刘欢胡云香
Owner HUAZHONG UNIV OF SCI & TECH
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